Patents by Inventor Zhi-Ting Ye

Zhi-Ting Ye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200052171
    Abstract: A light emitting diode assembly structure includes a light emitting chip, a color converting layer, a light guiding member, and a reflecting member. The color converting layer coats the light emitting chip and the light guiding member coats the color converting layer. The planar or non-planar reflecting member is arranged over the light guiding member. The reflecting member faces toward the light emitting chip and changes the range of illumination of the light emitted by the light emitting chip. The reflecting member can be arranged on a side of the color converting layer and light can be irradiated towards the exterior of the light emitting diode assembly structure.
    Type: Application
    Filed: October 17, 2019
    Publication date: February 13, 2020
    Inventors: ZHI-TING YE, SHYI-MING PAN, CHIH-WEI CHANG
  • Publication number: 20190189864
    Abstract: A light source module includes a lighting structure, a light diffusing layer, a wavelength converting layer, and a cover plate. The lighting structure includes a plurality of light emitting elements that are all blue-light emitting elements. The light diffusing layer is disposed on the lighting structure, the wavelength converting layer is disposed on the light diffusing layer, and the cover plate is disposed on the wavelength converting layer.
    Type: Application
    Filed: December 13, 2018
    Publication date: June 20, 2019
    Inventors: Zhi-Ting Ye, SHYI-MING PAN, YU-CHENG LAN, CHING-HO TIEN
  • Publication number: 20190172987
    Abstract: A light-emitting device includes a light-emitting structure with a side surface, and a reflective layer covering the side surface. The light-emitting structure has a first light-emitting angle and a second light-emitting angle. The difference between the first light-emitting angle and the second light-emitting angle is larger than 15°.
    Type: Application
    Filed: December 27, 2018
    Publication date: June 6, 2019
    Inventors: Chien-Liang LIU, Ming-Chi HSU, Shih-An LIAO, Chun-Hung LIU, Zhi-Ting YE, Cheng-Teng YE, Po-Chang CHEN, Sheng-Che CHIOU
  • Patent number: 10205070
    Abstract: A light-emitting device includes a light-emitting structure with a side surface, and a reflective layer covering the side surface, and a light-transmitting body. The light-transmitting body encloses the light-emitting structure and has a first side surface, a second side surface, a third side surface and a fourth side surface. The reflective layer covers the first side surface and the third side surface without covering the second side surface and the fourth side surface. The light-emitting structure has a first light-emitting angle and a second light-emitting angle different from the first light-emitting angle.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: February 12, 2019
    Assignee: Epistar Corporation
    Inventors: Chien-Liang Liu, Ming-Chi Hsu, Shih-An Liao, Chun-Hung Liu, Zhi-Ting Ye, Cheng-Teng Ye, Po-Chang Chen, Sheng-Che Chiou
  • Patent number: 10145526
    Abstract: A headlamp module comprises a connecting base, a substrate, and at least two edge-type light emitting diode (LED) units. The at least two edge-type LED units are mounted to opposite surfaces of the substrate facing away from each other. Each edge-type LED unit comprises an LED chip, a wavelength converting layer, and a light reflecting layer. The LED chip comprises a bottom surface, a light emitting surface facing away from the bottom surface, and first sidewalls. The wavelength converting layer covers the light emitting surface and the first sidewalls. The wavelength converting layer converts emitted light to a desired range of wavelengths. The light reflecting layer reflects the converted light toward the second sidewalls, thus expanding the angle and brightness of light around the headlamp module and avoiding an unlit or dark area immediately around the headlamp module.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: December 4, 2018
    Assignee: HARVATEK CORPORATION
    Inventors: Zhi-Ting Ye, Shyi-Ming Pan, Chia-Hung Pan
  • Publication number: 20180287024
    Abstract: The present invention provides a semiconductor light-emitting module and a semiconductor LED chip thereof. The semiconductor LED chip includes a semiconductor light-emitting structure, a light-guiding structure layer, and a light-reflecting structure layer. The semiconductor light-emitting structure includes a light-emitting layer for generating a projection light source. The light-guiding structure layer is connected to the semiconductor light-emitting structure. The light-reflecting structure layer is connected to the light-guiding structure layer. The projection light source generated by the light-emitting layer is projected into the light-guiding structure layer and onto the light-reflecting structure layer. The projection light source is guided and reflected by matching the light-guiding structure layer and the light-reflecting structure layer to form a wide-angle light source that is projected outwardly from an outer surface of the light-guiding structure layer.
    Type: Application
    Filed: June 29, 2017
    Publication date: October 4, 2018
    Inventors: ZHI-TING YE, SHYI-MING PAN
  • Patent number: 10060600
    Abstract: A light emitting device includes a light emitting chip, a reflecting cup arranged on a side of the light emitting chip, and a package encapsulating the light emitting chip and the reflecting cup. The light emitting chip includes a first light emitting surface and a second light emitting surface coupled to the first light emitting surface. The reflecting cup has an inner surface facing the second light emitting surface of the light emitting chip. The reflecting cup arranges around a periphery of the second light emitting surface. The inner surface of the reflecting cup is a multifocal paraboloid. The multifocal paraboloid includes multistage paraboloids. The corresponding focus points of the multistage paraboloids are symmetrically distributed on the first light emitting surface of the light emitting chip.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: August 28, 2018
    Assignee: HARVATEK CORPORATION
    Inventors: Zhi-Ting Ye, Shyi-Ming Pan
  • Patent number: 9978917
    Abstract: The present invention provides a light-emitting diode (LED) package structure and the method for manufacturing the same. First, a ceramic substrate is provided. Then, an ultraviolet (UV) LED chip, a light-guiding layer, and a metal reflective layer are disposed on the substrate sequentially. By means of the metal reflective layer, the emission light of the UV LED from the light-emitting side is reflected laterally and thus making the UV LED package structure output a plane light source.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: May 22, 2018
    Assignee: Harvatek Corporation
    Inventors: Zhi-Ting Ye, Shyi-Ming Pan
  • Patent number: 9921359
    Abstract: A light source module includes a light guide plate, a reflecting film, and a plurality of edge-type light emitting diode (LED) units. Grooves are defined in a lower surface of the light guide plate. The reflecting film is below the lower surface and covers the entire lower surface and the grooves. An air gap is defined between the reflecting film and the lower surface. The edge-type LED units are located in the grooves. Each edge-type LED unit includes an LED chip, a wavelength converting layer, and a light reflecting layer. Light emitted is converted by the wavelength converting layer, reflected towards sidewalls of the wavelength converting layer, and transmitted to the lower surface. The reflecting film reflects light that enters the air gap towards an upper surface of the light guide plate, enabling uniform emission of light from the upper surface.
    Type: Grant
    Filed: February 17, 2017
    Date of Patent: March 20, 2018
    Assignee: HARVATEK CORPORATION
    Inventors: Zhi-Ting Ye, Shyi-Ming Pan, Chia-Hung Pan
  • Patent number: 9890913
    Abstract: An illumination device includes at least one semiconductor light emitting element, a supporting base, and a lamp housing. The semiconductor light emitting element is disposed on the supporting base. The lamp housing is disposed on the supporting base to cover the semiconductor light emitting element, and includes a first illuminating part and a lateral illuminating part surrounding the first illuminating part. A micro-structure is formed on a side of the first illuminating part and facing the semiconductor light emitting element for reflecting the light emitted from the semiconductor light emitting element.
    Type: Grant
    Filed: May 14, 2014
    Date of Patent: February 13, 2018
    Assignee: EPISTAR CORPORATION
    Inventors: Zhi-Ting Ye, Fen-Ren Chien
  • Publication number: 20180033928
    Abstract: A light emitting diode assembly structure includes a light emitting chip, a color converting layer, a light guiding member, and a reflecting member. The color converting layer coats the light emitting chip and the light guiding member coats the color converting layer. The planar or non-planar reflecting member is arranged over the light guiding member. The reflecting member is faced towards the light emitting chip and changes the range of illumination of the light emitted by the light emitting chip. The reflecting member can be arranged on a side of the color converting layer and light can be irradiated towards the exterior of the light emitting diode assembly structure.
    Type: Application
    Filed: March 28, 2017
    Publication date: February 1, 2018
    Inventors: CHIH-WEI CHANG, ZHI-TING YE, SHYI-MING PAN
  • Publication number: 20180031193
    Abstract: A headlamp module comprises a connecting base, a substrate, and at least two edge-type light emitting diode (LED) units. The at least two edge-type LED units are mounted to opposite surfaces of the substrate facing away from each other. Each edge-type LED unit comprises an LED chip, a wavelength converting layer, and a light reflecting layer. The LED chip comprises a bottom surface, a light emitting surface facing away from the bottom surface, and first sidewalls. The wavelength converting layer covers the light emitting surface and the first sidewalls. The wavelength converting layer converts emitted light to a desired range of wavelengths. The light reflecting layer reflects the converted light toward the second sidewalls, thus expanding the angle and brightness of light around the headlamp module and avoiding an unlit or dark area immediately around the headlamp module.
    Type: Application
    Filed: February 15, 2017
    Publication date: February 1, 2018
    Inventors: ZHI-TING YE, SHYI-MING PAN, CHIA-HUNG PAN
  • Publication number: 20180031755
    Abstract: A light source module includes a light guide plate, a reflecting film, and a plurality of edge-type light emitting diode (LED) units. Grooves are defined in a lower surface of the light guide plate. The reflecting film is below the lower surface and covers the entire lower surface and the grooves. An air gap is defined between the reflecting film and the lower surface. The edge-type LED units are located in the grooves. Each edge-type LED unit includes an LED chip, a wavelength converting layer, and a light reflecting layer. Light emitted is converted by the wavelength converting layer, reflected towards sidewalls of the wavelength converting layer, and transmitted to the lower surface. The reflecting film reflects light that enters the air gap towards an upper surface of the light guide plate, enabling uniform emission of light from the upper surface.
    Type: Application
    Filed: February 17, 2017
    Publication date: February 1, 2018
    Inventors: ZHI-TING YE, SHYI-MING PAN, CHIA-HUNG PAN
  • Publication number: 20180006199
    Abstract: A semiconductor light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED structures are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED structures. Each of the LED structures includes a first electrode and a second electrode. Light emitted from at least one of the LED structures passes through the transparent substrate and emerges from the second main surface. An illumination device includes the semiconductor light emitting element and a supporting base. The semiconductor light emitting element is disposed on the supporting base, and an angle is formed between the semiconductor light emitting element and the supporting base.
    Type: Application
    Filed: March 18, 2014
    Publication date: January 4, 2018
    Inventors: Zhi-Ting Ye, Fen-Ren Chien, Shyi-Ming Pan
  • Patent number: 9799810
    Abstract: A light emitting device includes a side-emitting assembly, a reflecting cup arranged on a side of the side-emitting assembly, and a package for accommodating the side-emitting assembly and the reflecting cup. The side-emitting assembly with a side surface includes a light emitting chip, a wavelength conversion layer coated on the light emitting chip, and a reflecting layer arranged above the wavelength conversion layer. The reflecting cup has an inner surface facing the side surface of the side-emitting assembly. The inner surface of the reflecting cup is a multifocal paraboloid. The multifocal paraboloid includes multistage paraboloids. The corresponding focal points of the multistage paraboloids are symmetrically distributed on the side surface of the side-emitting assembly.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: October 24, 2017
    Assignee: HARVATEK CORPORATION
    Inventors: Zhi-Ting Ye, Shyi-Ming Pan, Chia-Hung Pan, Ping-Lung Wang
  • Publication number: 20170194540
    Abstract: A light-emitting device includes a light-emitting structure with a side surface, and a reflective layer covering the side surface. The light-emitting structure has a first light-emitting angle and a second light-emitting angle. The difference between the first light-emitting angle and the second light-emitting angle is larger than 15°.
    Type: Application
    Filed: December 30, 2016
    Publication date: July 6, 2017
    Inventors: Chien-Liang LIU, Ming-Chi HSU, Shih-An LIAO, Chun-Hung LIU, Zhi-Ting YE, Cheng-Teng YE, Po-Chang CHEN, Sheng-Che CHIOU
  • Patent number: 9488321
    Abstract: A semiconductor light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) structures. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED structures are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED structures. Each of the LED structures includes a first electrode and a second electrode. Light emitted from at least one of the LED structures passes through the transparent substrate and emerges from the second main surface. An illumination device includes the semiconductor light emitting element and a supporting base. The semiconductor light emitting element is disposed on the supporting base, and an angle is formed between the semiconductor light emitting element and the supporting base.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: November 8, 2016
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Zhi-Ting Ye, Fen-Ren Chien, Shyi-Ming Pan
  • Patent number: 9371975
    Abstract: A light source device including a light emitting diode (LED) chip and a molding lens is provided. The molding lens is directly formed on the LED chip and includes a center of a bottom where the LED chip located at and a light exiting surface formed corresponding to the center. The light exiting surface comprises a concave portion, a first light exiting region surrounding the concave portion and a second light exiting region surrounding the first light exiting region. The first light exiting region connects between the concave portion and the second light exiting region.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: June 21, 2016
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Zhi-Ting Ye, Fen-Ren Chien
  • Patent number: 9234641
    Abstract: An optical lens including a first light exit surface, a total internal reflection (TIR) surface, a second light exit surface and a third light exit surface connected in an order, and correspondingly has a first intersection, a second intersection and a third intersection therebetween. A first line between the first intersection and a reference point on an optical axis of the optical lens intersects with the optical axis to form a first angle between 30 degrees to 60 degrees, and a first direction of the reference point pointing toward a point on the TIR surface intersects with a normal of the first light exit surface at the point to form a reflecting angle larger than a critical angle of TIR. A second line between the second intersection and the reference point intersects with the first line to form a second angle between 10 degrees to 30 degrees.
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: January 12, 2016
    Assignee: WINTEK CORPORATION
    Inventors: Wen-Chieh Wu, Zhi-Ting Ye, Ming-Chuan Lin, Hsiu-Ping Lee
  • Publication number: 20150330583
    Abstract: An illumination device includes at least one semiconductor light emitting element, a supporting base, and a lamp housing. The semiconductor light emitting element is disposed on the supporting base. The lamp housing is disposed on the supporting base to cover the semiconductor light emitting element, and includes a first illuminating part and a lateral illuminating part surrounding the first illuminating part. A micro-structure is formed on a side of the first illuminating part and facing the semiconductor light emitting element for reflecting the light emitted from the semiconductor light emitting element.
    Type: Application
    Filed: May 14, 2014
    Publication date: November 19, 2015
    Applicant: Formosa Epitaxy Incorporation
    Inventors: Zhi-Ting Ye, Fen-Ren Chien