Patents by Inventor Zhi-Wei FENG

Zhi-Wei FENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9007778
    Abstract: A signal wiring of a touch panel mainly extends a bonding portion of a touch sensing unit from a signal wire on a substrate outside the substrate. The bonding portion is further attached to a signal bus so as to shrink the wiring area of the touch sensing unit and the edge frame as well. The bonding portion outside the substrate is allowed to be formed larger for improving improving the stability and yield of the connection between the touch sensing unit and the signal bus.
    Type: Grant
    Filed: August 13, 2012
    Date of Patent: April 14, 2015
    Inventors: Kai-Ti Yang, Hsing-Ming Chang, Zhi-Wei Feng
  • Publication number: 20140043776
    Abstract: A signal wiring of a touch panel mainly extends a boding portion of a touch sensing unit from a signal wire on a substrate outside the substrate. The bonding portion is further attached to a signal bus so as to shrink the wiring area of the touch sensing unit and the edge frame as well. The bonding portion outside the substrate is allowed to be formed larger for improve the stability and yield of the connection between the touch sensing unit and the signal bus.
    Type: Application
    Filed: August 13, 2012
    Publication date: February 13, 2014
    Inventors: Kai-Ti YANG, Hsing-Ming CHANG, Zhi-Wei FENG