Patents by Inventor Zhi Yuan Shane Loo

Zhi Yuan Shane Loo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Enhancing metal/low-K interconnect reliability using a protection layer
    Patent number: 8486824
    Abstract: A protection layer is coated or otherwise formed over the interconnect structure. The interconnect structure includes a metal line (such as top and bottom metal layers connected by a metal via) and a low-K material. The protection layer includes a vertically aligned dielectric or other material dispersed with carbon nanotubes. The protection layer could include one or multiple layers of carbon nanotubes, and the carbon nanotubes could have any suitable dispersion, alignment, and pattern in each layer of the protection layer. Among other things, the carbon nanotubes help to reduce or prevent damage to the interconnect structure, such as by reducing or preventing the collapse of the low-K material or delamination between the metal line and the low-K material.
    Type: Grant
    Filed: July 10, 2012
    Date of Patent: July 16, 2013
    Assignees: STMicroelectronics Asia Pacific PTE., Ltd., Nanyang Technological University
    Inventors: Tong Yan Tee, Xueren Zhang, Shanzhong Wang, Valeriy Nosik, Jijie Zhou, Sridhar Idapalapati, Subodh Mhaisalkar, Zhi Yuan Shane Loo
  • ENHANCING METAL/LOW-K INTERCONNECT RELIABILITY USING A PROTECTION LAYER
    Publication number: 20130012016
    Abstract: A protection layer is coated or otherwise formed over the interconnect structure. The interconnect structure includes a metal line (such as top and bottom metal layers connected by a metal via) and a low-K material. The protection layer includes a vertically aligned dielectric or other material dispersed with carbon nanotubes. The protection layer could include one or multiple layers of carbon nanotubes, and the carbon nanotubes could have any suitable dispersion, alignment, and pattern in each layer of the protection layer. Among other things, the carbon nanotubes help to reduce or prevent damage to the interconnect structure, such as by reducing or preventing the collapse of the low-K material or delamination between the metal line and the low-K material.
    Type: Application
    Filed: July 10, 2012
    Publication date: January 10, 2013
    Applicant: STMicroelectronics Asia Pacific PTE Ltd
    Inventors: Tong Yan Tee, Xueren Zhang, Shanzhong Wang, Valeriy Nosik, Jijie Zhou, Sridhar Idapalapati, Subodh Mhaisalkar, Zhi Yuan Shane Loo
  • Enhancing metal/low-K interconnect reliability using a protection layer
    Patent number: 8217518
    Abstract: A protection layer is coated or otherwise formed over the interconnect structure. The interconnect structure includes a metal line (such as top and bottom metal layers connected by a metal via) and a low-K material. The protection layer includes a vertically aligned dielectric or other material dispersed with carbon nanotubes. The protection layer could include one or multiple layers of carbon nanotubes, and the carbon nanotubes could have any suitable dispersion, alignment, and pattern in each layer of the protection layer. Among other things, the carbon nanotubes help to reduce or prevent damage to the interconnect structure, such as by reducing or preventing the collapse of the low-K material or delamination between the metal line and the low-K material.
    Type: Grant
    Filed: March 7, 2007
    Date of Patent: July 10, 2012
    Assignees: STMicroelectronics Asia Pacific Pte., Ltd., Nanyang Technological University
    Inventors: Tong Yan Tee, Xueren Zhang, Shanzhong Wang, Valeriy Nosik, Jijie Zhou, Sridhar Idapalapati, Subodh Mhaisalkar, Zhi Yuan Shane Loo