Abstract: An electronic element is used for being soldered to a top surface and a bottom surface of a circuit board with solder pastes, and includes: a main body, including an insulating body and multiple terminals fixed to the insulating body, in which each of the terminals has a soldering portion, the soldering portions are arranged in two rows for being soldered respectively to the top surface and the bottom surface of the circuit board, and a distance between the two rows of the soldering portions is greater than or equal to a distance between outermost sides of the solder pastes on the top surface and the bottom surface of the circuit board; and a pressing member, located at an outer side of one row of the soldering portions, movably connected to the main body, and finally fixed to the main body. A method for assembling the electronic element to a circuit board is further provided.