Abstract: The disclosure provides a cover plate, a cover plate assembly, a battery housing, a battery module, and a battery pack. The cover plate includes a body portion and a first boss. The body portion has a thickness D1, and 0.8 mm?D1?1.5 mm. The first boss protrudes from one side of the body portion. The first boss is provided with a liquid injection hole communicating with a through hole of an insulating plate. Another side of the body portion is provided with a first concavity corresponding to the first boss. The cover plate has a thickness D2 at the first boss, and 0.8 mm?D2?1.5 mm.

Abstract: A battery liquid injection structure, a battery and a battery pack are provided. The battery liquid injection structure includes a top cover piece and a sealing member. The top cover piece is provided with a liquid injection portion, and a core of the battery is below the liquid injection portion. The liquid injection portion is provided with a liquid injection hole arranged obliquely. The sealing member is sealingly inserted in the liquid injection hole.

Abstract: This application discloses a housing, a housing assembly and a battery. The housing includes an insulating base body and a metal frame. The insulating base body has an accommodation cavity. The insulating base body has a mounting side surface. An opening in communication with the accommodation cavity is defined by the mounting side surface. The metal frame is provided around a circumferential portion of the opening and is fixedly connected to the insulating base body. A through hole in communication with the opening is defined by the metal frame. The metal frame is used for connecting a metal cover plate. The metal cover plate plugs the through hole, so that the structural strength of the housing may meet the use requirements.

Abstract: A bonding device includes: a supporting assembly, comprising a first and second supporting bodies arranged in a first direction, at least one of the first and second supporting bodies is movable in the first direction, the supporting assembly having an upper surface which faces a flexible substrate and matches an inner surface of the flexible substrate; and a stretching assembly, including a carrier film and a plurality of driving elements, a central area of the carrier film being attached to the inner surface of the flexible substrate, at least two of the plurality of driving elements arranged oppositely in the first direction, at least two of the plurality of driving elements arranged oppositely in a second direction, the plurality of driving elements are connected to peripheral portions of the carrier film, and stretches the peripheral portions of the carrier film to align the inner surface with the supporting assembly.

Abstract: A bonding device includes: a supporting assembly, comprising a first and second supporting bodies arranged in a first direction, at least one of the first and second supporting bodies is movable in the first direction, the supporting assembly having an upper surface which faces a flexible substrate and matches an inner surface of the flexible substrate; and a stretching assembly, including a carrier film and a plurality of driving elements, a central area of the carrier film being attached to the inner surface of the flexible substrate, at least two of the plurality of driving elements arranged oppositely in the first direction, at least two of the plurality of driving elements arranged oppositely in a second direction, the plurality of driving elements are connected to peripheral portions of the carrier film, and stretches the peripheral portions of the carrier film to align the inner surface with the supporting assembly.

Abstract: The present invention provides recombinant protein carrying an epitope. The recombinant protein has a skeleton structure from carrier protein, and a low immunogenic protein epitope is imported through splicing, replacement, and/or insertion to at least one molecular surface amino acid residue area of the carrier protein. The carrier protein has at least one T cell epitope, and the recombinant protein can effectively excite immunoreaction of an organism to the low immunogenic protein epitope.