Abstract: A Region Merging image segmentation algorithm based on boundary extraction is disclosed, comprising the steps of calculating a gradient image, extracting a boundary and carrying out initial segmentation and Region Merging, wherein each pixel is regarded as one region when initial segmentation is not conducted. In the Region Merging process, the portion of the common boundary of two adjacent regions that lies on the boundary image is taken as the merging cost, the regions are merged according to the ascending order of the mean gradient value inside the region, and a texture difference evaluation mechanism is introduced to reduce the wrong segmentation. The algorithm solves the problems of the other current segmentation algorithms, such as over-segmentation, easy to be influenced by noise and illumination, large in computation and memory consumption, in need of a large number of samples being marked manually and the like.

Abstract: A Region Merging image segmentation algorithm based on boundary extraction is disclosed, comprising the steps of calculating a gradient image, extracting a boundary and carrying out initial segmentation and Region Merging, wherein the initial segmentation can be omitted. In the Region Merging process, the ratio of the length of boundary extraction result lies on the adjacent edge between adjacent regions to the length of the adjacent edge is taken as the merging cost, the regions are merged according to the ascending order of the mean gradient value in the region, and a texture difference evaluation mechanism is introduced to remove the error segmentation. The algorithm solves the problems of the other current segmentation algorithms, such as over-segmentation, easy to be influenced by noise and illumination, large in computation and memory consumption, in need of a large number of samples being marked manually and the like.

Abstract: The present invention applies to the technical field of photoelectric detectors and provides a high-frequency photoelectric detector encapsulation base can-packaged by using a multi-layer ceramic, comprising a laminated multi-layer ceramic substrate, wherein the multi-layer ceramic substrate is welded with pins at a bottom and provided with a metal ring at a top; an upper surface and a lower surface of each layer of the ceramic substrate are both plated with a conductive metal layer; circuit connection holes are distributed in each layer of the ceramic substrate; the upper surface of the multi-layer ceramic substrate is provided with two power contacts and two differential signal contacts; and the power contacts and the differential signal contacts penetrate through each layer of the ceramic substrate to be connected to the corresponding pins.

Abstract: The present invention applies to the technical field of photoelectric detectors and provides a high-frequency photoelectric detector encapsulation base can-packaged by using a multi-layer ceramic, comprising a laminated multi-layer ceramic substrate, wherein the multi-layer ceramic substrate is welded with pins at a bottom and provided with a metal ring at a top; an upper surface and a lower surface of each layer of the ceramic substrate are both plated with a conductive metal layer; circuit connection holes are distributed in each layer of the ceramic substrate; the upper surface of the multi-layer ceramic substrate is provided with two power contacts and two differential signal contacts; and the power contacts and the differential signal contacts penetrate through each layer of the ceramic substrate to be connected to the corresponding pins.