Patents by Inventor Zhifang Fan

Zhifang Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7768376
    Abstract: This invention provides thermal sensors and imagers that are flexible and capable of conforming to curved surfaces and corresponding methods of making and methods of thermal sensing. The thermal sensors contain an array of thermal resistors patterned in a row and column configuration, with each thermal resistor electrically isolated from other thermal resistors within the sensor. Thermal information is obtained from a region by measuring the resistance of each thermal resistor and calculating a thermal resistance for each entry of the array.
    Type: Grant
    Filed: October 25, 2007
    Date of Patent: August 3, 2010
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: Chang Liu, Nannan Chen, Jonathan Engel, Jack Chen, Zhifang Fan
  • Publication number: 20080219320
    Abstract: This invention provides thermal sensors and imagers that are flexible and capable of conforming to curved surfaces and corresponding methods of making and methods of thermal sensing. The thermal sensors contain an array of thermal resistors patterned in a row and column configuration, with each thermal resistor electrically isolated from other thermal resistors within the sensor. Thermal information is obtained from a region by measuring the resistance of each thermal resistor and calculating a thermal resistance for each entry of the array.
    Type: Application
    Filed: October 25, 2007
    Publication date: September 11, 2008
    Inventors: Chang Liu, Nannan Chen, Jonathan Engel, Jack Chen, Zhifang Fan
  • Patent number: 7351303
    Abstract: Microfluidic systems and components. A microfluidic system includes one or more functional units or microfluidic chips, configured to perform constituent steps in a process and interconnected to form the system. A multi-layer microfluidic system includes a separate dedicated fluid layer and dedicated electromechanical layer connected via through-holes. Electromechanical components are formed on the electromechanical layer.
    Type: Grant
    Filed: October 9, 2003
    Date of Patent: April 1, 2008
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: Chang Liu, Kashan Shaikh, Kee Ryu, Edgar Goluch, Zhifang Fan, David Bullen
  • Publication number: 20080017306
    Abstract: Microfluidic systems and components. A microfluidic system includes one or more functional units or microfluidic chips, configured to perform constituent steps in a process and interconnected to form the system. A multi-layer microfluidic system includes a separate dedicated fluid layer and dedicated electromechanical layer connected via through-holes. Electromechanical components are formed on the electromechanical layer.
    Type: Application
    Filed: October 9, 2003
    Publication date: January 24, 2008
    Inventors: Chang Liu, Kashan Shaikh, Kee Ryu, Edgar Goluch, Zhifang Fan, David Bullen