Abstract: A spine-protecting and spine-correcting multi-functional health-care seat device employing gravity to achieve embrace-like support, pressure reduction, fixing, and correction, including a seat frame and a gravity embrace-like support and sitting device. The gravity embrace-like support and sitting device includes a sitting plate (1), sitting plate support rods (8) symmetrically arranged on two sides of a bottom of the sitting plate (1), rotating bearings (1101) symmetrically arranged on two sides of the seat frame, embrace-like support levers cooperatively arranged on the rotating bearings (1101), and embrace-like support palms (2) arranged at top ends of the embrace-like support levers. One end of each sitting plate support rod (8) is hinged to a bottom of the sitting plate (1), and the other end is hinged to a bottom of each embrace-like support lever through a support rod rotating shaft (15).

Abstract: The present invention generally provides apparatus and methods for providing necessary capacitive decoupling to a large area substrate in a plasma reactor. One embodiment of the invention provides a substrate support for using in a plasma reactor comprising an electrically conductive body has a top surface with a plurality of raised areas configured for contacting a back surface of a large area substrate, and the plurality of raised areas occupy less than about 50% of the surface area of the top surface.

Abstract: The present invention generally provides apparatus and methods for providing necessary capacitive decoupling to a large area substrate in a plasma reactor. One embodiment of the invention provides a substrate support for using in a plasma reactor comprising an electrically conductive body has a top surface with a plurality of raised areas configured for contacting a back surface of a large area substrate, and the plurality of raised areas occupy less than about 50% of the surface area of the top surface.

Abstract: A sputtering target forming method, a sputtering target, and a method of using a sputtering target are herein disclosed. Large area sputtering targets are necessary for producing films on large area substrates. To save on material costs, the large area sputtering target can be formed of multiple target tiles that can be placed adjacent each other on a backing plate. The gaps that are present between the target tiles may to be filled to ensure that the backing plate does not sputter and contaminate the sputtering process. The material filling the gaps may be of the same composition as the sputtering target tiles. Alternatively, the entire sputtering target can be plasma sprayed onto the backing plate to ensure that the sputtering target has a unitary sputtering target body across the entire large area backing plate.

Abstract: A sputtering target forming method, a sputtering target, and a method of using a sputtering target are herein disclosed. Large area sputtering targets are necessary for producing films on large area substrates. To save on material costs, the large area sputtering target can be formed of multiple target tiles that can be placed adjacent each other on a backing plate. The gaps that are present between the target tiles may to be filled to ensure that the backing plate does not sputter and contaminate the sputtering process. The material filling the gaps may be of the same composition as the sputtering target tiles. Alternatively, the entire sputtering target can be plasma sprayed onto the backing plate to ensure that the sputtering target has a unitary sputtering target body across the entire large area backing plate.