Abstract: An electronic device includes a first substrate, a first protrusion, a second protrusion and a plurality of third protrusions. The first substrate includes an edge, a first region, and a second region. The first substrate includes a surface. The first protrusion is in the first region. A maximum distance from the surface to a top surface of the first protrusion is defined as a first distance. The second protrusion is in the second region. A maximum distance from the surface to a top surface of the second protrusion is defined as a second distance. The first protrusion is disposed between two of the third protrusions. A maximum distance from the surface to a top surface of the third protrusion is defined as a third distance. The first distance is different from the second distance, and the third distance is less than the first distance.

Abstract: A method for inspecting electronic components and an electronic device are provided. The electronic device includes electronic elements, signal lines, an inspection structure, a substrate and a first driving element electrically connected to the signal lines. The signal lines include a first and a second signal lines. The electronic components include a first group of electronic components electrically connected to the first signal line and a second group of electronic components electrically connected to the second signal line. The first signal line has a first portion overlapping a first inspection region and a second portion overlapping the first driving element. The second signal line has a third portion overlapping a second inspection region and a fourth portion overlapping the first driving element. A distance between the second portion and the fourth portion is smaller than a distance between the first portion and the third portion.

Abstract: An electronic device is provided. The electronic device includes a working region and a non-working region adjacent to the working region. The electronic device includes a first substrate, a first photo spacer, a second photo spacer, and a plurality of third photo spacers. The first photo spacer is disposed on the first substrate in the working region and has a first thickness. The second photo spacer is disposed on the first substrate in the non-working region and has a second thickness. The plurality of third photo spacers are disposed on the first substrate. The first photo spacer is disposed between two of the plurality of third photo spacers. At least one of the plurality of third photo spacers has a third thickness. The first thickness is different from the second thickness, and the third thickness is less than the first thickness.

Abstract: An electronic device including a plurality of electronic components, a first substrate, a second substrate, and a third substrate is provided. The first substrate includes a first driving circuit and a first connection pad. The second substrate includes a second driving circuit and a second connection pad, and the first connection pad is coupled to the second connection pad. The first substrate, the second substrate, and the plurality of electronic components are disposed on the third substrate.

Abstract: An electronic device, including multiple electronic elements, a first substrate, a second substrate, and a third substrate, is provided. The first substrate includes a first device element and a first connection pad. The second substrate includes a second device element and a second connection pad. The third substrate includes a first connection line, wherein the first connection pad and the second connection pad are coupled to the first connection line, and the first substrate, the second substrate, and the electronic elements are disposed on the third substrate.

Abstract: An electronic device, a setting method for determining a common voltage of the electronic device, and a setting method for determining a driving voltage difference range of the electronic device are provided. The electronic device includes a data line, a tunable element, and a control element. The control element stores a threshold voltage of the tunable element. The threshold voltage is a driving voltage difference corresponding to a maximum capacitance value. The control element is configured to provide a first input voltage to the data line and receive a first output voltage. The control element is configured to provide a second input voltage to the data line and receive a second output voltage. The control element determines a desired common voltage according to at least one of the first output voltage and the second output voltage and according to the threshold voltage of the tunable element.

Abstract: This disclosure provides a communication device and a manufacturing method thereof. The manufacturing method of the communication device includes the following steps: providing a first dielectric layer, wherein the first dielectric layer includes a first region and a second region, and the first dielectric layer has a first surface and a second surface opposite to the first surface; providing a second dielectric layer; combining the first dielectric layer and the second dielectric layer with a sealing element, so that the sealing element is disposed between the first surface of the first dielectric layer and a third surface of the second dielectric layer; after combining the first dielectric layer and the second dielectric layer, thinning the second surface of the first dielectric layer; and disposing a first communication element on the first surface of the first dielectric layer in the first region.

Abstract: A manufacturing method of an electronic device including following steps is provided. A first substrate is provided. A thermal release adhesive layer is provided on the first substrate. A thinning process is performed on the first substrate to form a first thinned substrate. A cutting process is performed on the first thinned substrate to form a first sub-substrate. The thermal release adhesive layer is separated from the first thinned substrate or the first sub-substrate. In the manufacturing method of the electronic device provided in one or more embodiments of the disclosure, the manufacturing process of the electronic device may be simplified, and/or defects of the resultant electronic device may be reduced.

Abstract: An electronic device is provided. The electronic device includes a working region and a non-working region adjacent to the working region. The electronic device includes a first substrate, a first photo spacer, a second photo spacer, and a plurality of third photo spacers. The first photo spacer is disposed on the first substrate in the working region and has a first thickness. The second photo spacer is disposed on the first substrate in the non-working region and has a second thickness. The plurality of third photo spacers are disposed on the first substrate. The first photo spacer is disposed between two of the plurality of third photo spacers. At least one of the plurality of third photo spacers has a third thickness. The first thickness is different from the second thickness, and the third thickness is less than the first thickness.

Abstract: An electronic modulating device is provided. The electronic modulating device includes a first substrate. The first substrate includes a first portion and a second portion. The electronic modulating device also includes a second substrate disposed opposite to the first substrate. The electronic modulating device further includes at least one working device disposed between the first substrate and the second substrate, wherein the working device overlaps the first portion and does not overlap the second portion. In addition, the electronic modulating device includes a first adjustment unit disposed between the first portion of the first substrate and the second substrate. The first adjustment unit has a first elastic coefficient. The electronic modulating device also includes second adjustment unit disposed between the second portion of the first substrate and the second substrate. The second adjustment unit has a second elastic coefficient that is greater than the first elastic coefficient.

Abstract: The disclosure provides an electromagnetic wave adjusting device, including a first substrate, a first conductive element, a second substrate, a second conductive element, and a dielectric layer. The first conductive element is disposed on the first substrate. The second substrate is opposite to the first substrate. The second conductive element is disposed on the second substrate and faces the first substrate, in which the first conductive element has an overlapping region which overlaps the second conductive element. The dielectric layer is disposed between the first substrate and the second substrate. The electromagnetic wave adjusting device includes a working region and a non-working region. The working region includes the overlapping region. The non-working region is disposed outside the working region. A first region in the non-working region and a second region in the working region have the same film-layer stack structure.

Abstract: An electronic modulating device is provided. The electronic modulating device includes a first substrate. The first substrate includes a first portion and a second portion. The electronic modulating device also includes a second substrate disposed opposite to the first substrate. The electronic modulating device further includes at least one working device disposed between the first substrate and the second substrate, wherein the working device overlaps the first portion and does not overlap the second portion. In addition, the electronic modulating device includes a first adjustment unit disposed between the first portion of the first substrate and the second substrate. The first adjustment unit has a first elastic coefficient. The electronic modulating device also includes second adjustment unit disposed between the second portion of the first substrate and the second substrate. The second adjustment unit has a second elastic coefficient that is greater than the first elastic coefficient.

Abstract: An electronic modulating device is provided. The electronic modulating device includes a first substrate. The first substrate includes a first portion and a second portion. The electronic modulating device also includes a second substrate disposed opposite to the first substrate. The electronic modulating device further includes at least one working device disposed between the first substrate and the second substrate, wherein the working device overlaps the first portion and does not overlap the second portion. In addition, the electronic modulating device includes a first adjustment unit disposed between the first portion of the first substrate and the second substrate. The first adjustment unit has a first elastic coefficient. The electronic modulating device also includes second adjustment unit disposed between the second portion of the first substrate and the second substrate. The second adjustment unit has a second elastic coefficient that is greater than the first elastic coefficient.

Abstract: The disclosure provides an electromagnetic wave adjusting device, including a first substrate, a first conductive element, a second substrate, a second conductive element, and a dielectric layer. The first conductive element is disposed on the first substrate. The second substrate is opposite to the first substrate. The second conductive element is disposed on the second substrate and faces the first substrate, in which the first conductive element has an overlapping region which overlaps the second conductive element. The dielectric layer is disposed between the first substrate and the second substrate. The electromagnetic wave adjusting device includes a working region and a non-working region. The working region includes the overlapping region. The non-working region is disposed outside the working region. A first region in the non-working region and a second region in the working region have the same film-layer stack structure.

Abstract: An electronic modulating device is provided. The electronic modulating device includes a first substrate. The first substrate includes a first portion and a second portion. The electronic modulating device also includes a second substrate disposed opposite to the first substrate. The electronic modulating device further includes at least one working device disposed between the first substrate and the second substrate, wherein the working device overlaps the first portion and does not overlap the second portion. In addition, the electronic modulating device includes a first adjustment unit disposed between the first portion of the first substrate and the second substrate. The first adjustment unit has a first elastic coefficient. The electronic modulating device also includes second adjustment unit disposed between the second portion of the first substrate and the second substrate. The second adjustment unit has a second elastic coefficient that is greater than the first elastic coefficient.