Abstract: An example on-board charger includes an insulating housing and an on-board charging device. In the on-board charging device, a bidirectional direct current conversion circuit is configured to receive a first direct current transmitted by a direct current bus, and output a second direct current through a power battery connection port to supply power to a power battery. A first bridge arm circuit is configured to receive an alternating current through an alternating current power supply input port, and output the first direct current. A second bridge arm circuit is configured to receive the first direct current and output a second alternating current through the alternating current load power supply port to supply power to the alternating current load.

Abstract: Provided are a preparation method of a pyridazinone derivative, an intermediate thereof, and a preparation method of the intermediate. The method has the advantages of easily available raw materials, simple steps, low costs, good intermediate stability, high purity and high yield, and is suitable for large-scale industrial production.

Abstract: The present disclosure relates to compositions and methods for treating Williams syndrome (WS), herein identified as a neurodevelopmental oligodendrocyte hypomyelination-associated disease, and to compositions and methods for treatment of other neurodevelopmental myelination abnormality diseases or disorder.

Abstract: A semiconductor molding system is provided that includes a molding device, an image collection device, and a controller connected to the molding device and the image collection device. The image collection device is configured to obtain a target image of a to-be-molded lead frame before the to-be-molded lead frame is molded by the molding device. The controller is configured to determine whether foreign object(s) exist in a non-molding area of the to-be-molded lead frame based on the target image of the to-be-molded lead frame and a reference image. A method for detecting foreign objects of a to-be-molded lead frame is also provided.

Abstract: Data is received that characterizes a chip in the package system (CPS) having a plurality of wires and vias. Thereafter, using the received data, a chip power calculation is performed. The chip power calculated is used to generate a thermal-aware power map. Further, package and system level thermal analysis is performed using the power map to generate a tile-based CPS thermal profile. A plurality of chip finite element sub-models are then generated that each correspond to a different tile. A thermal field solution is solved for each sub-model so that, for each wire, wire temperature rises are extracted from the corresponding the chip sub-model analysis and combined with temperature values from the CPS thermal profile. This extracting and combining is then used to generate a back-annotation file covering each metal wire and via in the CPS.

Abstract: Data is received that characterizes a chip in the package system (CPS) having a plurality of wires and vias. Thereafter, using the received data, a chip power calculation is performed. The chip power calculated is used to generate a thermal-aware power map. Further, package and system level thermal analysis is performed using the power map to generate a tile-based CPS thermal profile. A plurality of chip finite element sub-models are then generated that each correspond to a different tile. A thermal field solution is solved for each sub-model so that, for each wire, wire temperature rises are extracted from the corresponding the chip sub-model analysis and combined with temperature values from the CPS thermal profile. This extracting and combining is then used to generate a back-annotation file covering each metal wire and via in the CPS.

Abstract: Data is received that characterizes a chip in the package system (CPS) having a plurality of wires and vias. Thereafter, using the received data, a chip power calculation is performed. The chip power calculated is used to generate a thermal-aware power map. Further, package and system level thermal analysis is performed using the power map to generate a tile-based CPS thermal profile. A plurality of chip finite element sub-models are then generated that each correspond to a different tile. A thermal field solution is solved for each sub-model so that, for each wire, wire temperature rises are extracted from the corresponding the chip sub-model analysis and combined with temperature values from the CPS thermal profile. This extracting and combining is then used to generate a back-annotation file covering each metal wire and via in the CPS.