Abstract: The disclosure discloses a preparation method and product of carbon fiber reinforced polymer composites with a designable characteristic structure. The method includes: (a) choosing carbon fabrics as raw material, where a predetermined number of the fabrics are selected to deposit the reinforcement phase; (b) coating all carbon fabrics with resin matrix, placing the fabrics layer by layer, where the carbon fabrics with the reinforcement phases are placed in a predetermined layer, meanwhile a micro power supply is placed in a setting layer during the stacking process, then a prefabricated product is obtained; (c) placing the prefabricated product in a vacuum bag then evacuating and sealing, hot pressing the sealed prefabricated product, finally the carbon fiber reinforced polymer composite product in the vacuum bag after hot pressing is successfully manufactured.

Abstract: The disclosure belongs to the technical field of batteries, and particularly relates to a current collector component, which includes a first current collector piece, a second current collector piece, and an insulator, the first current collector piece and the second current collector piece being in insulated connection through an insulator; the second current collector piece includes a body part and a welding part, the body part and the welding part forming an included angle, and a welding surface of the welding part and a surface of the body part forming an included angle. The structure of the disclosure has high welding safety, may increase the utilization rate of the internal space of a housing, and may prevent the damage to a cell caused by laser penetration welding. In addition, the disclosure further discloses a secondary battery.

Abstract: The disclosure belongs to the technical field of batteries, and particularly relates to a current collector component, which includes a first current collector piece, a second current collector piece, and an insulator, the first current collector piece and the second current collector piece being in insulated connection through an insulator; and the second current collector piece includes a body part, a welding part, and a connecting part, the body part being connected to the insulator and provided with a first electrical connection surface, the connecting part being connected between the body part and the welding part, and the connecting part being bendable, so that the welding part is located on the side, far away from the first electrical connection surface, of the body part. The structure of the disclosure may increase the utilization rate of the internal space of a housing.

Abstract: The present disclosure relates to a semiconductor structure and a method for forming the semiconductor structure. The semiconductor structure includes: a first wafer, including a first substrate and a first dielectric layer on the first substrate, a pad groove and a pad structure in the pad groove are formed in the first substrate and the first dielectric layer, and the pad groove extends through the first substrate along a direction from the first substrate to the first dielectric layer and extends into a partial thickness of the first dielectric layer; and an isolation ring structure, arranged in the first substrate around the pad groove and extending through the first substrate along the direction from the first substrate to the first dielectric layer.

Abstract: The present disclosure relates to a semiconductor structure and a method for forming the semiconductor structure. The semiconductor structure includes: a first wafer, including a first substrate and a first dielectric layer on the first substrate, a plurality of through-silicon via (TSV) structures in an array arrangement are formed in the first substrate, and the TSV structures extend through the first substrate along a direction from the first substrate to the first dielectric layer and extend into a partial thickness of the first dielectric layer; and an isolation ring structure, arranged in the first substrate around the plurality of TSV structures and extending through the first substrate along the direction from the first substrate to the first dielectric layer.

Abstract: The present invention provides a liquid bandage containing peptide anti-inflammatory active ingredient and a preparation method thereof, which relates to the technical field of medical materials. The liquid bandage comprises film-forming agents; one or more plasticizers, comprising glycerin; one or more anti-inflammatory substances, comprising oligopeptide with an amino acid sequence of Leu-Leu-Phe-Thr-Thr-Gln; and solvent, comprising deionized water. The liquid bandage can promote the expression of interleukin 10 (IL-10) and inhibit the expressions of interleukin 6 (IL-6) and tumor necrosis factor (TNF-?). Peptide anti-inflammatory active ingredient can produce good anti-inflammatory activity. Further, the liquid bandage can enhance the close contact between gel and the injured skin surface, increase the cleanliness of the wound surface, and can increase a clearance rate of inflammatory cells.

Abstract: The present invention provides a liquid band-aid containing peptide anti-inflammatory active ingredient and a preparation method thereof, which belong to the technical field of medical materials. The liquid band-aid includes film-forming agent, plasticizer, anti-inflammatory substance, and solvent, where the plasticizer includes glycerin, the solvent includes deionized water, and the anti-inflammatory substance includes high F-value oligopeptide with an amino acid sequence of Leu-Leu-Phe-Thr-Thr-Gln and a molecular weight of 736.52 Da. The liquid band-aid can promote the expression of interleukin 10 (IL-10) and inhibit the expressions of cytokine interleukin 6 (IL-6) and tumor necrosis factor (TNF-?), and thus have good anti-inflammatory activity. The liquid band-aid further enhances the close contact between gel and an injured skin surface, increases the cleanliness of a wound surface, and improves the clearance rate of inflammatory cells.