Patents by Inventor ZHIGAO WANG
ZHIGAO WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250133852Abstract: The present disclosure discloses a photoelectric sensor and a forming method thereof. The photoelectric sensor includes a substrate and a light-transmitting layer. The substrate has a light-receiving surface and includes a plurality of photosensitive pixel regions. Each photosensitive pixel region includes a plurality of pixel units arranged in a matrix. In a pixel unit, a plurality of first protrusions are formed in the light-receiving surface of the substrate, and both a lateral dimension and a vertical dimension of a first protrusion of the plurality of first protrusions are smaller than a wavelength of light. The light-transmitting layer covering the light-receiving surface of the substrate and filling between adjacent first protrusions of the plurality of first protrusions.Type: ApplicationFiled: October 16, 2024Publication date: April 24, 2025Inventors: Huike WANG, Zhigao WANG
-
Patent number: 12256012Abstract: A method and an apparatus for privacy protection biometric authentication and an electronic device. The method comprises the following steps: constructing a corresponding a biological data template according to a biological information data set input by a user when registering; generating a pair of public key and private key by asymmetric cryptography technology; generating encrypted biological data by a secret sharing solution and OKVS technology according to the biological data template and the private key; sending the public key and the encrypted biological data to a server; recovering the private key by OKVS technology according to the biological data input by the user during authentication and the encrypted biological data; constructing a signature according to the recovered private key and the corresponding public key; sending the signature to the server, so that the server verifies the user according to the public key and the signature.Type: GrantFiled: March 15, 2024Date of Patent: March 18, 2025Assignees: ZHEJIANG UNIVERSITY, ZJU-HANGZHOU GLOBAL SCIENTIFIC AND TECHNOLOGICAL INNOVATION CENTERInventors: Bingsheng Zhang, Zhigao Wang, Kui Ren
-
Publication number: 20250072133Abstract: Photodetector and forming method thereof are provided. The photodetector includes a substrate including a plurality of photosensitive areas and isolation areas between adjacent photosensitive area; a diode structure in a photosensitive area of the plurality of photosensitive areas; a deep trench isolation structure in an isolation area of the isolation areas; a protruding portion at least on a top surface of the deep trench isolation structure, a surface of the protruding portion protruding relative to a surface of the substrate, and a center of the protruding portion being higher than edges of the protruding portion; and a passivation layer on surfaces of protruding portions, a refractive index of the passivation layer material being greater than a refractive index of a material of the protruding portions.Type: ApplicationFiled: July 3, 2024Publication date: February 27, 2025Inventors: Yuqing ZHANG, Xing CHEN, Zhigao WANG
-
Publication number: 20240279006Abstract: An automatic high-speed stacking machine is disclosed, including a loading unit, a precision positioning unit, a stacking unit, a grabbing unit and a feeding unit. The feeding unit includes a platen configured to place silicon steel sheet stack; a material warehouse configured to store the platen containing the silicon steel sheet stack. An area of a side of the material warehouse is defined as a reclaiming area, and an area of a side of the loading unit is defined as a loading area. A skip car moving back and forth between the reclaiming area and the loading area is configured to take out and send the platen containing the silicon steel sheet stack from the material warehouse to the loading area, or send an empty platen back to the material warehouse.Type: ApplicationFiled: April 30, 2024Publication date: August 22, 2024Inventors: Yanan ZHANG, Yajun DING, Bing ZONG, Linlin PEI, Qi YU, Zhigao WANG, Dongsheng LU, Peng TANG
-
Publication number: 20240223377Abstract: A method and an apparatus for privacy protection biometric authentication and an electronic device. The method comprises the following steps: constructing a corresponding a biological data template according to a biological information data set input by a user when registering; generating a pair of public key and private key by asymmetric cryptography technology; generating encrypted biological data by a secret sharing solution and OKVS technology according to the biological data template and the private key; sending the public key and the encrypted biological data to a server; recovering the private key by OKVS technology according to the biological data input by the user during authentication and the encrypted biological data; constructing a signature according to the recovered private key and the corresponding public key; sending the signature to the server, so that the server verifies the user according to the public key and the signature.Type: ApplicationFiled: March 15, 2024Publication date: July 4, 2024Inventors: Bingsheng ZHANG, Zhigao WANG, Kui REN
-
Publication number: 20240222406Abstract: Pixel units, photodetectors and fabrication methods of photodetectors are provided. The Pixel unit include a base substrate; a first deep trench isolation structure located in the base substrate and extending in a first direction; a second deep trench isolation structure located in the base substrate, electrically insulated from the first deep trench isolation structure and extending in a second direction intersecting the first direction, and a photosensitive element located in a portion of the base substrate surrounded by the first deep trench isolation structure and the second deep trench isolation structure and connected in series with the first deep trench isolation structure. The second deep trench isolation structure includes a first conductive layer, a second conductive layer and a dielectric layer between the first conductive layer and the second conductive layer.Type: ApplicationFiled: December 29, 2023Publication date: July 4, 2024Inventors: Xing CHEN, Zhigao WANG
-
Publication number: 20240186362Abstract: An image sensor and a formation method of the image sensor are provided in the present disclosure. The method includes forming an array substrate, where a photosensitive device is in the array substrate; forming an interconnection structural layer on the array substrate; forming a passivation structural layer on the interconnection structural layer; and forming a connection pad and an isolation wall in the passivation structural layer. The connection pad is electrically connected to the photosensitive device; and the isolation wall is between adjacent photosensitive devices and at least passes through the passivation structural layer and extends to the interconnection structural layer.Type: ApplicationFiled: November 30, 2023Publication date: June 6, 2024Inventors: Zhanjie LU, Zhigao WANG
-
Publication number: 20240162262Abstract: A backside illuminated (BSI) image sensor includes: an array substrate containing one or more photosensitive devices and including a first surface; a mirror layer disposed at a side of the first surface of the array substrate and electrically insulted from the one or more photosensitive devices; and an interconnection structure layer disposed at a side of the mirror layer facing away from the array substrate, electrically connected to the one or more photosensitive devices, and electrically insulated from the mirror layer.Type: ApplicationFiled: November 13, 2023Publication date: May 16, 2024Inventors: Huike WANG, Zhigao WANG
-
Publication number: 20230402316Abstract: The present disclosure relates to a semiconductor structure and a method for forming the semiconductor structure. The semiconductor structure includes: a first wafer, including a first substrate and a first dielectric layer on the first substrate, a pad groove and a pad structure in the pad groove are formed in the first substrate and the first dielectric layer, and the pad groove extends through the first substrate along a direction from the first substrate to the first dielectric layer and extends into a partial thickness of the first dielectric layer; and an isolation ring structure, arranged in the first substrate around the pad groove and extending through the first substrate along the direction from the first substrate to the first dielectric layer.Type: ApplicationFiled: May 26, 2023Publication date: December 14, 2023Applicants: Semiconductor Manufacturing International (Beijing) Corporation, Semiconductor Manufacturing International (Shanghai) CorporationInventors: Bingquan WANG, Siriguleng Zhang, Dayong Yan, Zhigao Wang, Daming Zhang
-
Publication number: 20230402481Abstract: The present disclosure relates to a semiconductor structure and a method for forming the semiconductor structure. The semiconductor structure includes: a first wafer, including a first substrate and a first dielectric layer on the first substrate, a plurality of through-silicon via (TSV) structures in an array arrangement are formed in the first substrate, and the TSV structures extend through the first substrate along a direction from the first substrate to the first dielectric layer and extend into a partial thickness of the first dielectric layer; and an isolation ring structure, arranged in the first substrate around the plurality of TSV structures and extending through the first substrate along the direction from the first substrate to the first dielectric layer.Type: ApplicationFiled: May 26, 2023Publication date: December 14, 2023Applicants: Semiconductor Manufacturing International (Beijing) Corporation, Semiconductor Manufacturing International (Shanghai) CorporationInventors: Bingquan WANG, Siriguleng ZHANG, Dayong YAN, Zhigao WANG, Hui REN
-
Publication number: 20230112511Abstract: The present invention provides a liquid bandage containing peptide anti-inflammatory active ingredient and a preparation method thereof, which relates to the technical field of medical materials. The liquid bandage comprises film-forming agents; one or more plasticizers, comprising glycerin; one or more anti-inflammatory substances, comprising oligopeptide with an amino acid sequence of Leu-Leu-Phe-Thr-Thr-Gln; and solvent, comprising deionized water. The liquid bandage can promote the expression of interleukin 10 (IL-10) and inhibit the expressions of interleukin 6 (IL-6) and tumor necrosis factor (TNF-?). Peptide anti-inflammatory active ingredient can produce good anti-inflammatory activity. Further, the liquid bandage can enhance the close contact between gel and the injured skin surface, increase the cleanliness of the wound surface, and can increase a clearance rate of inflammatory cells.Type: ApplicationFiled: November 9, 2022Publication date: April 13, 2023Applicant: ZHEJIANG OCEAN UNIVERSITYInventors: HONGYU LUO, XINWEI YU, ZHIGAO WANG, JU HUANG, PENG GAO, CHONG YI
-
Publication number: 20210093748Abstract: The present invention provides a liquid band-aid containing peptide anti-inflammatory active ingredient and a preparation method thereof, which belong to the technical field of medical materials. The liquid band-aid includes film-forming agent, plasticizer, anti-inflammatory substance, and solvent, where the plasticizer includes glycerin, the solvent includes deionized water, and the anti-inflammatory substance includes high F-value oligopeptide with an amino acid sequence of Leu-Leu-Phe-Thr-Thr-Gln and a molecular weight of 736.52 Da. The liquid band-aid can promote the expression of interleukin 10 (IL-10) and inhibit the expressions of cytokine interleukin 6 (IL-6) and tumor necrosis factor (TNF-?), and thus have good anti-inflammatory activity. The liquid band-aid further enhances the close contact between gel and an injured skin surface, increases the cleanliness of a wound surface, and improves the clearance rate of inflammatory cells.Type: ApplicationFiled: September 26, 2020Publication date: April 1, 2021Inventors: HONGYU LUO, XINWEI YU, ZHIGAO WANG, JU HUANG, PENG GAO, CHONG YI