Patents by Inventor Zhihai Zack Yu

Zhihai Zack Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat transfer apparatus and method for transferring heat between integrated circuits
    Patent number: 8654530
    Abstract: A heat transfer apparatus and method are provided for transferring heat between integrated circuits. In use, a heat transfer medium is provided with a first end in thermal communication with a first integrated circuit and a second end in thermal communication with a second integrated circuit. Furthermore, a single casting formed about the heat transfer medium and defining at least one heat sink is provided for thermal communication with the first integrated circuit or the second integrated circuit.
    Type: Grant
    Filed: October 16, 2007
    Date of Patent: February 18, 2014
    Assignee: NVIDIA Corporation
    Inventor: Zhihai Zack Yu
  • Heat sink apparatus and method for allowing air to flow directly to an integrated circuit package thereunder
    Patent number: 7965506
    Abstract: A heat sink apparatus and method are provided for allowing air to flow directly to an integrated circuit package thereunder. In use, a heat sink is provided including an upper portion with a plurality of fins, and a lower portion configured for allowing air to flow directly to an integrated circuit package thereunder.
    Type: Grant
    Filed: August 22, 2007
    Date of Patent: June 21, 2011
    Assignee: NVIDIA Corporation
    Inventors: Zhihai Zack Yu, Don Le
  • Circuit board heat exchanger carrier system and method
    Patent number: 7885063
    Abstract: A heat exchanger carrier system, method, and computer program product are provided. Included is a circuit board with components mounted thereon. Further included is a carrier coupled to the circuit board. Also included is a plurality of heat exchangers coupled to the carrier for transferring heat from the components.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: February 8, 2011
    Assignee: NVIDIA Corporation
    Inventors: Zhihai Zack Yu, Jeong H. Kim, Tommy C. Lee
  • Flat vapor chamber apparatus and method for transferring heat between integrated circuits
    Patent number: 7800905
    Abstract: A flat vapor chamber apparatus and method are provided for transferring heat between integrated circuits. In use, a flat vapor chamber is provided with a first end in thermal communication with a first integrated circuit and a second end in thermal communication with a second integrated circuit.
    Type: Grant
    Filed: October 16, 2007
    Date of Patent: September 21, 2010
    Assignee: NVIDIA Corporation
    Inventor: Zhihai Zack Yu
  • Heat exchanger system and method for circulating external air about a chipset
    Patent number: 7643301
    Abstract: A system, method, and computer program product are provided for circulating external air about a chipset. Included is a circuit board with a chipset mounted thereon that communicates with a central processing unit and controls interaction with memory. Further provided is an airflow subsystem coupled to the circuit board for circulating external air about the chipset.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: January 5, 2010
    Assignee: NVIDIA Corporation
    Inventors: Zhihai Zack Yu, Tommy C. Lee
  • Controllable heat transfer medium system and method for use with a circuit board
    Patent number: 7619889
    Abstract: A system and method are provided for controlling a transfer of heat between circuit board components. Included is a circuit board with components mounted thereon. Also provided is a controllable heat transfer medium for controlling a transfer of heat between the components.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: November 17, 2009
    Assignee: NVIDIA Corporation
    Inventors: Zhihai Zack Yu, Jeong H. Kim, Tommy C. Lee
  • CONTROLLABLE HEAT TRANSFER MEDIUM SYSTEM AND METHOD FOR USE WITH A CIRCUIT BOARD
    Publication number: 20090050309
    Abstract: A system and method are provided for controlling a transfer of heat between circuit board components. Included is a circuit board with components mounted thereon. Also provided is a controllable heat transfer medium for controlling a transfer of heat between the components.
    Type: Application
    Filed: August 20, 2007
    Publication date: February 26, 2009
    Inventors: Zhihai Zack Yu, Jeong H. Kim, Tommy C. Lee
  • CIRCUIT BOARD HEAT EXCHANGER CARRIER SYSTEM AND METHOD
    Publication number: 20090050292
    Abstract: A heat exchanger carrier system, method, and computer program product are provided. Included is a circuit board with components mounted thereon. Further included is a carrier coupled to the circuit board. Also included is a plurality of heat exchangers coupled to the carrier for transferring heat from the components.
    Type: Application
    Filed: August 20, 2007
    Publication date: February 26, 2009
    Inventors: Zhihai Zack Yu, Jeong H. Kim, Tommy C. Lee