Abstract: A tripod head is designed for solving the problem that in the prior art, a tripod head cannot take the undamped motion only in the horizontal unidirection. The tripod head comprises a ball sleeve. The upper part of the ball sleeve is provided with an opening. A spherical joint for being connected with a quick release plate connector is arranged in the opening. A rotatable chassis is arranged under the lower part of the ball sleeve. The middle part of the chassis is provided with a mounting hole for being connected with a tripod, wherein a unidirectional positioning regulating knob is arranged on the outer surface of the ball sleeve and the axis of the unidirectional positioning regulating knob is positioned on the same horizontal plane as the center of the spherical joint.

Abstract: Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.

Abstract: A method and an apparatus for setting a touch vibration function of a touchscreen. The method includes receiving a function setting instruction input by a user by using an operation interface; changing a value of a preset registration entry according to the function setting instruction; receiving touch information generated when the touchscreen is touched; and performing a touch vibration according to the touch information and reporting the touch information to an operating system when the value of the registration entry determines that a touch vibration is to be performed; or reporting the touch information to an operating system when the value of the registration entry determines that a touch vibration is not to be performed. The present invention is applicable to a WP8 capacitive touchscreen mobile phone.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for thermal management of an integrated circuit assembly using a jumping-drops vapor chamber. In one embodiment, an apparatus includes a die having a first side including a plurality of integrated circuit devices that are configured to generate heat when in operation, and a second side disposed opposite to the first side, and a vapor chamber including a liquid, an evaporator including a surface that is thermally coupled with the second side of the die, the evaporator being configured to evaporate the liquid to vapor, and a condenser including a superhydrophobic surface and configured to condense the vapor, wherein energy released from coalescence of condensed vapor on the superhydrophobic surface causes the condensed vapor to jump from the superhydrophobic surface of the condenser to the surface of the evaporator. Other embodiments may be described and/or claimed.

Abstract: Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.

Abstract: Assemblies, methods, and systems for controlling the temperature of an electronic device are described. One method includes positioning an electronic device in a chamber and electrically coupling a probe to the electronic device. The method also includes flowing a fluid in contact with the electronic device at a flow rate, the fluid comprising a liquid. A current is applied to the probe to carry out an electronic device testing operation, and a temperature of the electronic device is monitored during the electronic testing operation. The method may also include determining whether a change to the flow rate or temperature is necessary based on the monitored temperature of the electronic device. In one aspect of certain embodiments, the electronic device may be positioned so that each of the sides of the electronic device may be at least partially in contact with the fluid during the electronic device testing operation.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for thermal management of an integrated circuit assembly using a jumping-drops vapor chamber. In one embodiment, an apparatus includes a die having a first side including a plurality of integrated circuit devices that are configured to generate heat when in operation, and a second side disposed opposite to the first side, and a vapor chamber including a liquid, an evaporator including a surface that is thermally coupled with the second side of the die, the evaporator being configured to evaporate the liquid to vapor, and a condenser including a superhydrophobic surface and configured to condense the vapor, wherein energy released from coalescence of condensed vapor on the superhydrophobic surface causes the condensed vapor to jump from the superhydrophobic surface of the condenser to the surface of the evaporator. Other embodiments may be described and/or claimed.

Abstract: Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.

Abstract: The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.

Abstract: The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.

Abstract: The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.

Abstract: The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.

Abstract: In some embodiments, transpiration cooling and fuel cell for ultra mobile applications is presented. In this regard, an apparatus is introduced having an integrated circuit device, a fuel cell to power the integrated circuit device, wherein the fuel cell produces water as a byproduct, a chassis to house the integrated circuit device and the fuel cell, and a skin to cover the chassis, the skin comprising a waterproof layer configured to prevent water from contacting the integrated circuit device and a water absorbent layer of hydro gel configured to absorb water. Other embodiments are also disclosed and claimed.

Abstract: In some embodiments, transpiration cooling and fuel cell for ultra mobile applications is presented. In this regard, an apparatus is introduced having an integrated circuit device, a fuel cell to power the integrated circuit device, wherein the fuel cell produces water as a byproduct, a chassis to house the integrated circuit device and the fuel cell, and a skin to cover the chassis, the skin comprising a waterproof layer configured to prevent water from contacting the integrated circuit device and a water absorbent layer of hydro gel configured to absorb water. Other embodiments are also disclosed and claimed.

Abstract: Disclosed is fluid dispenser valve for managing a streamlined flow of fluid. The fluid dispenser valve includes a valve chamber and a fluid inlet. The valve chamber is capable of circulating the fluid. Further, the fluid inlet is configured tangentially to the valve chamber. The fluid inlet is capable of enabling the flow of the fluid into the valve chamber.