Patents by Inventor ZHIHUI WEI

ZHIHUI WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular power supply and method for manufacturing the same
    Patent number: 9867275
    Abstract: A modular power supply and a method for manufacturing the same are disclosed. The modular power supply comprises a printed circuit board, power components, and a heat sink. The power components are mounted on the printed circuit board and disposed at a side opposite to the heat sink, a lower surface of the printed circuit board is engaged with an upper surface of the heat sink which is planar, and an insulating layer is disposed between the upper surface of the heat sink and the lower surface of the printed circuit board. A method for manufacturing the modular power supply is also disclosed. The modular power supply has excellent heat dissipation effect, and the production and assembly process thereof is simplified, so that the production efficiency is improved and the quality is guaranteed.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: January 9, 2018
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Shijie Chen, Yan Deng, Zhihui Wei
  • MODULAR POWER SUPPLY AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20170034899
    Abstract: A modular power supply and a method for manufacturing the same are disclosed. The modular power supply comprises a printed circuit board, power components, and a heat sink. The power components are mounted on the printed circuit board and disposed at a side opposite to the heat sink, a lower surface of the printed circuit board is engaged with an upper surface of the heat sink which is planar, and an insulating layer is disposed between the upper surface of the heat sink and the lower surface of the printed circuit board. A method for manufacturing the modular power supply is also disclosed. The modular power supply has excellent heat dissipation effect, and the production and assembly process thereof is simplified, so that the production efficiency is improved and the quality is guaranteed.
    Type: Application
    Filed: March 1, 2016
    Publication date: February 2, 2017
    Inventors: SHIJIE CHEN, YAN DENG, ZHIHUI WEI