Abstract: A main and auxiliary alloy-based neodymium-iron-boron magnet material and the preparation method thereof. The raw material composition for the main and auxiliary alloy-based neodymium-iron-boron magnet material includes a main alloy raw material and an auxiliary alloy raw material, wherein the mass percentage of the auxiliary alloy raw material in the raw material composition for the main and auxiliary alloy-based neodymium-iron-boron magnet material is 1.0-15.0 mass %. For the main and auxiliary alloy-based neodymium-iron-boron magnet material prepared by using the raw material composition, the coercivity is increased while high remanence is ensured, and the preparation method therefor can be suitable for engineering applications.

Abstract: The present disclosure provides a method for communal facilities management in a smart city based on an Internet of Things.

Abstract: Disclosed is a carbon-dioxide-responsive self-thickening intelligent fluid based on supramolecular self-assembly, which comprises a Gemini surfactant, a single-chain amide molecule having a tertiary amine head group and water, wherein the Gemini surfactant and the single-chain amide molecule are self-assembled to form a vesicle structure dispersed in water, with a hydrophilic head group being located outside and a hydrophobic tail group located inside. The method for preparing the carbon-dioxide-responsive self-thickening intelligent fluid of the present invention is simple, the injection viscosity is low, and the fluid is converted into a gel when encountering carbon dioxide, so that the viscosity is greatly increased.

Abstract: A modular power supply and a method for manufacturing the same are disclosed. The modular power supply comprises a printed circuit board, power components, and a heat sink. The power components are mounted on the printed circuit board and disposed at a side opposite to the heat sink, a lower surface of the printed circuit board is engaged with an upper surface of the heat sink which is planar, and an insulating layer is disposed between the upper surface of the heat sink and the lower surface of the printed circuit board. A method for manufacturing the modular power supply is also disclosed. The modular power supply has excellent heat dissipation effect, and the production and assembly process thereof is simplified, so that the production efficiency is improved and the quality is guaranteed.

Abstract: A modular power supply and a method for manufacturing the same are disclosed. The modular power supply comprises a printed circuit board, power components, and a heat sink. The power components are mounted on the printed circuit board and disposed at a side opposite to the heat sink, a lower surface of the printed circuit board is engaged with an upper surface of the heat sink which is planar, and an insulating layer is disposed between the upper surface of the heat sink and the lower surface of the printed circuit board. A method for manufacturing the modular power supply is also disclosed. The modular power supply has excellent heat dissipation effect, and the production and assembly process thereof is simplified, so that the production efficiency is improved and the quality is guaranteed.