Abstract: Embodiments in the present disclosure provide a flexible circuit board and a display device. The flexible circuit board includes a base material, a plurality of binding pins, and a protective layer. The plurality of binding pins are located on the base material, extend in a first direction, and are arranged in a second direction; the protective layer is located on the side of the binding pins facing away from the base material, and includes a plurality of first openings and second openings for exposing the plurality of binding pins, the size of the first openings being greater than that of the second openings; and one binding pin corresponds to one first opening and at least one second opening, and the second opening is located on at least one side of the first opening in the first direction.

Abstract: Disclosed are a display module and a method for manufacturing the same, and a display device. The display module includes: a display panel, a heat dissipation layer, a heat conduction assembly, and a driving chip, wherein the display panel includes a first part and a second part opposite to each other, and a bending part connecting the first part and the second part; the heat dissipation layer is disposed on a side, proximal to the second part, of the first part; the heat conduction assembly is disposed between the heat dissipation layer and the second part; an area of an orthographic projection of the heat conduction assembly on the first part is smaller than an area of an orthographic projection of the heat dissipation layer on the first part; and the driving chip is disposed on a side, distal from the heat conduction assembly, of the second part distal.

Abstract: Disclosed are a display module and a method for manufacturing the same, and a display device. The display module includes: a display panel, a heat dissipation layer, a heat conduction assembly, and a driving chip, wherein the display panel includes a first part and a second part opposite to each other, and a bending part connecting the first part and the second part; the heat dissipation layer is disposed on a side, proximal to the second part, of the first part; the heat conduction assembly is disposed between the heat dissipation layer and the second part; an area of an orthographic projection of the heat conduction assembly on the first part is smaller than an area of an orthographic projection of the heat dissipation layer on the first part; and the driving chip is disposed on a side, distal from the heat conduction assembly, of the second part distal.

Abstract: The present invention provides a display module and a fixing method therefor, and a display apparatus. The display module is provided with a light-shielding structure including a light-shielding part and a supporting part that are integrally formed, wherein the light-shielding part is arranged around the inner wall of a through hole; the supporting part is fixed to a side of a display panel away from a cover plate; and an orthographic projection of the light-shielding part on the cover plate and an orthographic projection of a light-shielding layer on the cover plate at least partially overlap, such that a transition area is surrounded by the light-shielding layer and the light-shielding part in a through hole area.

Abstract: Disclosed are a display module and a method for manufacturing the same, and a display device. The display module includes: a display panel, a heat dissipation layer, a heat conduction assembly, and a driving chip, wherein the display panel includes a first part and a second part opposite to each other, and a bending part connecting the first part and the second part; the heat dissipation layer is disposed on a side, proximal to the second part, of the first part; the heat conduction assembly is disposed between the heat dissipation layer and the second part; an area of an orthographic projection of the heat conduction assembly on the first part is smaller than an area of an orthographic projection of the heat dissipation layer on the first part; and the driving chip is disposed on a side, distal from the heat conduction assembly, of the second part distal.