Patents by Inventor Zhi-Hui Yang

Zhi-Hui Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure
    Patent number: 8421213
    Abstract: A package structure includes a first carrier board provided with a through hole, at least a filling hole in communication with the through hole, a semiconductor chip received in the through hole, and a fastening member disposed in the filling hole and abutting against the semiconductor chip so as to secure the semiconductor chip in position, thereby preventing the semiconductor chip in the through hole from displacement under an external force.
    Type: Grant
    Filed: August 24, 2009
    Date of Patent: April 16, 2013
    Assignee: Unimicron Technology Corporation
    Inventors: Shin-Ping Hsu, Zhao-Chong Zeng, Zhi-Hui Yang
  • PACKAGE STRUCTURE
    Publication number: 20110042800
    Abstract: A package structure includes a first carrier board provided with a through hole, at least a filling hole in communication with the through hole, a semiconductor chip received in the through hole, and a fastening member disposed in the filling hole and abutting against the semiconductor chip so as to secure the semiconductor chip in position, thereby preventing the semiconductor chip in the through hole from displacement under an external force.
    Type: Application
    Filed: August 24, 2009
    Publication date: February 24, 2011
    Applicant: Phoenix Precision Technology Corporation
    Inventors: Shin-Ping Hsu, Zhao Chong Zeng, Zhi-Hui Yang