Patents by Inventor Zhijun LV

Zhijun LV has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210289816
    Abstract: The present invention provides an artificial diet for Orius strigicollis (O. strigicollis), a preparation method and use thereof belonging to the technical field of insect rearing wherein the artificial diet includes the following raw materials: compound amino acids, water, potassium sorbate, vitamin complex, folic acid, biotin, glucose, sodium chloride, yeast powder, sodium alginate, calcium lactate, and greenish yellow food coloring. The artificial diet of the present invention is beneficial for O. strigicollis to forage, promotes growth and development thereof, improves fecundity thereof, and increases the survival rate of O. strigicollis nymphs.
    Type: Application
    Filed: June 5, 2020
    Publication date: September 23, 2021
    Inventors: Jun HUANG, Yaobin LV, Chendi YU, Cheng QIAN, Xiaowei LI, Zhijun ZHANG, Jinming ZHANG
  • Publication number: 20210255269
    Abstract: The present disclosure provides an electronic system, an electronic device and a method for controlling the electronic device. The electronic system includes a first electronic device and at least one second electronic device, each second electronic device being associated with a target item. The first electronic device comprises: a first processing unit configured to determine an identifier of a second electronic device targeted by the first instruction input and generate a search signal specific to the second electronic device; and a first transmitting unit configured to transmit the generated search signal to the second electronic device.
    Type: Application
    Filed: February 8, 2021
    Publication date: August 19, 2021
    Inventors: Zhijun LV, Haijiao CAI, Xinpeng FENG, Ji ZHOU
  • Patent number: 11094740
    Abstract: The disclosure discloses a backboard, a display device, and a method for fabricating the same, and the backboard includes: a backboard body; and a plurality of LED installation mounts arranged in an array on the backboard body, wherein each of the plurality of LED installation mounts includes at least two lead-out electrodes to be connected with LED pins, and a coil structure around each of the at least two lead-out electrodes, wherein the coil structure is configured to produce a magnetic field upon being powered on. The coils can be formed on the backboard body in the backboard to absorb electrodes of LEDs to thereby position them precisely so as to transfer the LEDs in a mass manner with a high good yield ratio, and the lead-out electrodes can be powered on to thereby detect abnormally operating LEDs.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: August 17, 2021
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Zhijun Lv, Liwen Dong, Wenqu Liu, Xiaoxin Song, Zhao Cui, Feng Zhang, Qi Yao, Changzheng Wang
  • Patent number: 11088352
    Abstract: A display substrate, a manufacturing method thereof, and a display device are provided, in the field of display technology. The display substrate includes a base substrate, and a thin-film transistor, a light-emitting device, an encapsulation structure, and a conductive film layer sequentially disposed on the base substrate in a direction away from the base substrate. Since the display substrate includes a conductive film layer on a side of the encapsulation structure away from the base substrate, when the protective film layer on the side of the conductive film layer away from the base substrate is peeled off, static electricity generated by the separation of the film layer can be released to the conductive film layer, avoiding electron transition to the active layer of the thin-film transistor in the display substrate to cause offset of the threshold voltage of the thin-film transistor. The display brightness uniformity of the display substrate can be ensured.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: August 10, 2021
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Wenqu Liu, Feng Zhang, Qi Yao, Zhijun Lv, Liwen Dong, Shizheng Zhang, Ning Dang, Xiaoxin Song, Zhao Cui
  • Publication number: 20210233980
    Abstract: A display substrate is provided. The display substrate includes a base substrate; a pixel definition structure on the base substrate; a plurality of light emitting elements respectively in a plurality of first apertures; and a reflective layer at least partially in a respective one of the plurality of first apertures and configured to reflect light laterally emitted from a respective one of the plurality of light emitting elements to exit from a light emitting surface of the respective one of the plurality of light emitting elements. The pixel definition structure includes a first pixel definition layer on the base substrate, and a second pixel definition layer on a side of the first pixel definition layer away from the base substrate. Lateral sides of the first pixel definition layer and the second pixel definition layer have different slope angles with respect to a main surface of the base substrate.
    Type: Application
    Filed: December 16, 2019
    Publication date: July 29, 2021
    Applicant: BOE Technology Group Co., Ltd.
    Inventors: Zhijun LV, Liwen DONG, Wenqu LIU, Xiaoxin SONG, Zhao CUI, Libo WANG, Detian MENG, Feng ZHANG
  • Publication number: 20210220826
    Abstract: The present disclosure provides an electrode plate, a microfluidic chip, and a method of manufacturing the electrode plate. In one embodiment, an electrode plate includes: a substrate, an electrode and a surface contact layer stacked in sequence, and a droplet inlet hole passing through the substrate, the electrode and the surface contact layer. The surface contact layer comprises a super-hydrophobic region and a hydrophilic region, and the droplet inlet hole is disposed in the hydrophilic region. The microfluidic chip includes: a first electrode plate formed by the abovementioned electrode plate, and a second electrode plate provided on a side of the first electrode plate close to the surface contact layer. The first electrode plate is provided opposite to the second electrode plate and a liquid channel is formed between the first electrode plate and the second electrode plate.
    Type: Application
    Filed: December 6, 2019
    Publication date: July 22, 2021
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xiaoxin Song, Feng Zhang, Wenqu Liu, Zhijun Lv, Zhao Cui, Qi Yao
  • Publication number: 20210210515
    Abstract: An array substrate, a method for manufacturing the same, a display panel and a display device are disclosed. The array substrate includes: a substrate, and a planarization layer and a pixel definition layer sequentially disposed on the substrate, a protrusion is disposed on the planarization layer, the pixel definition layer is provided with an opening, and the protrusion is disposed in a region defined by the opening. The method for manufacturing the array substrate includes: forming a planarization layer on which a protrusion is disposed; forming a pixel definition layer, the pixel definition layer is provided with an opening, and the protrusion is disposed in a region defined by the opening.
    Type: Application
    Filed: January 4, 2018
    Publication date: July 8, 2021
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Feng ZHANG, Wenqu LIU, Zhijun LV, Liwen DONG, Shizheng ZHANG, Ning DANG
  • Publication number: 20210200011
    Abstract: The present application discloses display substrate having a base substrate; an insulating layer on the base substrate; and an electrode layer on a side of the insulating layer distal to the base substrate and having a plurality of electrode blocks. The insulating layer has a first side distal to the base substrate and a second side opposite to the first side and proximal to the base substrate. Each of the plurality of electrode blocks has a third side distal to the base substrate and a fourth side opposite to the third side and proximal to the base substrate. The first side of the insulating layer in the inter-electrode block region has a first height relative to a surface of the base substrate greater than a second height of the fourth side of an adjacent electrode of the plurality of electrode blocks relative to the surface of the base substrate.
    Type: Application
    Filed: February 2, 2018
    Publication date: July 1, 2021
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Feng Zhang, Zhijun Lv, Wenqu Liu, Liwen Dong, Shizheng Zhang, Ning Dang
  • Publication number: 20210200985
    Abstract: A fingerprint identification module, a manufacturing method thereof and an electronic device are disclosed.
    Type: Application
    Filed: January 17, 2020
    Publication date: July 1, 2021
    Inventors: Wenqu LIU, Xiufeng LI, Qi YAO, Feng ZHANG, Liwen DONG, Zhao CUI, Chuanxiang XU, Detian MENG, Xiaoxin SONG, Libo WANG, Yang YUE, Dongfei HOU, Zhijun LV
  • Publication number: 20210202648
    Abstract: The present application discloses an array substrate having a plurality of first thin film transistors and a plurality of second thin film transistors. Each of the plurality of first thin film transistors includes a silicon active layer. The array substrate includes a base substrate; a silicon layer having a plurality of silicon active layers respectively for the plurality of first thin film transistors; and a UV absorption layer on a side of the silicon layer distal to the base substrate, and including a plurality of UV absorption blocks. Each of the plurality of UV absorption blocks is on a side of the one of the plurality of silicon active layers distal to the base substrate, and is insulated from the one of the plurality of silicon active layers.
    Type: Application
    Filed: December 11, 2017
    Publication date: July 1, 2021
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Feng Zhang, Zhijun Lv, Wenqu Liu, Liwen Dong, Shizheng Zhang, Ning Dang, Zhiyong Liu
  • Publication number: 20210167274
    Abstract: A piezoelectric device includes: a base having at least one hole, a heat conductive portion disposed in the at least one hole and in contact with a wall of the at least one hole, and at least one piezoelectric sensor disposed on the base. A thermal conductivity of the heat conductive portion is greater than a thermal conductivity of the base. Each piezoelectric sensor includes: a first electrode, a piezoelectric pattern made of a piezoelectric material and a second electrode that are sequentially stacked in a thickness direction of the base.
    Type: Application
    Filed: September 30, 2020
    Publication date: June 3, 2021
    Inventors: Feng ZHANG, Wenqu LIU, Zhijun LV, Liwen DONG, Xiaoxin SONG, Zhao CUI, Detian MENG, Libo WANG
  • Patent number: 10985225
    Abstract: The present disclosure provides a method for manufacturing an OLED display substrate, including a step of forming a pattern of a pixel definition layer on a substrate through a patterning process. A bottom wall of the pixel definition layer is formed on the substrate, a top wall of the pixel definition layer is arranged parallel to the bottom wall, and a side wall of the pixel definition layer is angled relative to the top wall at an acute angle.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: April 20, 2021
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Feng Zhang, Wenqu Liu, Zhijun Lv, Liwen Dong, Shizheng Zhang, Ning Dang
  • Patent number: 10985228
    Abstract: Embodiments of the present disclosure provide a flexible display panel, a method of manufacturing the flexible display panel, and a flexible display apparatus. The flexible display panel comprises: a reinforced insulating layer of an inorganic material, wherein the reinforced insulating layer comprises a reinforced region, and is formed with a reinforcing hole in the reinforced region; an organic material filled in the reinforcing hole; and at least one insulating film which is disposed on at least one of both sides of the reinforced insulating layer and which is in contact with the reinforced insulating layer at least in the reinforced region.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: April 20, 2021
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Feng Zhang, Wenqu Liu, Zhijun Lv, Liwen Dong, Shizheng Zhang, Ning Dang
  • Publication number: 20210110761
    Abstract: A driving backplane includes a base, and a pixel driving circuit, a first electrode and a first piezoelectric block that are disposed in the sub-pixel region. The pixel driving circuit is disposed on the base. The first electrode is disposed at a side of the pixel driving circuit away from the base. The first electrode includes a first sub-electrode pattern and a second sub-electrode pattern that are in a same layer and are spaced apart to be insulated from each other, and the first sub-electrode pattern is electrically connected to the pixel driving circuit. The first piezoelectric block is disposed between the pixel driving circuit and the first electrode, and the first sub-electrode pattern and the second sub-electrode pattern are in contact with the first piezoelectric block.
    Type: Application
    Filed: October 14, 2020
    Publication date: April 15, 2021
    Inventors: Wenqu LIU, Qi YAO, Feng ZHANG, Zhijun LV, Liwen DONG, Zhao CUI, Xiaoxin SONG, Detian MENG, Libo WANG
  • Publication number: 20210091281
    Abstract: A detection substrate, a preparation method thereof, a detection device and a detection method are provided. A detection substrate includes a base substrate, wherein the base substrate includes multiple through holes, and electrode columns are embedded in the multiple through holes; the base substrate comprises a detection region and a bonding pad region, the detection region includes a driving circuit, and the bonding pad region is provided with bonding pads; and the bonding pads are connected with the electrode columns through the driving circuit.
    Type: Application
    Filed: July 9, 2020
    Publication date: March 25, 2021
    Inventors: Zhijun LV, Liwen DONG, Xiaoxin SONG, Feng ZHANG, Zhao CUI, Wenqu LIU, Detian MENG, Libo WANG
  • Publication number: 20210089739
    Abstract: Embodiments of the present disclosure provide a method for manufacturing a fingerprint recognition method, a fingerprint recognition module, and a display device. The method for manufacturing the fingerprint recognition module includes: providing a backplane; forming a bonding terminal in a bonding area of the backplane; forming a sensing electrode in a fingerprint recognition area of the backplane; forming an insulation layer cladding the bonding terminal in the bonding area, and forming a piezoelectric material layer in the fingerprint recognition area, where an orthographic projection of the piezoelectric material layer on the backplane coincides with an orthographic projection of the sensing electrode on the backplane; performing polarization processing on the piezoelectric material layer; and peeling off the insulation layer.
    Type: Application
    Filed: March 21, 2020
    Publication date: March 25, 2021
    Inventors: Wenqu LIU, Qi Yao, Feng Zhang, Zhijun Lv, Liwen Dong, Xiaoxin Song, Zhao Cui, Detian Meng, Libo Wang, Mingqi Chen, Changzheng Wang
  • Publication number: 20210074689
    Abstract: Disclosed are a transfer carrier and a manufacturing method thereof, and a method for transferring a light-emitting diode chip. The transfer carrier includes: a substrate having a plurality of via holes penetrating a thickness of the substrate, the substrate having a first surface and second surface which are opposite to each other; and thermoplastic structures filling corresponding ones of the via holes, one end of the thermoplastic structures protruding from the second surface of the substrate, and the other end covering a surrounding area on the first surface, of the corresponding via holes.
    Type: Application
    Filed: August 4, 2020
    Publication date: March 11, 2021
    Inventors: Hsuanwei MAI, Zhanfeng Cao, Ke Wang, Haixu Li, Zhiwei Liang, Zhijun Lv
  • Patent number: 10930518
    Abstract: The present disclosure provides an OLED substrate and a manufacturing method thereof, a display device and a manufacturing method thereof, and belongs to the technical field of display technology. A manufacturing method for an OLED substrate of the present disclosure includes: forming, by a patterning process, a pattern including first electrodes of OLED devices and a pixel defining layer provided above the first electrodes above the base substrate, wherein the pixel defining layer includes a plurality of pixel partition walls spaced apart from each other, each of the pixel partition walls defines one of the first electrodes.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: February 23, 2021
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Feng Zhang, Zhijun Lv, Wenqu Liu, Liwen Dong, Shizheng Zhang, Ning Dang
  • Publication number: 20210033761
    Abstract: A filter structure and a method for manufacturing the same, and a display device. The filter structure includes a base substrate and a plurality of filter units positioned on the base substrate, at least part of the filter units including a quantum dot filter layer. The filter units further include a reflective structure whose orthographic projection on the base substrate surrounds the orthographic projection of the quantum dot filter layer on the base substrate. A distance between a plane of the reflective structure away from the base substrate and the base substrate is greater than a distance between a plane of the quantum dot filter layer close to the base substrate and the base substrate.
    Type: Application
    Filed: December 13, 2019
    Publication date: February 4, 2021
    Inventors: Xiaoxin SONG, Feng ZHANG, Wenqu LIU, Zhijun LV, Liwen DONG, Zhao CUI, Qi YAO
  • Publication number: 20200335575
    Abstract: Disclosed are an array substrate, and a display device, and a method for manufacturing the same. The array substrate includes: a base substrate, and a thin film transistor, a planarization pattern, a bonding pattern, and a conductive structure that are disposed on the base substrate. The thin film transistor, the planarization pattern, and the bonding pattern are laminated in a direction going distally from the base substrate. The planarization pattern is provided with a via and a groove, the conductive structure is disposed in the via, wherein the bonding pattern is conductive and is electrically connected to the thin film transistor by the conductive structure, an orthographic projection of the bonding pattern on the base substrate falls outside an orthographic projection of the groove on the base substrate, and the groove is configured to accommodate an adhesive.
    Type: Application
    Filed: February 25, 2020
    Publication date: October 22, 2020
    Inventors: Xue Dong, Guangcai Yuan, Haixu Li, Zhanfeng Cao, Ke Wang, Zhijun Lv, Fei Wang, Huijuan Wang, Zhiwei Liang, Xinhong Lu