Abstract: A high-speed additive manufacturing apparatus includes a main body, a sintering module, a product carrying member, a raw material carrying member, and a raw material wiper. The main body includes a printing tank and a raw material tank adjacent to the printing tank. The sintering module is arranged on the main body. The sintering module includes a plurality of sintering light source assemblies. Each of the sintered light source assemblies has a light beam emitting end. The light beam emitting end emits a sintering light beam. The light beam emitting ends of the sintering light source assemblies are arranged in a plurality of rows. Each light beam emitting end in one row is unaligned with the light beam emitting end in adjacent rows along a direction in which the light beam emitting end moves.

Abstract: A vapor reduction device for a semiconductor wafer has a plurality of heat plates which are spaced arranged longitudinally for receiving a plurality of wafers, the heat plates are integrated into a heating frame which is further placed into a casing. The movements of the heat plates within the casing causes that the wafers can be heated rapidly and uniformly so as to evaporated vapor effectively. The heat plates are separable from the heating frame and thus a number of the heat plates is selectable as desired. The heating temperature for the heat plates is controllable independently so that the temperatures of the wafers are controllable so that the temperature differences of the wafers are controllable to be uniformly distributed.

Abstract: A plasma etching reaction chamber includes a casing having a receiving chamber; a base liftably installed below the receiving chamber; a first electrode and a second electrode; and a radio frequency electrode rod. The second electrode has a plurality of water channels and a bottom of the second electrode is installed with two cooling water tubes which are communicated with the plurality of water channels; upper sides of the two cooling water tubes are hidden within the driving rod and lower sides thereof extend downwards to be out of the casing so that external cooling water can flow into the cooling water tubes and then to the water channels to achieve the object of cooling.