Abstract: A display substrate, a method for fabricating the same, and a display apparatus are disclosed. The display substrate is provided with functional films, at least one of the functional films includes a protrusion array on a side away from the display substrate. When the display substrate is assembled with another display substrate, protrusion portions of the protrusion array are embedded into a frame sealant between the display substrate and the another display substrate.

Abstract: The present disclosure provides a packaging method, a display panel, and a display device. The packaging method includes forming a glass adhesive on a packaging area of an OLED array substrate or on a packaging cover plate, aligning the packaging cover plate with the OLED array substrate, and applying, from a side of the packaging cover plate facing away from the OLED array substrate a laser to the glass adhesive, to sinter the glass adhesive, wherein the packaging method further includes forming a barrier layer on the packaging cover plate, the barrier layer being configured to block the laser from irradiating an OLED device on the OLED array substrate when the laser irradiates the glass adhesive.

Abstract: The present invention discloses a method and a system of flattening a surface formed by sealant of a packaging cover plate, as well as a packaging method, the method includes vibrating a high temperature sintered packaging cover plate by using a high frequency vibrator with a preset frequency, and irradiating the surface formed by sealant of the packaging cover plate by using a laser with preset power, so that a convex portion formed by the sealant is melted and flows to a concave portion formed by the sealant under vibration of the high frequency vibrator, thereby flattening the surface formed by sealant of the packaging cover plate.

Abstract: The present disclosure provides a packaging method, a display panel, and a display device. The packaging method includes forming a glass adhesive on a packaging area of an OLED array substrate or on a packaging cover plate, aligning the packaging cover plate with the OLED array substrate, and applying, from a side of the packaging cover plate facing away from the OLED array substrate a laser to the glass adhesive, to sinter the glass adhesive, wherein the packaging method further includes forming a barrier layer on the packaging cover plate, the barrier layer being configured to block the laser from irradiating an OLED device on the OLED array substrate when the laser irradiates the glass adhesive.

Abstract: The present disclosure provides an organic light-emitting diode (OLED) display device, a manufacturing method thereof, and a display apparatus containing the OLED display device. A pattern of an anode layer is formed over a base substrate. A graphene oxide layer is formed over the pattern of the anode layer by an electroplating process. The graphene oxide layer is used as an auxiliary layer or is used as at least one of a hole injection layer and a hole transport layer in the OLED display device. Since the graphene oxide material has high work function, the hole injection barrier may be reduced and to the hole injection and hole transport capability of the OLED display device may be enhanced to improve light emitting performance of the OLED display device.

Abstract: The present disclosure provides a packaging method, a display panel, and a display device. The packaging method includes forming a glass adhesive on a packaging area of an OLED array substrate or on a packaging cover plate, aligning the packaging cover plate with the OLED array substrate, and applying, from a side of the packaging cover plate facing away from the OLED array substrate a laser to the glass adhesive, to sinter the glass adhesive, wherein the packaging method further includes forming a barrier layer on the packaging cover plate, the barrier layer being configured to block the laser from irradiating an OLED device on the OLED array substrate when the laser irradiates the glass adhesive.

Abstract: The present invention provides a packaging method for an electronic device, which includes a step of forming a packaging substrate, the step of the forming a packaging substrate includes: forming, on a base substrate, a defining pattern which comprises a groove for defining position of frit; providing colloidal frit in the groove; presintering the colloidal frit to obtain preliminarily cured frit; polishing upper surfaces of the defining pattern and the preliminarily cured frit; and removing the defining pattern, and completely curing the preliminarily cured frit, so as to form solid frit on the base substrate. The present invention also provides a packaging system. By using the packaging method provided by the present invention, a better packaging effect can be achieved.

Abstract: A packaging method comprising forming a frit on a first substrate, affixing a second substrate to the first substrate in position, and irradiating the frit by laser beam so as to melt the frit. The packaging method further comprises performing an ultrasonic treatment on the frit by means of ultrasonic wave when the frit being melted. A display panel packaged by the packaging method and a display device having the display panel are disclosed. Further, a packaging device for performing the packaging method is also disclosed.

Abstract: The present invention provides a packaging method for an electronic device, which includes a step of forming a packaging substrate, the step of the forming a packaging substrate includes: forming, on a base substrate, a defining pattern which comprises a groove for defining position of frit; providing colloidal frit in the groove; presintering the colloidal frit to obtain preliminarily cured frit; polishing upper surfaces of the defining pattern and the preliminarily cured frit; and removing the defining pattern, and completely curing the preliminarily cured frit, so as to form solid frit on the base substrate. The present invention also provides a packaging system. By using the packaging method provided by the present invention, a better packaging effect can be achieved.

Abstract: The present disclosure provides a method for coating a packaging material, an OLED display panel and its manufacturing method, and a display device. The method for coating the packaging material includes steps of providing a base substrate in a chamber of a magnetron sputtering device, and depositing the packaging material at a region of the base substrate where the packaging material is to be coated by the magnetron sputtering device.

Abstract: The present disclosure provides an organic light-emitting diode (OLED) display device, a manufacturing method thereof, and a display apparatus containing the OLED display device. A pattern of an anode layer is formed over a base substrate. A graphene oxide layer is formed over the pattern of the anode layer by an electroplating process. The graphene oxide layer is used as an auxiliary layer or is used as at least one of a hole injection layer and a hole transport layer in the OLED display device. Since the graphene oxide material has high work function, the hole injection barrier may be reduced and to the hole injection and hole transport capability of the OLED display device may be enhanced to improve light emitting performance of the OLED display device.

Abstract: An encapsulating method, a display panel and a display apparatus, the encapsulating method including: forming a frit layer in an encapsulating area of a first substrate; forming a glass network modifier oxide layer on the surface of the frit layer; a first-sintering for the frit layer and the glass network modifier oxide layer; and aligning and attaching the first substrate and a second substrate, and forming an encapsulating structure through irradiating the encapsulating area by a laser. The encapsulating method can improve the liquidity of the surface of the frit layer and make the surface of the frit planarization after sintering at high temperature, so that the production of the holes of the surface of the frit layer can be reduced in the process of being encapsulated by a laser, and then the effect of encapsulating is improved.

Abstract: The present invention discloses a method and a system of flattening a surface formed by sealant of a packaging cover plate, as well as a packaging method, the method includes vibrating a high temperature sintered packaging cover plate by using a high frequency vibrator with a preset frequency, and irradiating the surface formed by sealant of the packaging cover plate by using a laser with preset power, so that a convex portion formed by the sealant is melted and flows to a concave portion formed by the sealant under vibration of the high frequency vibrator, thereby flattening the surface formed by sealant of the packaging cover plate.

Abstract: The invention involves an intellectualized polarity identification device which comprises an electromagnetic module connected with a control circuit. The electromagnetic module comprises a magnetic inductor (electromagnet), a movable contact plate coaxially set with the magnetic inductor (electromagnet) and stationary contact plates. The control circuit comprises a reversed-polarity alarm protecting circuit connected with a correct-polarity conducting circuit. The reversed-polarity alarm protecting circuit comprises an alarm circuit and a protection circuit, the protection circuit comprising a diode and a photocoupler. The correct-polarity conducting circuit comprises a conduction circuit and an indicator circuit, respectively connected with the photocoupler. The intellectualized polarity identification device is electromagnetically controlled such that a closed circuit is created only when the device is connected with the correct polarity.