Abstract: A canopy tent based on a car tailgate includes a canopy, the canopy includes a connecting section and an epitaxial section, the connecting section is connected to the car tailgate, and the epitaxial section is connected to an upright pole facing away from a car; when the car tailgate is opened, corners of the connecting section are nested on corners of the car tailgate facing away from a rear of the car; the upright pole cooperates with the car tailgate to spread the canopy to form a sheltered area at the rear of the car. The canopy tent uses the car tailgate as two support points of the canopy tent, and completes the setup of the canopy tent with the help of the external upright pole, which not only reduces space occupation, but also lowers the difficulty and enhances the efficiency of setup, thereby improving the user experience.

Abstract: A car window sunshade protective cover includes an inner sleeve, an outer sleeve, an inner elastic member, and an outer elastic member. The inner sleeve includes an inner edge strip and a shielding member, and parts of edges of the shielding member are detachably connected to an inner edge of the inner edge strip. The outer sleeve includes an outer edge strip and a grille member, and the grille member is connected to an inner edge of the outer edge strip. The inner elastic member is disposed on and connected to a side edge of the inner edge strip. The outer elastic member is disposed on and connected to a side edge of the outer edge strip. the inner sleeve and the outer sleeve are configured to be sleeved onto the framed car window through the opening. The protective cover achieves un protection, mosquito-proofing, and shading.

Abstract: A power module includes a thermally conductive base plate, a connection layer, a ceramic substrate, and a chip that are sequentially stacked. A molding body wraps the ceramic substrate and the chip. The ceramic substrate includes an insulation layer and a first metal layer. The first metal layer is disposed between the insulation layer and the connection layer. A reinforcing structure is formed on a side that is of the thermally conductive base plate and that faces the ceramic substrate. The reinforcing structure is located on a side portion of the connection layer in a direction perpendicular to an arrangement direction of the thermally conductive base plate and the connection layer. A wall surface of the reinforcing structure and a surface that is of the first metal layer and that faces the thermally conductive base plate enclose a containing space. The molding body fills the containing space.

Abstract: A power module includes a first conductive plate, a second conductive plate, a third terminal, a first power transistor, and a second power transistor. A part of the first conductive plate serves as a first terminal. The second conductive plate is stacked with the first conductive plate. The third terminal is stacked with the first terminal. The first power transistor is disposed between the first conductive plate and the second conductive plate. A first electrode of the first power transistor is electrically connected to the first conductive plate, and a second electrode of the first power transistor is electrically connected to the second conductive plate. A first electrode of the second power transistor is electrically connected to the second conductive plate, and a second electrode of the second power transistor is electrically connected to the third terminal.

Abstract: A heat dissipation system and a power device. The heat dissipation system may include a power module and a condenser. The power module may include a base and a power component, the base has a first chamber, and the first chamber is filled with a refrigerant. The power component is disposed on a first surface of the base, and the power component is in thermally conductive contact with the first surface. Heat generated by the power component may be transferred from the first surface to the first chamber, and is further conducted to the refrigerant, and the refrigerant may be heated and vaporized into vapor. In addition, the condenser communicates with the first chamber, and the vaporized refrigerant may enter the condenser. The refrigerant condensed into a liquid state by the condenser may flow back to the first chamber.

Abstract: A heat dissipation system may include a power module, an evaporator, and a condenser. The power module includes a thermally conductive substrate and a power component, and the power component is fastened to a first surface of the thermally conductive substrate. The evaporator has an evaporation chamber, and the evaporation chamber is filled with a refrigerant. At least one sidewall of the evaporator is provided with a window, the thermally conductive substrate is embedded into the window, at least a part of surfaces of the thermally conductive substrate is immersed in the refrigerant, and the first surface is located on an outer side of the evaporation chamber. The condenser communicates with the evaporation chamber, and the vaporized refrigerant may enter the condenser. The refrigerant condensed into a liquid state by the condenser may flow back to the evaporation chamber.

Abstract: A cover plate may include a plate body and a gasket. The plate body includes a first face and a second face that are disposed back from each other, and the plate body is provided with a first hole. The gasket includes a body part, and the body part is provided with a second hole, and in a direction from the first face to the second face, the first hole penetrates through the plate body, and the second hole penetrates through the body part. When the cover plate is applied to the power module, each pin of the power module may pass through one second hole and be inserted into one first hole in a one-to-one correspondence, and the pin is in interference fit with the corresponding first hole. In this way, the plate body may limit each pin, thereby improving a position degree of the pin.

Abstract: Logo candidates for a specific ISO data can be identified from external resources based on the enriched merchant data. Low quality images of the logo candidates are filtered out with image analysis including entropy ratio evaluations of the logo candidates. Also, the logo candidates are processed with high quality filtering including classification of the logo candidates with a deep learning classifier for distinguishing logos from non-logos. A logo from the logo candidates is selected to associate with the ISO data packets. A display having the selected logo associated with a transaction of the ISO data packets can be generated for display to users.

Abstract: A vehicle curtain capable of being used in double-layer includes an outer mesh cloth, an interlayer plain cloth, and an inner covering plain cloth. The outer mesh cloth and the inner covering plain cloth are respectively arranged on an outer side and an inner side of the interlayer plain cloth, and an edge of the outer mesh cloth is disposed with several mounting connection blocks. The interlayer plain cloth includes an upper interlayer plain cloth and a lower interlayer plain cloth, the upper interlayer plain cloth is sewn and connected to the outer mesh cloth, and the lower interlayer plain cloth and the upper interlayer plain cloth are movably connected. By using a double-layer structure, a user can open and close the lower interlayer plain cloth through a guide rail or a zipper to realize semi shading and full shading functions of a vehicle window thereby greatly improving user's experience.

Abstract: Logo candidates for a specific ISO data can be identified from external resources based on the enriched merchant data. Low quality images of the logo candidates are filtered out with image analysis including entropy ratio evaluations of the logo candidates. Also, the logo candidates are processed with high quality filtering including classification of the logo candidates with a deep learning classifier for distinguishing logos from non-logos. A logo from the logo candidates is selected to associate with the ISO data packets. A display having the selected logo associated with a transaction of the ISO data packets can be generated for display to users.

Abstract: Implementations of semiconductor clips may include a die attach portion coupled to a step portion, a lead attach portion directly coupled to the step portion, a first alignment feature directly coupled to a first side of the lead attach portion, and a second alignment feature directly coupled to a second side of the lead attach portion. The second side may be opposite the first side. The lead attach portion may be in a plane substantially parallel with a plane formed by the die attach portion.

Abstract: The disclosure provides a multi-level occupant movement simulation method and apparatus. The method includes: establishing a multi-level architectural topology according to a structure of a building; obtaining a schedule of multiple occupants in a simulation experiment; obtaining a time period of stay of each occupant of the multiple occupants according to the schedule, and simulating, according to a preset simulation algorithm, the state transition position of each occupant in the multi-level architectural topology during the time period of stay; and calculating an operating energy consumption parameter of the building according to the state transition position.

Abstract: A method for directly preparing an empty shell type small grain ZSM-5 molecular sieve. The method comprises: uniformly mixing and stirring an organic template agent, a silicon source and water; dripping an aqueous solution of an aluminum source into the mixture; preserving room temperature, and continuously stirring for a period of time; and performing hydrothermal crystallization, and washing, drying and roasting the obtained product to obtain the molecular sieve. The molecular sieve has high degree of crystallinity and uniform particle size. Moreover, the method requires short time, simple operation and only one step, no extra surfactant is needed, and secondary acid and alkali treatment is not needed.

Abstract: A rapid synthesis method of a small-crystal-grain ZSM-5 molecular sieve, the method comprising: preparing a mixed silicon-aluminum glue solution, placing the solution in a crystallization kettle for low-temperature nucleation, enabling high-temperature crystallization growth of the solution, and obtaining a crystallization product, namely, a small-crystal-grain ZSM-5 molecular sieve, the nucleation temperature being 60-120° C., nucleation time being 1-3 hours, a crystallization growth temperature being 150-170° C., and crystallization growth time being 1-3 hours. The method is easy to operate, and has a short operation time, thus being able to complete within 6 hours; in addition, the product has uniform grain sizes, is in a mono-dispersed state, and has a high crystallization degree to a submicron degree.

Abstract: A rapid synthesis method of a small-crystal-grain ZSM-5 molecular sieve, the method comprising: preparing a mixed silicon-aluminum glue solution, placing the solution in a crystallization kettle for low-temperature nucleation, enabling high-temperature crystallization growth of the solution, and obtaining a crystallization product, namely, a small-crystal-grain ZSM-5 molecular sieve, the nucleation temperature being 60-120° C., nucleation time being 1-3 hours, a crystallization growth temperature being 150-170° C., and crystallization growth time being 1-3 hours. The method is easy to operate, and has a short operation time, thus being able to complete within 6 hours; in addition, the product has uniform grain sizes, is in a mono-dispersed state, and has a high crystallization degree to a submicron degree.

Abstract: A method for directly preparing an empty shell type small grain ZSM-5 molecular sieve. The method comprises: uniformly mixing and stirring an organic template agent, a silicon source and water; dripping an aqueous solution of an aluminum source into the mixture; preserving room temperature, and continuously stirring for a period of time; and performing hydrothermal crystallization, and washing, drying and roasting the obtained product to obtain the Molecular sieve. The molecular sieve has high degree of crystallinity and uniform particle size. Moreover, the method requires short time, simple operation and only one step, no extra surfactant is needed, and secondary acid and alkali treatment is not needed.

Abstract: The present invention provides a bootstrap driving circuit without extra power supply, which circuit includes a power unit, a switching unit, a bootstrap unit, a drive unit; the power unit is used to output a direct voltage; the switching unit is connected with the power unit, to control the turn-on or turn-off with the power unit; the bootstrap unit is connected with the switching unit, to supply drive electric energy and output drive power; the bootstrap unit includes an energy storage capacitor; the drive unit is connected with the bootstrap unit, to output control signal under the drive of the drive power. The bootstrap driving process is completed via the charging-discharging of the energy storage capacitor in the bootstrap unit of the invention and without an extra power supply, which forms the bootstrap driving circuit without extra power supply, further overcomes the requirement of an extra power supply for a common driving circuit, reduces the power consumption and meets the demand of the circuit.

Abstract: The present invention provides a bootstrap driving circuit without extra power supply, which circuit includes a power unit, a switching unit, a bootstrap unit, a drive unit; the power unit is used to output a direct voltage; the switching unit is connected with the power unit, to control the turn-on or turn-off with the power unit; the bootstrap unit is connected with the switching unit, to supply drive electric energy and output drive power; the bootstrap unit includes an energy storage capacitor; the drive unit is connected with the bootstrap unit, to output control signal under the drive of the drive power. The bootstrap driving process is completed via the charging-discharging of the energy storage capacitor in the bootstrap unit of the invention and without an extra power supply, which forms the bootstrap driving circuit without extra power supply, further overcomes the requirement of an extra power supply for a common driving circuit, reduces the power consumption and meets the demand of the circuit.