Abstract: A resin composition includes a vinyl-containing polyphenylene ether resin and a multifunctional vinylsilane. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board and achieve improvement in at least one of the properties including prepreg or laminate surface appearance, glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance after moisture absorption, thermal resistance, dielectric constant, dissipation factor and inner resin flow.

Abstract: A resin composition includes a maleimide resin and a multifunctional vinylsilane. Also provided is an article made from the resin composition including such as a prepreg, a resin film, a laminate or a printed circuit board, wherein the article has improved one or more properties including glass transition temperature, difference in glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance, dissipation factor and dissipation factor after ageing at high temperature.

Abstract: A resin composition includes a vinyl-containing polyphenylene ether resin and a multifunctional vinylsilane. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board and achieve improvement in at least one of the properties including prepreg or laminate surface appearance, glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance after moisture absorption, thermal resistance, dielectric constant, dissipation factor and inner resin flow.

Abstract: Disclosed is a phosphorus-containing compound capable of serving as a flame retardant to be used in conjunction with other ingredients to make resin compositions, useful for fabricating such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, having improved one or more properties including glass transition temperature, coefficient of thermal expansion, thermal resistance, flame retardancy, dielectric constant, and dissipation factor. In addition, a method of preparing the phosphorus-containing compound and a resin composition comprising the phosphorus-containing compound are also disclosed.

Abstract: A quaternary lactam compound of formula (I). The compound is used in the manufacture of a medicament for the treatment and/or prevention of thrombotic or thromboembolic disorders.

Abstract: A phosphorus-containing flame retardant, a preparation method thereof, a resin composition comprising the phosphorus-containing flame retardant and an article made therefrom are disclosed. The phosphorus-containing flame retardant is characterized by having the advantages of high phosphorus content, high resin compatibility, not increasing gel time of varnish and low water absorption rate, and is therefore suitable for use as a flame retardant of various resin materials.

Abstract: A compound having a structure represented by the following Formula (I), where Q1 and Q2 individually represent a functional group containing a C?C unsaturated bond and J1 and J2 individually represent a flame retardant group containing a phosphorus atom, useful in a resin composition for fabricating articles such as a prepreg, a resin film, a laminate or a printed circuit board, such that the articles have improved one or more properties including glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance, dielectric constant, dissipation factor and flame retardancy.

Abstract: Disclosed is a resin composition, which comprises 30 parts by weight to 90 parts by weight of a maleimide resin and 15 parts by weight to 60 parts by weight of a benzoxazine resin. The resin composition may be fabricated into various articles, such as prepregs, prepregs with copper foil, resin films, resin films with copper foil, laminates or printed circuit boards, which possess at least one, more or all of the following properties: high peel strength, high thermal resistance after moisture absorption, high glass transition temperature, low thermal expansion, high thermal resistance, low dielectric constant, low dissipation factor and so on.

Abstract: The present disclosure pertains to the technical field of resin composite materials and more particularly relates to resin compositions and articles made therefrom, including a resin film, a prepreg, a laminate or a printed circuit board, wherein the resin composition comprises a phosphorus-containing flame retardant of Formula (I) and a prepolymerized resin prepared at least from a divinylbenzene compound, an allyl resin and an acrylate resin. The resin compositions may be further used to make a resin film, a prepreg, a laminate or a printed circuit board, which has the properties of absence of branch-like pattern on laminate surface, high glass transition temperature, low ratio of thermal expansion, and high copper foil peeling strength.

Abstract: Disclosed is a compound useful in a resin composition for fabricating articles such as a prepreg, a resin film, a laminate or a printed circuit board, such that the articles have improved one or more properties including glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance, dielectric constant, dissipation factor and flame retardancy.

Abstract: A resin composition comprises 100 parts by weight of epoxy resin; 2 to 50 parts by weight of carboxyl-containing butadiene acrylonitrile resin; 1 to 40 parts by weight of phosphazene; and 1 to 8 parts by weight of acrylic triblock copolymer. The resin composition may be made into various articles, such as prepregs, laminates, printed circuit boards or rigid-flex boards, and meets one, more or all of the following properties: high yield rate in solder pad fall-off test at high temperature, low dust weight loss, low stickiness, high thermal resistance, high peel strength to copper foil, and high bonding strength to polyimide layer.

Abstract: A resin composition comprises 100 parts by weight of epoxy resin; 2 to 50 parts by weight of carboxyl-containing butadiene acrylonitrile resin; 1 to 40 parts by weight of phosphazene; and 1 to 8 parts by weight of acrylic triblock copolymer. The resin composition may be made into various articles, such as prepregs, laminates, printed circuit boards or rigid-flex boards, and meets one, more or all of the following properties: high yield rate in solder pad fall-off test at high temperature, low dust weight loss, low stickiness, high thermal resistance, high peel strength to copper foil, and high bonding strength to polyimide layer.

Abstract: A phosphorus-containing flame retardant, a preparation method thereof, a resin composition comprising the phosphorus-containing flame retardant and an article made therefrom are disclosed. The phosphorus-containing flame retardant is characterized by having the advantages of high phosphorus content, high resin compatibility, not increasing gel time of varnish and low water absorption rate, and is therefore suitable for use as a flame retardant of various resin materials.

Abstract: Disclosed is an assembly comprising an insulation material and a copper foil disposed on the insulation material, wherein the copper foil has a thickness of less than or equal to 6 ?m, and the insulation material is made from a resin composition comprising oxazolidone epoxy resin, oxydianiline type benzoxazine resin and a curing agent. The assembly achieves desirable balanced properties in peel strength, glass transition temperature, dimensional change after reflow, thermal resistance, and dielectric properties.

Abstract: Disclosed is a phosphorus-containing compound capable of serving as a flame retardant to be used in conjunction with other ingredients to make resin compositions, useful for fabricating such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, having improved one or more properties including glass transition temperature, coefficient of thermal expansion, thermal resistance, flame retardancy, dielectric constant, and dissipation factor. In addition, a method of preparing the phosphorus-containing compound and a resin composition comprising the phosphorus-containing compound are also disclosed.

Abstract: Disclosed is a resin composition, which comprises 30 parts by weight to 90 parts by weight of a maleimide resin and 15 parts by weight to 60 parts by weight of a benzoxazine resin. The resin composition may be fabricated into various articles, such as prepregs, prepregs with copper foil, resin films, resin films with copper foil, laminates or printed circuit boards, which possess at least one, more or all of the following properties: high peel strength, high thermal resistance after moisture absorption, high glass transition temperature, low thermal expansion, high thermal resistance, low dielectric constant, low dissipation factor and so on.

Abstract: Disclosed is an assembly comprising an insulation material and a copper foil disposed on the insulation material, wherein the copper foil has a thickness of less than or equal to 6 ?m, and the insulation material is made from a resin composition comprising oxazolidone epoxy resin, oxydianiline type benzoxazine resin and a curing agent. The assembly achieves desirable balanced properties in peel strength, glass transition temperature, dimensional change after reflow, thermal resistance, and dielectric properties.

Abstract: Provided is a resin composition, comprising epoxy resin, oxydianiline type benzoxazine resin, styrene-maleic anhydride resin and tetra-phenol resin. The resin composition may be baked for producing products such as prepregs, resin films, resin-coated coppers, laminates and printed circuit boards, which satisfy one or more or all of desirable properties such as higher dimensional stability after a reflow process, better thermal resistance after horizontal black oxide process, low dielectric constant, low dissipation factor, high thermal resistance and flame retardancy.

Abstract: Provided is a resin composition, comprising epoxy resin, oxydianiline type benzoxazine resin, styrene-maleic anhydride resin and tetra-phenol resin. The resin composition may be baked for producing products such as prepregs, resin films, resin-coated coppers, laminates and printed circuit boards, which satisfy one or more or all of desirable properties such as higher dimensional stability after a reflow process, better thermal resistance after horizontal black oxide process, low dielectric constant, low dissipation factor, high thermal resistance and flame retardancy.

Abstract: The present invention belongs to the technical field of a resin having low dielectric properties, and presents a vinylbenzyl-etherified-DOPO compound resin composition and a preparation method and application thereof. The composition includes a vinylbenzyl-etherified-DOPO compound resin and a vinyl-terminated polyphenylene ether resin. The DOPO resin is vinylbenzyl etherified in the present invention, thus obtaining a vinylbenzyl-etherified-DOPO compound resin having low dielectric properties, and there are no hydroxyl group on itself, no hydroxyl function group will be generated during the cross-linking reaction; and the vinylbenzyl-etherified-DOPO compound resin contains phosphorus atoms, and has flame retardancy.