Patents by Inventor Zhimin CHAI

Zhimin CHAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230145232
    Abstract: Interfacial convective assembly can assemble any type of nanoparticles or other nanoelements in minutes to form microscale and nanoscale patterns in vias or trenches in patterned substrates. The nanoelements can be assembled on both hydrophilic and hydrophobic surfaces. Nanoparticles can fuse during the process to provide solid or single crystalline electrical circuit components.
    Type: Application
    Filed: April 12, 2021
    Publication date: May 11, 2023
    Inventors: Zhimin CHAI, Adnan KORKMAZ, Cihan YILMAZ, Ahmed A. BUSNAINA
  • Publication number: 20220373882
    Abstract: A scalable printing process capable of printing microscale and nanoscale features for additively manufacturing electronics is provided. This fast, directed assembly-based approach selectively prints microscale and nanoscale features on both rigid and flexible substrates. The printing speed is much faster than state-of-the-art inkjet and flexographic printing, and the resolution is two orders of magnitude higher, with minimum feature size of 100 nm. Feature patterns can be printed over large areas and require no special limitations on the assembled materials. Hydrophilic/hydrophobic patterns are used to direct deposition of nanomaterials to specific regions or to selectively assemble polymer blends to desired sites in a one-step process with high specificity and selectively. The selective deposition can be based on electrostatic forces, hydrogen bonding, or hydrophobic interactions.
    Type: Application
    Filed: October 16, 2020
    Publication date: November 24, 2022
    Inventors: Salman A. ABBASI, Zhimin CHAI, Ahmed BUSNAINA