Patents by Inventor Zhimin DOU

Zhimin DOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE STRUCTURE AND ELECTRONIC APPARATUS
    Publication number: 20230178442
    Abstract: A package structure includes a second substrate. A second component is connected to the second substrate, and at least a part of the second component is connected to the second connecting rod through the second heat dissipation block, so that heat of the at least a part of the second component can be further transferred to the second connecting rod through the second heat dissipation block, and then transferred, through the second connecting rod, to the second substrate or another structure connected to the second connecting rod. In this way, the heat of the second component is transferred out, and heat conduction paths of the second component are increased.
    Type: Application
    Filed: August 25, 2020
    Publication date: June 8, 2023
    Inventors: Zhimin DOU, Qiu CHEN, Runqing YE, Yong SHE, Fuqiang MA