Patents by Inventor Zhiping XUE

Zhiping XUE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240175056
    Abstract: Genomic insertions, duplications, and insertion/deletion (indels) account for ˜14% of human pathogenic mutations. Current gene editing methods cannot accurately or efficiently correct these abnormal genomic rearrangements, especially larger alterations (>100 bp). The presently disclosed compositions and methods accurately delete insertions/duplications and repair the deletion junction to improve the scope of gene therapies. For example, a Cas9 prime editor (PECas9) is combined with two prime editing guide RNAs (pegRNAs) targeting complementary DNA strands. PECas9 can replace an ˜1-kb genomic fragment with a desired sequence at the target site without requiring an exogenous DNA template.
    Type: Application
    Filed: March 15, 2022
    Publication date: May 30, 2024
    Inventors: Tingting Jiang, Xiao-Ou Zhang, Zhiping Weng, Wen Xue
  • Patent number: 11982650
    Abstract: A method for testing an interfacial tribochemical reaction between a diamond wafer and active metal abrasive or metal oxide abrasive is provided. A surface of a diamond indenter used in a nano scratch tester is coated with a layer of the active metal abrasive or the metal oxide abrasive with uniform and controllable thickness by magnetron sputtering, and an interface interaction between the layer of the active metal abrasive or the metal oxide abrasive and the diamond wafer is controlled by a scratch test of the diamond wafer. Chemical components of an interaction section on a surface of the diamond wafer are analyzed by the scanning probe micro Raman spectrometer.
    Type: Grant
    Filed: August 7, 2023
    Date of Patent: May 14, 2024
    Assignee: HUAQIAO UNIVERSITY
    Inventors: Xipeng Xu, Jing Lu, Qiufa Luo, Yueqin Wu, Dekui Mu, Zhiping Xue
  • Patent number: 11919192
    Abstract: The invention discloses a bamboo chip integrated material. The bamboo chip integrated material is formed by a plurality of lengthened bamboo chips which are glued and overlaid; each lengthened bamboo chip is formed by a plurality of bamboo chip units which sequentially and continuously mesh and are butted; sharp teeth and grooves are formed in the two ends in the length direction of the bamboo chip units, wherein the sharp tooth of each bamboo chip unit and the groove of the corresponding bamboo sheet unit are matched to form a meshing butt-joint part, and the meshing butt-joint parts of the adjacent lengthened bamboo chips are arranged in a staggered mode; and each bamboo chip unit has a thickness of 4-12 mm and a width of 15-50 mm.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: March 5, 2024
    Assignee: HUNAN TAOHUAJIANG BAMBOO SCIENCE & TECHNOLOGY CO., LTD.
    Inventors: Zhiping Wu, Jinbo Hu, Yanhui Xiong, Zhicheng Xue, Ting Li, Zhibin Hu, Yuankun Hu
  • Publication number: 20230384194
    Abstract: A method for testing an interfacial tribochemical reaction between a diamond wafer and active metal abrasive or metal oxide abrasive is provided. A surface of a diamond indenter used in a nano scratch tester is coated with a layer of the active metal abrasive or the metal oxide abrasive with uniform and controllable thickness by magnetron sputtering, and an interface interaction between the layer of the active metal abrasive or the metal oxide abrasive and the diamond wafer is controlled by a scratch test of the diamond wafer. Chemical components of an interaction section on a surface of the diamond wafer are analyzed by the scanning probe micro Raman spectrometer.
    Type: Application
    Filed: August 7, 2023
    Publication date: November 30, 2023
    Inventors: Xipeng XU, Jing LU, Qiufa LUO, Yueqin WU, Dekui MU, Zhiping XUE