Abstract: Provided are organometallic compounds comprising a ligand comprising at least two moieties A and B which are linked by a linking group L2, wherein the ligand is coordinated to a central metal atom M. Also provided are formulations comprising these organometallic compounds. Further provided are organic light emitting devices (OLEDs) and related consumer products that utilize these organometallic compounds.

Abstract: Disclosed is a test device and method for remote control parking, falling within the technical field of testing. The method provided by the present disclosure includes the following steps: responding to a remote control parking instruction sent by a portable terminal, and acquiring position and pose data of a vehicle in real-time; injecting function loss conditions; determining a stopping position of the vehicle according to the position and pose data if an alarm signal or a parking success signal sent by an in-vehicle infotainment system is received; and determining a test result of remote control parking according to the stopping position of the vehicle and the function loss conditions. The present disclosure is used to test the response of a vehicle parking under the function loss condition.

Abstract: Provided is a new composition of matter for phosphorescent emitters containing a chelating ligand comprised of a fused heterocyclic structure containing boron. The disclosed ligands form two bonds to the metal forming a 6-membered chelate and can be further substituted to form tridentate or tetradentate ligands.

Abstract: Provided are organometallic compounds comprising two moieties A and B which are each independently a monocyclic ring or a polycyclic fused ring structure, wherein the monocyclic ring or each ring of the polycyclic fused ring structure is independently a 5-membered to 10-membered carbocyclic or heterocyclic ring which are linked by a direct bond and which are further bridged by a linker comprising two groups which are each independently selected from the group consisting of O, S, Se, NR, BR, BRR?, PR, CR, C?O, C?NR, C?CRR?, C?S, CRR?, SO, SO2, P(O)R, SiRR?, and GeRR?. Also provided are formulations comprising these organometallic compounds. Further provided are organic light emitting devices (OLEDs) and related consumer products that utilize these organometallic compounds.

Abstract: A rotational speed sensor, a manufacturing method thereof, a driving method thereof, and an electronic device are provided. The rotational speed sensor includes liquid crystal cell, rotational speed sensing module and rotational speed determining module; rotational speed sensing module is configured to convert rotational speed into voltage signal and apply voltage signal to liquid crystal cell; and at least a part of optical signal propagation module of rotational speed determining module is located in liquid crystal cell.

Abstract: Provided is a display module, including: a shell; a display panel, wherein the display panel is disposed in the shell and is connected to the shell; a first light emitting component, wherein the first light emitting component is connected to the display panel and is configured to emit light of a target wavelength; and a fingerprint recognition sensor, wherein the fingerprint recognition sensor is disposed between the shell and the display panel and is fixedly connected to the shell; an orthographic projection of the fingerprint recognition sensor onto the display panel and an orthographic projection of the first light emitting component onto the display panel do not overlap; and the fingerprint recognition sensor is configured to recognize a fingerprint based on received light of the target wavelength reflected by an obstacle.

Abstract: This disclosure discloses a light-emitting diode chip, a method for fabricating the same, a backlight module, and a display device. The light-emitting diode chip includes: a transparent base substrate; at least one light-emitting diode located on one side of the base substrate; and a dimming structure located on a side of the base substrate away from the light-emitting diode, wherein the light-emitting diode is configured to emit light from double sides thereof; and the dimming structure is configured to adjust the intensity of light emitted from the side of the base substrate away from the light-emitting diode.

Abstract: Provided is a display module, including: a shell; a display panel, wherein the display panel is disposed in the shell and is connected to the shell; a first light emitting component, wherein the first light emitting component is connected to the display panel and is configured to emit light of a target wavelength; and a fingerprint recognition sensor, wherein the fingerprint recognition sensor is disposed between the shell and the display panel and is fixedly connected to the shell; an orthographic projection of the fingerprint recognition sensor onto the display panel and an orthographic projection of the first light emitting component onto the display panel do not overlap; and the fingerprint recognition sensor is configured to recognize a fingerprint based on received light of the target wavelength reflected by an obstacle.

Abstract: The disclosure discloses an acceleration sensor, where the acceleration sensor comprises: a housing, and a mass block in the housing and connected with the housing via at least two hanging beams, where an auxiliary buffer component is further provided between the mass block and a bottom surface of the housing, and an elastic coefficient of the auxiliary buffer component decreases as force applied thereon increases.

Abstract: A method for manufacturing a micro light-emitting diode array substrate is disclosed. The method includes: providing a drive substrate comprising a plurality of sub-pixel regions, the plurality of sub-pixel regions being configured for bearing micro light-emitting diodes of different colors, and epitaxial layers of the micro light-emitting diodes of different colors having different thicknesses; providing a base substrate, forming a plurality of micro light-emitting diodes on the base substrate, and transferring micro light-emitting diodes of same color on the base substrate as a whole onto the drive substrate; repeating the transferring process in a sequence that the thicknesses of the epitaxial layers of the micro light-emitting diodes gradually increase, until each sub-pixel region in pixel units is provided with one of the micro light-emitting diodes having same color as the each sub-pixel region.

Abstract: The present application provides a fingerprint sensor. The fingerprint sensor includes an array of a plurality of optical fibers. Each of the plurality of optical fibers has a first end and second end opposite to the first end. Each of the plurality of optical fibers is configured to allow an incident light to enter into the second end and an exit light to exit from the second end. Each of the plurality of optical fibers includes a fiber core; a fiber Bragg grating in the fiber core; and a reflective film on the first end.

Abstract: The present application provides a fingerprint sensor. The fingerprint sensor includes an array of a plurality of optical fibers. Each of the plurality of optical fibers has a first end and second end opposite to the first end. Each of the plurality of optical fibers is configured to allow an incident light to enter into the second end and an exit light to exit from the second end. Each of the plurality of optical fibers includes a fiber core; a fiber Bragg grating in the fiber core; and a reflective film on the first end.

Abstract: A method for manufacturing a micro light-emitting diode array substrate is disclosed. The method includes: providing a drive substrate comprising a plurality of sub-pixel regions, the plurality of sub-pixel regions being configured for bearing micro light-emitting diodes of different colors, and epitaxial layers of the micro light-emitting diodes of different colors having different thicknesses; providing a base substrate, forming a plurality of micro light-emitting diodes on the base substrate, and transferring micro light-emitting diodes of same color on the base substrate as a whole onto the drive substrate; repeating the transferring process in a sequence that the thicknesses of the epitaxial layers of the micro light-emitting diodes gradually increase, until each sub-pixel region in pixel units is provided with one of the micro light-emitting diodes having same color as the each sub-pixel region.

Abstract: A device for fingerprint recognition, a manufacturing method therefor, and an electronic apparatus are provided. The method includes: forming fingerprint recognition units in multiple independent preset regions of a substrate, where the fingerprint recognition units each include a fingerprint recognition component and a light emitting component; partitioning the substrate along boundaries of the preset regions to separate the fingerprint recognition units from each other; and coupling the fingerprint recognition units after partition with corresponding control circuits, to make the fingerprint recognition component and the light emitting component of each fingerprint recognition unit be electrically connected to a corresponding control circuit coupled with the each fingerprint recognition unit. The fingerprint recognition unit and the control circuit coupled with each other serve together as the device for fingerprint recognition. The method is for manufacturing the device for fingerprint recognition.

Abstract: A light emitting diode device, an array substrate and a display device. The light emitting diode device includes a substrate, a first sub-light emitting unit disposed on the substrate, and a second sub-light emitting unit disposed on a side of the first sub-light emitting unit away from the substrate. The first sub-light emitting unit includes a first semiconductor layer of a first conductivity type, a first light emitting layer, and a second semiconductor layer of a second conductivity type which are each disposed successively in a direction away from the substrate. The second sub-light emitting unit includes the second semiconductor layer, a second light emitting layer, and a third semiconductor layer of the first conductivity type. Each layer is disposed successively in the direction away from the substrate. The first conductivity type is different from the second conductivity type.

Abstract: A rotational speed sensor, a manufacturing method thereof, a driving method thereof, and an electronic device are provided. The rotational speed sensor includes liquid crystal cell, rotational speed sensing module and rotational speed determining module; rotational speed sensing module is configured to convert rotational speed into voltage signal and apply voltage signal to liquid crystal cell; and at least a part of optical signal propagation module of rotational speed determining module is located in liquid crystal cell.

Abstract: A manufacturing method of a light emitting diode device and a light emitting diode device are provided. The manufacturing method of the light emitting diode device includes: forming a light emitting lamination layer on a base substrate, the light emitting lamination layer including a first semiconductor layer, a first light emitting layer, a second semiconductor layer, a second light emitting layer and a third semiconductor layer sequentially formed on the base substrate; dividing the light emitting lamination layer to form a plurality of light emitting units spaced from each other, each light emitting unit including a first area and a second area spaced from each other; and removing the third semiconductor layer and the second light emitting layer in the first area to form a first sub light emitting unit, and the second area being used for forming a second sub light emitting unit.

Abstract: The disclosure relates to the field of display technologies, and discloses a display module, and a method for fabricating the same, and the display module includes a display panel, a backlight module, and a flexible printed circuit, wherein the flexible printed circuit is electrically connected with the display panel, the backlight module includes a light source, and the light source is fixed on a side of the flexible printed circuit facing the display panel, and electrically connected with the flexible printed circuit.

Abstract: This disclosure discloses a light-emitting diode chip, a method for fabricating the same, a backlight module, and a display device. The light-emitting diode chip includes: a transparent base substrate; at least one light-emitting diode located on one side of the base substrate; and a dimming structure located on a side of the base substrate away from the light-emitting diode, wherein the light-emitting diode is configured to emit light from double sides thereof; and the dimming structure is configured to adjust the intensity of light emitted from the side of the base substrate away from the light-emitting diode.

Abstract: The disclosure discloses an acceleration sensor, where the acceleration sensor comprises: a housing, and a mass block in the housing and connected with the housing via at least two hanging beams, where an auxiliary buffer component is further provided between the mass block and a bottom surface of the housing, and an elastic coefficient of the auxiliary buffer component decreases as force applied thereon increases.