Abstract: A back plate configured to support a circuit board includes a body. The body defines a central recess formed into a top surface thereof, and a raised main support column extending from the central recess and adapted to support the circuit board.

Abstract: An electronic apparatus includes a main circuit board, an electronic device, side circuit boards, and a pressure applying unit. The electronic device is installed on and electrically connected to the main circuit board. The side circuit boards are positioned at edges of the electronic device on a side of the electronic device away from the main circuit board and electrically connected to the electronic device. The pressure applying unit is positioned on a side of the electronic device and on each of the side circuit boards away from the main circuit board. The pressure applying unit applies pressure: 1) to the side circuit boards to maintain an electrical connection between the side circuit boards and the electronic device; and 2) to side regions of the electronic device to maintain an electrical connection between the main circuit board and the electronic device.

Abstract: A pressurizing device includes a pressurizing plate having a first pressurizing plate surface and a second pressurizing plate surface opposite to each other. The first pressurizing plate surface presses an electronic element located on a first circuit board surface of a circuit board. The pressurizing device includes a plurality of peripheral pressurizing units applying pressure to a peripheral region of the second pressurizing plate surface and a plurality of central pressurizing units applying pressure to a central region of the second pressurizing plate surface.

Abstract: A circuit board assembly includes a chip, a first loading board, a circuit board, an intermediate board and a second loading board. The first loading board is arranged on the chip, and the circuit board is electrically connected to the chip. The intermediate board is arranged on the circuit board and positions the chip. The second loading board is arranged on a side of the circuit board opposite the intermediate board. The second loading board includes a plurality of protrusions and indentations formed on a first side thereof opposing the circuit board.

Abstract: A pressure-exerting device includes a first pressure-exerting unit adapted to press an electronic element on a circuit board. The first pressure-exerting unit has a pressure-exerting member defining a central opening sized to at least partially surround the electronic element, and a pressing elastic sheet arranged at an edge of the central opening of the pressure-exerting member and adapted to press the electronic element.

Abstract: A pressurizing device includes a pressurizing plate having a first pressurizing plate surface and a second pressurizing plate surface opposite to each other. The first pressurizing plate surface presses an electronic element located on a first circuit board surface of a circuit board. The pressurizing device includes a plurality of peripheral pressurizing units applying pressure to a peripheral region of the second pressurizing plate surface and a plurality of central pressurizing units applying pressure to a central region of the second pressurizing plate surface.

Abstract: A back plate configured to support a circuit board includes a body. The body defines a central recess formed into a top surface thereof, and a raised main support column extending from the central recess and adapted to support the circuit board.