Abstract: A packaged module and a metal plate. The packaged module may include a bearing structure, at least one metal strip, a circuit element, and a magnetic material. Further, a first surface of the bearing structure may bear the circuit element; two ends of each of the at least one metal strip may be coupled to the bearing structure, and a part of each metal strip other than the two ends is spaced apart from the bearing structure; and the magnetic material may cover a surface of a winding functional region of the at least one metal strip, where the winding functional region may be a part or all of the metal strip to which the winding functional region belongs. The foregoing solution helps simplify a packaging process and reduce losses and manufacturing costs of the packaged module.

Abstract: An electronic apparatus and a photovoltaic power optimizer. The electronic apparatus includes a circuit board, a heat dissipation housing, and an insulation member. The circuit board has a first surface and a second surface opposite to each other, where a first heat dissipation region is formed on the first surface and a second heat dissipation region is formed on the second surface. A first heat dissipation member has a first heat dissipation surface that is in direct contact with the first heat dissipation region. A second heat dissipation member is connected to the first heat dissipation member in a first direction, and has a second heat dissipation surface that is in direct contact with the second heat dissipation region. The first heat dissipation region and the second heat dissipation region are sealed by using the first heat dissipation member and the second heat dissipation member.

Abstract: Disclosed is a packaging solution, such as a lead frame for circuit board packaging, a packaged integrated circuit board, a power chip, and a circuit board packaging method. The lead frame includes a plurality of frame units disposed in parallel in a first direction. The frame unit includes a hollow bezel, and a plurality of pins and connecting ribs that are disposed in the bezel. Each pin includes a first pin part and a second pin part that extend in a second direction and are integrally formed. The first pin part is disposed in the bezel, the first pin part is configured to electrically connect to a circuit board, and the second pin part is connected and fastened to the bezel. The second direction is perpendicular to the first direction. The connecting ribs are connected among the plurality of pins and the bezel.

Abstract: The present invention relates to a universal-type efficient in-vitro amplification method for multiple times of clinical feedback of allogenic DNT cells. In the method of the present invention, the amount of a T cell activator is phased down in a continuous culture process without the need for additional interleukin-4 or AB serum.

Abstract: A multi-level direct current converter includes a direct current conversion unit, a switching unit, a voltage management unit, and a controller. The direct current conversion unit includes a flying capacitor, a first power transistor, and a second power transistor. A first end of the first power transistor is connected to a voltage input end of the multi-level direct current converter, a second end of the first power transistor is connected to a first end of the second power transistor by using the flying capacitor, and a second end of the second power transistor is connected to a reference ground.

Abstract: The three-level direct current converter includes: a flying capacitor, a plurality of switch groups, a drive circuit, and a control circuit. The control circuit includes at least an on-time generator. When a voltage on the flying capacitor deviates from a half of a power supply voltage, the on-time generator changes a charging current of a capacitor of the on-time generator to adjust an output on-time signal, and outputs the on-time signal to the drive circuit. The drive circuit generates a drive pulse signal based on the on-time signal to drive switch statuses of the plurality of switch groups, to adjust charging time and discharging time of the flying capacitor, where an absolute value of a difference between the voltage on the flying capacitor and the half of the power supply voltage is less than or equal to a preset threshold.

Abstract: This application provides an embedded substrate, a circuit board assembly, and an electronic device. The embedded substrate in this application includes an insulation layer, and an electronic element and a conductive connector that are embedded inside the insulation layer. The conductive connector is electrically connected to the electronic element. The conductive connector includes at least one fuse unit, the fuse unit includes a fusible structure and two electrical connection ends, the fusible structure is connected between the two electrical connection ends in a direction of an electrical path of the conductive connector, and the fusible structure is configured to be blown when a passing current exceeds a preset current threshold, to disconnect an electrical connection between the electronic element and an external connection end. In this application, maintenance and replacement costs are low during current burning prevention, and a volume is compact.

Abstract: This application provides a COT parallel circuit and a power supply device. After receiving a first power signal output by a first phase converter, the COT multiphase parallel circuit may output a first pulse signal to a second phase converter, where the first pulse signal is used to indicate to the second phase converter to output a second power signal. Further, the COT multiphase parallel circuit may output a plurality of power signals in one period of a RAMP signal. A high-frequency power signal can be output without increasing a frequency of the RAMP signal, thereby reducing the difficulty of implementing a high-frequency COT multiphase parallel connection.

Abstract: The electronic component package body includes a substrate, an electronic component, and first pins. The substrate includes a bottom surface, a top surface, and a first side surface. The first side surface is connected between the bottom surface and the top surface. The electronic component is packaged inside the substrate. The first pins are embedded in the substrate, and penetrate from the bottom surface to the top surface. The first pins include a bottom surface and a side surface connected to the bottom surface. The bottom surface is exposed relative to the bottom surface, and at least a partial structure of the side surface is exposed relative to the first side surface. Both the bottom surface and the side surface are used for soldering with solder. Reliability of soldering the electronic component package body and a circuit board is high.

Abstract: Embodiments of this application disclose an electronic component package body, an electronic component assembly structure, and an electronic device. The electronic component assembly structure includes: an electronic component package body, where the electronic component package body includes a substrate, an electronic component, and a pin; the electronic component is packaged inside the substrate, and the pin is electrically connected to the electronic component; the pin includes a first part embedded in the substrate, and a second part protruding from the substrate; the second part includes a bottom surface and a side surface, the bottom surface is an outer surface that is of the pin and that is away from the substrate, and the side surface is connected between the bottom surface and the substrate. In this application, reliability of soldering between the electronic component package body and the circuit board is relatively high.

Abstract: Disclosed is a packaging solution, such as a lead frame for circuit board packaging, a packaged integrated circuit board, a power chip, and a circuit board packaging method. The lead frame includes a plurality of frame units disposed in parallel in a first direction. The frame unit includes a hollow bezel, and a plurality of pins and connecting ribs that are disposed in the bezel. Each pin includes a first pin part and a second pin part that extend in a second direction and are integrally formed. The first pin part is disposed in the bezel, the first pin part is configured to electrically connect to a circuit board, and the second pin part is connected and fastened to the bezel. The second direction is perpendicular to the first direction. The connecting ribs are connected among the plurality of pins and the bezel.

Abstract: This application provides an embedded packaging structure, a preparation method thereof, and a terminal device. The embedded packaging structure includes a substrate frame, and a first through hole and a second through hole that run through the substrate frame in a thickness direction of the substrate frame. A metal connection electrode is disposed in the first through hole, an electronic component is embedded in the second through hole, and a pin of the electronic component is exposed at a hole opening of the second through hole. The substrate frame is made of silicon or a ceramic. Compared with a prior art substrate frame formed by using a resin material, the substrate frame in this application has better heat dissipation performance, moisture resistance, and strength in addition to providing insulation.

Abstract: A packaged module and a metal plate. The packaged module may include a bearing structure, at least one metal strip, a circuit element, and a magnetic material. Further, a first surface of the bearing structure may bear the circuit element; two ends of each of the at least one metal strip may be coupled to the bearing structure, and a part of each metal strip other than the two ends is spaced apart from the bearing structure; and the magnetic material may cover a surface of a winding functional region of the at least one metal strip, where the winding functional region may be a part or all of the metal strip to which the winding functional region belongs. The foregoing solution helps simplify a packaging process and reduce losses and manufacturing costs of the packaged module.

Abstract: A power supply circuit is disclosed. The circuit includes n capacitors, m power branches, and a control chip, where the m power branches include at least one first-type power branch and at least one second-type power branch, the first-type power branch includes a pre-boost topology structure and an open-loop topology structure connected in series to the pre-boost topology structure, the pre-boost topology structure is connected to the control chip, the pre-boost topology structure includes a straight-through state and a closed-loop state, and the control chip is configured to control, based on an output voltage of the power source, the pre-boost topology structure to switch between the straight-through state and the closed-loop state, so that the pre-boost topology structure pre-adjusts the output voltage of the power source and outputs a voltage range that meets a requirement of the open-loop topology structure.

Abstract: A power supply circuit is disclosed. The circuit includes n capacitors, m power branches, and a control chip, where the m power branches include at least one first-type power branch and at least one second-type power branch, the first-type power branch includes a pre-boost topology structure and an open-loop topology structure connected in series to the pre-boost topology structure, the pre-boost topology structure is connected to the control chip, the pre-boost topology structure includes a straight-through state and a closed-loop state, and the control chip is configured to control, based on an output voltage of the power source, the pre-boost topology structure to switch between the straight-through state and the closed-loop state, so that the pre-boost topology structure pre-adjusts the output voltage of the power source and outputs a voltage range that meets a requirement of the open-loop topology structure.

Abstract: A power supply bus circuit, includes a voltage regulator circuit, and an impedance isolation circuit, and further including one or more voltage adjustment circuits, where the voltage regulator circuit receives a direct current signal, adjusts a voltage of the direct current signal to a first preset voltage, and outputs a direct current signal of the first preset voltage to the impedance isolation circuit; the impedance isolation circuit receives the direct current signal of the first preset voltage, adjusts the direct current signal of the first preset voltage to an alternating current signal, and outputs, by using a transformer, the alternating current signal in an isolated way and converts the alternating current signal that is output in an isolated way to an isolated direct current signal, and outputs the isolated direct current signal to the voltage adjustment circuit.

Abstract: A power supply bus circuit, includes a voltage regulator circuit, and an impedance isolation circuit, and further including one or more voltage adjustment circuits, where the voltage regulator circuit receives a direct current signal, adjusts a voltage of the direct current signal to a first preset voltage, and outputs a direct current signal of the first preset voltage to the impedance isolation circuit; the impedance isolation circuit receives the direct current signal of the first preset voltage, adjusts the direct current signal of the first preset voltage to an alternating current signal, and outputs, by using a transformer, the alternating current signal in an isolated way and converts the alternating current signal that is output in an isolated way to an isolated direct current signal, and outputs the isolated direct current signal to the voltage adjustment circuit.