Abstract: A light-emitting diode (LED) lamp having high color-rendering property includes a lamp housing, a light source board, a plurality of white LEDs and a plurality of purple LEDs. The light source board is disposed in the lamp housing. The white LEDs are disposed on the light source board. The purple LEDs are disposed on the light source board. The wavelength range of the lights emitted by the purple LEDs is within the ultraviolet A (UVA) band.

Abstract: The invention discloses a hidden pin type high-power LED support, which comprises conductive pins and a base for packing the conductive pins, wherein a cavity is formed on the top of the base; a heat sink is fixedly arranged at the bottom of the cavity; the conductive pins pass through the bottom surface of the base; and the bottom surfaces of the conductive pins are parallel and level to the bottom surfaces of the base and the heat sink. The high-power LED support provided by the invention realizes the subsequent automated production of LEDs through a vibration plate smoothly by successfully hiding the conductive pins extended to both sides of an imitated Lumen lamp bead in the prior art in a frame of the base. Moreover, the invention also discloses high-power LED packaging structure and technology using same.