Abstract: The present invention teaches fluid resin dispensing and packaging methods by which to package a bare object, such as a semiconductor chip, directly and neatly on a substrate. A peripheral boundary is lined out by solder mask on the substrate surface to be packaged so as to form a barrier to prevent the fluid resin from overflowing whereby utilizing the surface tension between the fluid resin and the outer edge of the peripheral boundary. With the aid of the fluid resin barrier, the dispensed fluid resin can be contained within the range of the design. A clean and neat resin-packaged substrate can be obtained after the resin is solidified by heating the substrate.