Abstract: The present disclosure relates to air assemblies having an inflation, a deflation, and a closed state for use with inflatable products, such as air mattresses. Specifically, the present disclosure relates to air assemblies where the configuration of the air assembly can be changed manually by a user by operating a directional control valve to inflate, deflate, or close the inflatable product. The directional control valve may also activate a pump in the inflation and deflation states and deactivate the pump in the closed state.

Abstract: The present disclosure relates to air assemblies having an inflation, a deflation, and a closed state for use with inflatable products, such as air mattresses. Specifically, the present disclosure relates to air assemblies where the configuration of the air assembly can be changed manually by a user by operating a directional control valve to inflate, deflate, or close the inflatable product. The directional control valve may also activate a pump in the inflation and deflation states and deactivate the pump in the closed state.

Abstract: A PCB includes a base layer, a wiring pattern formed on a surface of the base layer, and a protecting layer formed on the wiring pattern. The protecting layer is formed by printing and solidifying an ink on the wiring pattern. The ink includes a cycloaliphatic epoxy resin, a phenoxyl resin solution, a solvent, a hardener, and an antifoaming agent.

Abstract: A printed circuit board includes a first electrically conductive circuit pattern, a substrate layer, an adhesive sheet, and a second electrically conductive circuit pattern, which are arranged in the above described order. The printed circuit board includes a single layer electrically conductive circuit area. The adhesive sheet defines a first opening spatially corresponding to the single layer electrically conductive circuit area. The adhesive sheet includes a first inner sidewall surrounding the first opening. The second electrically conductive circuit pattern defines a second opening spatially corresponding to the single layer electrically conductive circuit area. The second electrically conductive circuit pattern includes a second inner sidewall surrounding the second opening. The first inner sidewall and the second inner sidewall are not completely coplanar.

Abstract: A flexible printed circuit board (PCB) used for near field communication and a method for manufacturing the flexible PCB are provided. The flexible PCB includes an insulating layer; a first conductive circuit layer adhered on a surface of the insulating layer, the first conductive circuit layer includes at least one first conductive circuit arranged as spiral-shaped and defines a plurality of first spaces; a first resin layer is adhered on a surface of the insulating layer and fills the first spaces; and a first cover layer adhered on a surface of the first resin layer and a surface of the first conductive circuit layer away from the insulating layer.

Abstract: A PCB includes a base layer, a wiring pattern formed on a surface of the base layer, and a protecting layer formed on the wiring pattern. The protecting layer is formed by printing and solidifying an ink on the wiring pattern. The ink includes a cycloaliphatic epoxy resin, a phenoxyl resin solution, a solvent, a hardener, and an antifoaming agent.

Abstract: A method for manufacturing a multilayer FPCB includes certain steps. A first printed circuit substrate is provided, the first printed circuit substrate includes a first copper layer and a first protective film, the film defining a first opening. A second printed circuit substrate is provided, this substrate includes a second copper layer and a second protective film. The second protective film defines a second opening. The first printed circuit substrate is laminated together with the second printed circuit substrate by an adhesive sheet. The adhesive sheet defines a third opening in communication with and aligned with the first opening and the second opening. The first copper layer is then etched to form a first outer wiring layer and the third copper layer is also etched to form a second outer wiring layer, thereby obtaining a multilayer FPCB.

Abstract: A printed circuit board includes a first electrically conductive circuit pattern, a substrate layer, an adhesive sheet, and a second electrically conductive circuit pattern, which are arranged in the above described order. The printed circuit board includes a single layer electrically conductive circuit area. The adhesive sheet defines a first opening spatially corresponding to the single layer electrically conductive circuit area. The adhesive sheet includes a first inner sidewall surrounding the first opening. The second electrically conductive circuit pattern defines a second opening spatially corresponding to the single layer electrically conductive circuit area. The second electrically conductive circuit pattern includes a second inner sidewall surrounding the second opening. The first inner sidewall and the second inner sidewall are not completely coplanar.