Abstract: The embodiment of the present disclosure provides a deep neural network (DNN)-based multi-target constant false alarm rate (CFAR) detection method. The method includes: obtaining target values to be measured based on radar IF (IF) signals to be detected, the target values to be measured including a measured frequency value and a measured intensity value of the radar IF signals; obtaining peak sequences based on the target values to be measured; generating a target detection result by processing the peak sequences based on a DNN detector, the DNN detector being a machine learning model; generating approximated maximum likelihood estimation (AMLE) of a scale parameter based on an approximated maximum likelihood estimator; generating a false alarm adjustment threshold based on a preset false alarm rate and the AMLE; and generating a constant false alarm detection result by processing the target detection result based on the false alarm adjustment threshold.

Abstract: Provided is a road-rail dual purpose quick disassembly and assembly type rail grinding maintenance robot, including a left robot grinding unit, a right robot grinding unit and quick unit connecting devices. The two robot grinding units are fixedly connected to the left and right sides of the quick unit connecting devices by the quick unit connecting devices so as to achieve quick assembly and disassembly of the robot. Each of the robot grinding units includes a robot grinding device, a rail walking device, road walking devices, a frame, a shell component and an electric control component. The robot grinding device is fixedly installed on the inner side of the upper part of the frame. The rail walking device and the road walking devices are fixedly installed at the bottom of the frame. The degree of intelligent and flexible of rail grinding operation can be significantly improved.

Abstract: A semiconductor light-emitting element and a light-emitting device thereof are provided. The semiconductor light-emitting element includes a transparent substrate, a transparent bonding layer, and a semiconductor laminated layer including a first semiconductor layer, a light-emitting layer, and a second semiconductor layer. The transparent bonding layer is located between the transparent substrate and the semiconductor laminated layer. The transparent substrate has a first surface facing towards the semiconductor laminated layer, and the first surface has an uneven structure. The semiconductor laminated layer has a first surface facing towards the transparent substrate. The transparent bonding layer includes a first bonding layer in contact with the first surface of the transparent substrate, and a refractive index of the first bonding layer is lower than that of the transparent substrate.

Abstract: A light-emitting element and a light-emitting device are provided. The light-emitting element includes an epitaxial layer, an insulating layer formed on a surface of the epitaxial layer, and an electrode structure. The electrode structure includes a first electrode connected to a first conductivity type semiconductor layer and a second electrode connected to a second conductivity type semiconductor layer. The electrode structure includes a wiring portion and a connecting portion. The wiring portion is located above the insulating layer. The connecting portion penetrates through the insulating layer from an edge of the wiring portion and extends towards the epitaxial layer. The connecting portion is arranged to extend from the edge of the wiring portion towards the epitaxial layer. Further, a projection of the wiring portion on a front surface of the substrate does not overlap a projection of the connecting portion on the front surface of the substrate.

Abstract: A light-emitting diode (LED) chip includes a semiconductor laminated layer including a first semiconductor layer, a light-emitting layer and a second semiconductor layer arranged from bottom to top, a transparent conductive layer disposed on the semiconductor laminated layer, a transparent bonding layer disposed on the transparent conductive layer, and a transparent substrate disposed on the transparent bonding layer. The second semiconductor layer includes a first sublayer and a second sublayer disposed on a part of an upper surface of the first sublayer, and a doping concentration of the first sublayer is lower than that of the second sublayer. The transparent conductive layer is in contact with an upper surface of the second sublayer and a part of the upper surface of the first sublayer around the second sublayer. The LED chip can improve the manufacturing yield and ensure the ohmic contact and uniform lateral current spreading.

Abstract: A flip-chip light-emitting device includes a transparent substrate, an epitaxial structure, a transparent dielectric layer, a plurality of first contact electrodes, multiple second contact electrodes, a metallic reflection layer, a first insulating layer, and an electrode pad region. The epitaxial structure is formed on the transparent substrate, and includes a first type semiconductor layer, an active layer, and a second type semiconductor layer. The first and second contact electrodes are embedded in the transparent dielectric layer, and respectively connected to the first and second type semiconductor layers. The second and first contact electrodes are arranged in an array. The second contact electrodes are disposed in a region perpendicularly below the first pad and are distributed along a circular ring that is concentric with one of the first contact electrodes. A light emitting module includes a circuit board, and the flip-chip light emitting device is mounted on the circuit board.

Abstract: A high-strength medical fiber composite material includes a sodium alginate hydrogel matrix and a fiber framework. The fiber framework is completely embedded in the sodium alginate hydrogel matrix and formed by compounding supporting layer fibers and reinforcing layer fibers. The reinforcing layer fibers are located above the supporting layer fibers. The reinforcing layer fibers and the supporting layer fibers are orthogonal to each other. According to the high-strength medical fiber composite material prepared in the present invention, the stiffness is improved by 3-4 orders of magnitude, the tensile strength is improved by 2-3 orders of magnitude, and the high-strength medical fiber composite material has high biocompatibility and safety and a great application prospect.

Abstract: The light-emitting device includes a substrate, a light-emitting chip unit formed on the substrate and including multiple chips, an isolation groove extending in a first direction and separating two adjacent ones of the chips, and a bridging structure. The isolation groove is defined by a bottom and two sidewalls and has a first groove section and a second groove section arranged in the first direction. The first groove section has a width in a width direction perpendicular to the first direction that is greater than a width of the second groove section in the width direction. At the first groove section, one of the sidewalls has a curved portion. The bridging structure is formed on the bottom and the sidewalls, covers the curved portion, and electrically connects the two adjacent ones of the chips.

Abstract: A light-emitting includes an epitaxial structure, a diffusion blocking layer, an ohmic contact layer, a first electrode, and a second electrode. The epitaxial structure includes a first semiconductor layer, an active layer, and a second semiconductor layer disposed sequentially in such order. The diffusion blocking layer is disposed on a surface of the first semiconductor layer opposite to the active layer. The ohmic contact layer is disposed on a surface of the diffusion blocking layer opposite to the first semiconductor layer. The first electrode is disposed on a surface of the ohmic contact layer opposite to the diffusion blocking layer and is electrically connected to the first semiconductor layer. The second electrode is disposed on a surface of the second semiconductor layer adjacent to the active layer and is electrically connected to the second semiconductor layer. A method for manufacturing the light-emitting device is also provided.

Abstract: A light-emitting device includes a semiconductor substrate, an epitaxial structure that has a first surface facing the semiconductor substrate and a second surface opposite to the first surface, and a transparent bonding structure that is disposed between the first surface and the semiconductor substrate. The transparent bonding structure has a first bonding surface facing the first surface of the epitaxial structure and a second bonding surface opposite to the first bonding surface, and has a slit extending from the first bonding surface toward the second bonding surface and terminating at a position that is a distance away from the second bonding surface. A method for manufacturing a light-emitting device is also provided.

Abstract: A storage system configured for use with an energy management system is provided and includes a battery having a plurality of cells and a propagation barrier comprising a first set of slabs, phase change material, an opening positioned adjacent the phase change material, a second set of slabs positioned between the first set of slabs and configured such that as temperature of an initiating cell increases, the phase change material absorbs energy and melts so that a previous volume occupied by the phase change material is replaced with air to create high temperature gradient that reduces adjacent cell temperature rise.

Abstract: A magnetic pick-up tool, including a handle, a magnetic attraction head, and a telescopic rod. The magnetic attraction head is disposed in front of the handle. A first magnet is disposed on the magnetic attraction head. A front end of the telescopic rod is connected to a rear end of the magnetic attraction head. A rear end of the telescopic rod is connected to the handle. An illuminating lamp device capable of emitting light forwards is disposed on the magnetic attraction head. The illuminating lamp device capable of emitting light forwards is disposed on the magnetic attraction head and may be turned on as required for achieving free switching of auxiliary illumination, which have a wider illumination range on sides in a dark environment, so that users may pick up objects well and convenience is brought to the users.