Abstract: Disclosed herein are exemplary embodiments of methods, apparatus, and systems for performing content-adaptive deblocking to improve the visual quality of video images compressed using block-based motion-predictive video coding. For instance, in certain embodiments of the disclosed technology, edge information is obtained using global orientation energy edge detection (“OEED”) techniques on an initially deblocked image. OEED detection can provide a robust partition of local directional features (“LDFs”). For a local directional feature detected in the partition, a directional deblocking filter having an orientation corresponding to the orientation of the LDF can be used. The selected filter can have a filter orientation and activation thresholds that better preserve image details while reducing blocking artifacts. In certain embodiments, for a consecutive non-LDF region, extra smoothing can be imposed to suppress the visually severe blocking artifacts.

Abstract: The light-emitting device includes a substrate, a light-emitting chip unit formed on the substrate and including multiple chips, an isolation groove extending in a first direction and separating two adjacent ones of the chips, and a bridging structure. The isolation groove is defined by a bottom and two sidewalls and has a first groove section and a second groove section arranged in the first direction. The first groove section has a width in a width direction perpendicular to the first direction that is greater than a width of the second groove section in the width direction. At the first groove section, one of the sidewalls has a curved portion. The bridging structure is formed on the bottom and the sidewalls, covers the curved portion, and electrically connects the two adjacent ones of the chips.

Abstract: Disclosed are a method and a system for bug localization based on a code knowledge graph, including the steps of: extracting source codes from a Git version control system, parsing in the source codes to generate an abstract syntax tree (AST), constructing a code knowledge graph, preprocessing the summary and description of a bug report crawled from a Bugzilla bug tracking system, and performing the named entity recognition to identify bug-related entity sequence, converting the code knowledge graph and the bug-related entity sequence into vector representation through an embedding algorithm, calculating cosine similarities of vector representations between the code knowledge graph and the bug entity sequence, ranking the similarities from high to low to generate a list of suspicious methods, filtering redundant information in the source codes, identifying bug-related entity elements in the bug report, and reserving the bug-related information.

Abstract: A light-emitting includes an epitaxial structure, a diffusion blocking layer, an ohmic contact layer, a first electrode, and a second electrode. The epitaxial structure includes a first semiconductor layer, an active layer, and a second semiconductor layer disposed sequentially in such order. The diffusion blocking layer is disposed on a surface of the first semiconductor layer opposite to the active layer. The ohmic contact layer is disposed on a surface of the diffusion blocking layer opposite to the first semiconductor layer. The first electrode is disposed on a surface of the ohmic contact layer opposite to the diffusion blocking layer and is electrically connected to the first semiconductor layer. The second electrode is disposed on a surface of the second semiconductor layer adjacent to the active layer and is electrically connected to the second semiconductor layer. A method for manufacturing the light-emitting device is also provided.

Abstract: A light-emitting device includes a semiconductor substrate, an epitaxial structure that has a first surface facing the semiconductor substrate and a second surface opposite to the first surface, and a transparent bonding structure that is disposed between the first surface and the semiconductor substrate. The transparent bonding structure has a first bonding surface facing the first surface of the epitaxial structure and a second bonding surface opposite to the first bonding surface, and has a slit extending from the first bonding surface toward the second bonding surface and terminating at a position that is a distance away from the second bonding surface. A method for manufacturing a light-emitting device is also provided.

Abstract: A storage system configured for use with an energy management system is provided and includes a battery having a plurality of cells and a propagation barrier comprising a first set of slabs, phase change material, an opening positioned adjacent the phase change material, a second set of slabs positioned between the first set of slabs and configured such that as temperature of an initiating cell increases, the phase change material absorbs energy and melts so that a previous volume occupied by the phase change material is replaced with air to create high temperature gradient that reduces adjacent cell temperature rise.

Abstract: A magnetic pick-up tool, including a handle, a magnetic attraction head, and a telescopic rod. The magnetic attraction head is disposed in front of the handle. A first magnet is disposed on the magnetic attraction head. A front end of the telescopic rod is connected to a rear end of the magnetic attraction head. A rear end of the telescopic rod is connected to the handle. An illuminating lamp device capable of emitting light forwards is disposed on the magnetic attraction head. The illuminating lamp device capable of emitting light forwards is disposed on the magnetic attraction head and may be turned on as required for achieving free switching of auxiliary illumination, which have a wider illumination range on sides in a dark environment, so that users may pick up objects well and convenience is brought to the users.

Abstract: A light-emitting device includes a semiconductor structure having a first semiconductor layer, an active layer, and a second semiconductor layer. The second semiconductor layer and the active layer formed on a top surface of the first semiconductor layer exposes a portion of the top surface. A first strip electrode is connected to the exposed top surface. A second strip electrode is connected to the second semiconductor layer. When first and second electrodes are projected on a plane, two parallel lines, that contact two opposite ends of the first electrode and perpendicularly intersect a straight line connecting between two opposite ends of the second electrode, define on the straight line a length, which does not extend beyond a distance between the two opposite ends of the second electrode.

Abstract: This application provides an insulation resistor detection circuit, which includes a state control unit, which is connected between a positive electrode and a negative electrode of a power supply of a to-be-detected apparatus; a first voltage division branch that is connected in parallel to a first capacitor to obtain a first voltage waveform, a second voltage division branch that is connected in parallel to a second capacitor to obtain a second voltage waveform; and a processor that is connected to the state control unit, the first voltage division branch, and the second voltage division branch; determines a next switching moment based on the first voltage waveform and the second voltage waveform that are at a current moment; and control, at the next switching moment, the state control unit to switch a state.

Abstract: Example methods and apparatuses for detecting lithium plating and obtaining a polarization proportion are provided. One example method includes obtaining an open-circuit voltage of a rechargeable battery and a negative electrode open-circuit voltage of the rechargeable battery based on a state of charge of the rechargeable battery. A negative electrode polarization voltage of the rechargeable battery is obtained based on the open-circuit voltage, a terminal voltage of the rechargeable battery, and a polarization proportion of the rechargeable battery. A negative electrode voltage of the rechargeable battery is obtained based on the negative electrode open-circuit voltage and the negative electrode polarization voltage. It is determined, based on the negative electrode voltage, whether lithium plating occurs in the rechargeable battery.

Abstract: The light emitting assembly includes a substrate (1), a laser light source array, and a lens array. The laser light source array is disposed on the substrate (1), the lens array is disposed on a light emitting side of the laser light source array, one lens (3) in the lens array is disposed opposite to at least one laser light source (2) in the laser light source array, a light emitting surface of the lens (3) is a spherical surface, and at least some laser light sources (2) are eccentrically arranged with corresponding lenses (3). In a manufacturing process, lenses (3) of a same structure and laser light sources (2) of a same structure are used, and eccentric distances between the laser light sources (2) and the lenses (3) are changed, so that light emitting assemblies with different divergence angles can be prepared.

Abstract: A method of manufacturing a three-dimensional target object may include forming a shell from loose machining powder using an additive manufacturing process and subjecting the shell to a densification process to form a target object. The shell may define an enclosure that contains additional machining powder. The densification process may include causing metallurgical bonding between the shell and additional machining powder contained in the enclosure defined by the shell and shrinking and/or distorting the shape of the shell to conform the target object to a three-dimensional model for the target object. The shell may include a plurality of layers and/or parts that differ at least in respect of density. The plurality of layers and/or parts may be configured based at least in part on the shrinking and/or distorting to the shape of the shell needed to conform the target object to the three-dimensional model for the target object.

Abstract: A flip-chip light emitting device includes a substrate, a light-emitting layer, a bonding layer disposed between the substrate and the light-emitting layer, and a protective insulating layer disposed over the light-emitting layer and the bonding layer. The bonding layer has first and second upper surfaces that respectively have different first and second roughnesses.

Abstract: A flip-chip light-emitting diode includes a first conductivity type semiconductor layer, a light-emitting layer, a second conductivity type semiconductor layer, a first transparent dielectric layer, a second transparent dielectric layer, and a distributed Bragg reflector (DBR) structure which are sequentially stacked. The first transparent dielectric layer has a thickness greater than ?/2n1, and the second transparent dielectric layer has a thickness of m?/4n2, wherein m is an odd number, ? is an emission wavelength of the light-emitting layer, n1 is a refractive index of the first transparent dielectric layer, and n2 is a refractive index of the second transparent dielectric layer and is greater than n1.