Abstract: A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.

Abstract: A lamp includes a cover plate, a housing, and a light source assembly. At least one side wall of the housing is a light-emitting surface; the cover plate and the housing are enclosed to form an accommodating space; the light source assembly is arranged in the accommodating space; and the light source assembly emits light toward the cover plate.

Abstract: An interconnection structure used in an electronic device includes a chassis, a first line board, a second line board, and a heat dissipation component. The heat dissipation component is disposed on a first side surface of the chassis, the first side surface includes a first opening, the second line board is horizontally disposed inside the chassis, the first line board is vertically inserted onto a side surface of the second line board, and a second side surface that is of the chassis and that is opposite to the first side surface includes a second opening. The second line board is horizontally disposed inside the chassis, and the first line board is vertically inserted onto the side surface of the second line board, to reduce a quantity of parts on a system air duct, reduce a flow resistance of a system, and improve a heat dissipation capability of the system.

Abstract: A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.

Abstract: A heat dissipation cabinet includes a cabinet body and a heat dissipation apparatus. A first accommodation region of the cabinet body can accommodate a plugboard in a stacked manner, and heat source components of the plugboard dissipate heat through the heat dissipation apparatus. An evaporator, a condenser, and an evaporation pipeline of the heat dissipation apparatus are connected to a liquid return pipeline to form a heat exchange loop, and the evaporator is in thermal contact with an outer surface of a heat source component. The condenser is disposed in a second accommodation region and located above the evaporator. A refrigerant flows in the heat exchange loop, to draw heat of the heat source component far to the condenser, and take away heat of the condenser using air generated by a fan. A second accommodation region is used as an independent air duct whose path is relatively short.

Abstract: An interconnection structure used in an electronic device includes a chassis, a first line board, a second line board, and a heat dissipation component. The heat dissipation component is disposed on a first side surface of the chassis, the first side surface includes a first opening, the second line board is horizontally disposed inside the chassis, the first line board is vertically inserted onto a side surface of the second line board, and a second side surface that is of the chassis and that is opposite to the first side surface includes a second opening. The second line board is horizontally disposed inside the chassis, and the first line board is vertically inserted onto the side surface of the second line board, to reduce a quantity of parts on a system air duct, reduce a flow resistance of a system, and improve a heat dissipation capability of the system.

Abstract: A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.

Abstract: An outdoor display screen includes a housing, a display screen, a control module, a heat dissipation module, and a power supply component. A first cavity and a second cavity are disposed on the housing. The display screen, the control module, and the power supply component are mounted in the first cavity, and the heat dissipation module is mounted in the second cavity. A cable-through hole is disposed on the housing. An air exhaust vent connected to an air intake vent of an internal circulation path and an air intake vent connected to an air exhaust vent of the internal circulation path are disposed in the first cavity to form an internal circulation heat-dissipation air duct. An air intake vent and an air exhaust vent are disposed in the second cavity to form an external circulation heat-dissipation air duct.

Abstract: The invention relates to a control method for a hard roof of a coal mine, specifically to a method for over-pit and under-pit cooperative control of roofs of far and near fields of an extra-large stoping space. The method provided by the invention overcomes the problem of lack of comprehensive and cooperative control methods for hard roofs of far and near fields of an extra-large stoping space in the prior art. According to a technical scheme in the invention, the method comprises an over-pit vertical hole hydraulic fracturing method, an over-pit L-shaped hole hydraulic fracturing method, an over-pit highly-energy-gathered repetition pulse strong shock wave method, an under-pit water injection method, an under-pit layered blasting method and an under-pit hydraulic fracturing method.

Abstract: An outdoor display screen includes a housing, a display screen, a control module, a heat dissipation module, and a power supply component. A first cavity and a second cavity are disposed on the housing. The display screen, the control module, and the power supply component are mounted in the first cavity, and the heat dissipation module is mounted in the second cavity. A cable-through hole is disposed on the housing. An air exhaust vent connected to an air intake vent of an internal circulation path and an air intake vent connected to an air exhaust vent of the internal circulation path are disposed in the first cavity to form an internal circulation heat-dissipation air duct. An air intake vent and an air exhaust vent are disposed in the second cavity to form an external circulation heat-dissipation air duct.