Patents by Inventor Zhiwu Fang

Zhiwu Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Combined analyte sensor and infusion set
    Patent number: 11944784
    Abstract: Disclosed herein are combined devices and methods of manufacturing such combined devices. The combined devices disclosed herein include an analyte sensor including a sensor probe; an infusion set hub including a cannula; and a flexible base. The analyte sensor and infusion set hub are attached to the flexible base such that movement of one of the analyte sensor and the infusion set hub is substantially not transferred to the other one of the analyte sensor and the infusion set hub.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: April 2, 2024
    Assignee: Medtronic Minimed, Inc.
    Inventors: Guangping Zhang, Kiem H. Dang, Valerie Chen, Ling Jiang, Evan Anselmo, Zhiwu Fang, Sarnath Chattaraj
  • COMBINED ANALYTE SENSOR AND INFUSION SET
    Publication number: 20210146047
    Abstract: Disclosed herein are combined devices and methods of manufacturing such combined devices. The combined devices disclosed herein include an analyte sensor including a sensor probe; an infusion set hub including a cannula; and a flexible base. The analyte sensor and infusion set hub are attached to the flexible base such that movement of one of the analyte sensor and the infusion set hub is substantially not transferred to the other one of the analyte sensor and the infusion set hub.
    Type: Application
    Filed: November 18, 2019
    Publication date: May 20, 2021
    Inventors: Guangping Zhang, Kiem H. Dang, Valerie Chen, Ling Jiang, Evan Anselmo, Zhiwu Fang, Sarnath Chattaraj
  • SYSTEM AND METHOD FOR PREVENTING OVERHEATING OR EXCESSIVE BACKPRESSURE IN THERMOELECTRIC SYSTEMS
    Publication number: 20140190185
    Abstract: A thermoelectric assembly and a method of operating a thermoelectric assembly are provided. The thermoelectric assembly includes at least one thermoelectric subassembly configured to be in thermal communication with a heat source and configured to be in thermal communication with a heat sink. The at least one thermoelectric subassembly includes at least one thermoelectric element including a hot side at a first temperature and a cold side at a second temperature lower than the first temperature. The thermoelectric assembly further includes a controller in operative communication with the at least one thermoelectric subassembly. The controller is configured to adjust the first temperature by adjusting an electrical current of the at least one thermoelectric subassembly.
    Type: Application
    Filed: December 17, 2013
    Publication date: July 10, 2014
    Applicant: Gentherm Incorporated
    Inventors: Lon E. Bell, Douglas T. Crane, Vladimir Jovovic, Eric Poliquin, Joseph Dean, Zhiwu Fang, Dmitri Kossakovski