Abstract: An improved PCB Rogowski coil addresses the challenges presented by space constraints within circuit interrupters. The disclosed coil comprises a plurality of PCBs that are coupled together, in contrast with known coils constructed from only a single PCB. During a pre-assembly stage, three PCBs are coupled to one another in order to form a partial coil assembly structured to be mounted onto a circuit interrupter primary conductor. After the partial coil assembly is mounted onto the primary conductor, a fourth PCB is connected to the partial coil assembly via press-fit connectors to form a complete coil. In contrast with known PCB Rogowski coils which are structured to be mounted perpendicularly to the primary conductor, the disclosed modular PCB Rogowski coil enables a substantial portion of the PCB surface area to be mounted in parallel to the primary conductor and to thus occupy significantly less space than known PCB Rogowski coils.

Abstract: An improved PCB Rogowski coil addresses the challenges presented by space constraints within circuit interrupters. The disclosed coil comprises a plurality of PCBs that are coupled together, in contrast with known coils constructed from only a single PCB. During a pre-assembly stage, three PCBs are coupled to one another in order to form a partial coil assembly structured to be mounted onto a circuit interrupter primary conductor. After the partial coil assembly is mounted onto the primary conductor, a fourth PCB is connected to the partial coil assembly via press-fit connectors to form a complete coil. In contrast with known PCB Rogowski coils which are structured to be mounted perpendicularly to the primary conductor, the disclosed modular PCB Rogowski coil enables a substantial portion of the PCB surface area to be mounted in parallel to the primary conductor and to thus occupy significantly less space than known PCB Rogowski coils.

Abstract: An assembly for manufacturing the insulation layer of a Thomson coil includes a base plate, a coil housing, and a cover plate. The base plate securely seats the coil housing, and the coil housing securely seats a Thomson coil and the cover plate. The cover plate has several ribs that hold multiple turns of a Thomson coil in place while epoxy is applied to the coil, thus ensuring that the epoxy is evenly distributed on the coil surface and that the coil windings remain level. The cover plate and coil housing are structured to either receive a high-pressure epoxy injection or to be used in an epoxy potting process, during which all exposed areas of the Thomson coil are coated by liquid epoxy. After the epoxy has solidified, the Thomson coil is coupled to the coil housing, and the housed and insulated Thomson coil is removed from the assembly.

Abstract: A wireless-controlled smart plug device and methods of use and operation, using a solid state switch to provide electrical power from an outlet to a load, and provide protection against overload, short circuit, ground, arc, or voltage surge faults. The switch includes a bidirectional semiconductor switch with two back-to-back connected transistors, such as silicon power MOSFETs, silicon insulated-gate bipolar transistors (IGBTs), silicon carbide (SiC) transistors, or gallium nitride (GaN) transistors, each configured to control the current flow from the electrical receptacle to the external electrical load.

Abstract: A wireless-controlled smart plug device and methods of use and operation, using a solid state switch to provide electrical power from an outlet to a load, and provide protection against overload, short circuit, ground, arc, or voltage surge faults. The switch includes a bidirectional semiconductor switch with two back-to-back connected transistors, such as silicon power MOSFETs, silicon insulated-gate bipolar transistors (IGBTs), silicon carbide (SiC) transistors, or gallium nitride (GaN) transistors, each configured to control the current flow from the electrical receptacle to the external electrical load.