Abstract: A class of lactam-modified polypeptide compounds and the use thereof in the preparation of a drug for treating related diseases.

Abstract: The present disclosure refers to an alternating current/direct current (AC/DC) converter for an on board charger (OBC). The AC/DC converter includes a three-phase-input comprising three inputs, a single-stage dual-active bridge (DAB) circuit, and an auxiliary circuit. The auxiliary circuit includes two switching means and an energy storage means, the auxiliary circuit also includes at least two branches, wherein each of the at least two branches include one of the switching means. At least one branch of the at least two branches is connected to a single-phase AC input of the three inputs, and another branch of the at least two branches is connected to an input of the three inputs which is not a single-phase AC input, and the another branch comprises the energy storage means.

Abstract: The power supply conversion circuit includes an isolation transformer, and the isolation transformer includes at least two primary coils and at least one secondary coil. Each primary coil is connected to a half-bridge circuit by using a first resonant network, and half-bridge circuits corresponding to the at least two primary coils are connected in series between two electrodes of a power supply. The half-bridge circuit is connected in parallel to a voltage divider, the voltage divider includes a first capacitor and a second capacitor that are connected in series, a first terminal of the first resonant network is connected to an intermediate node of the half-bridge circuit, and a second terminal of the first resonant network is connected to a connection point between the first capacitor and the second capacitor.

Abstract: A high power factor rectifier circuit includes a totem pole power factor correction (PFC) circuit, a sampling resistor, a power suppl a PFC controller, and a filter. The totem pole PFC circuit includes two bridge arm units connected in parallel between a first parallel connection point and a second parallel connection point. One end of the sampling resistor is connected to the first parallel connection point and a first reference ground, and the other end of the sampling resistor is separately connected to a sampling voltage input terminal of the PFC controller and a second reference ground. A grounding terminal of the PFC controller is connected to the first reference ground. A power output terminal of the power supply is connected to a power input terminal of the PFC controller using the filter.

Abstract: An example of a totem-pole bridgeless power factor correction circuit includes a first drive circuit, a rectifier bridge, an inductor, and a current detection circuit. The rectifier bridge includes a first metal oxide semiconductor (MOS) transistor and a first resistor that are located in a first bridge arm. The first drive circuit is configured to drive, based on a first PWM signal when a voltage of a second output port of an alternating current power supply is a positive voltage, a first port and a second port of the first MOS transistor to turn on the first MOS transistor to enable the alternating current power supply to charge the inductor by using the first MOS transistor.

Abstract: A power factor correction (PFC) circuit includes an alternating current input circuit, a totem-pole PFC circuit, an input sampling circuit, an output sampling circuit, and a PFC control protection circuit. A first output terminal of the alternating current input circuit is respectively connected to a first input terminal of the totem-pole PFC circuit and a first input terminal of the input sampling circuit.

Abstract: This application relates to the field of power supply packaging technologies, and in particular, to a PCB-pinout based packaged module, including a packaged module and a pin exposed outside the packaged module. The packaged module includes a PCB and a power component. The PCB has a first surface and a second surface that are disposed opposite to each other, and the power component is disposed on the first surface or the second surface of the PCB. The power component performs communication connection with a pin located on one side of the first surface or one side of the second surface of the PCB through surface-layer copper of the PCB. The pin located on one side of the first surface or one side of the second surface of the PCB is a surface-layer copper etching pattern that is located on the PCB and that is exposed outside the packaged module.

Abstract: This application provides a resonant conversion system, including a controller and a resonant conversion circuit. The resonant conversion circuit includes a high frequency chopper circuit, a resonant cavity, a transformer, and a rectification filter network, and the high frequency chopper circuit includes switches S1 and S2. The controller is configured to: detect a bridge arm midpoint voltage VSW, and determine based on the VSW a current threshold signal used to indicate a current threshold; detect a resonant current on a primary side of the transformer, and compare the resonant current with the current threshold signal to control on/off of the switch S1 or S2 based on the second electrical signal, so that the system operates in an inductive mode to ensure zero voltage switching of the switch, while operating in a state close to a capacitive mode to maximize the use of a gain region.

Abstract: This application provides a packaging device and a manufacturing method therefor, and an electronic device, and relates to the field of electronic technologies. The packaging device includes: a circuit board having a first surface; a first plastic packaging layer covering the first surface, where the first plastic packaging layer includes a first channel, the first channel penetrates the first plastic packaging layer in a direction perpendicular to the first surface; and a first pin electrically connected to the circuit board, the first pin is located in one first channel, at least a part of the first pin is connected to an inner wall of the first channel, a first conductive surface that is of the first pin and that is away from the circuit board is exposed from the first channel, and the first pin is electrically connected to an external device by using the first conductive surface.

Abstract: The present application provides an integrated device, and a power switching device comprising the integrated device. The integrated device comprises a substrate, a die arranged inside the substrate, at least one capacitor arranged on a surface of the substrate, wherein the die and the at least one capacitor are electrically connected. The power switching device comprises at least one integrated device according to the aforementioned embodiments of the present application. The compact design of the integrated device enables a high frequency, high efficiency, high power density power switching device.

Abstract: This application relates to the field of power supply packaging technologies, and in particular, to a PCB-pinout based packaged module, including a packaged module and a pin exposed outside the packaged module. The packaged module includes a PCB and a power component. The PCB has a first surface and a second surface that are disposed opposite to each other, and the power component is disposed on the first surface or the second surface of the PCB. The power component performs communication connection with a pin located on one side of the first surface or one side of the second surface of the PCB through surface-layer copper of the PCB. The pin located on one side of the first surface or one side of the second surface of the PCB is a surface-layer copper etching pattern that is located on the PCB and that is exposed outside the packaged module.

Abstract: Variants of transglutaminase from Streptoverticillium ladakanum, which variants have improved selectivity for Gln-141 of human growth hormone are provided.

Abstract: Anti-IL-13 antibodies, crystals of anti-IL-13 antibodies, IL-13 polypeptide/anti-IL-13 antibody complexes, crystals of IL-13 polypeptide/anti-IL-13 antibody complexes, IL-13R?1 polypeptide/IL-13 polypeptide/anti-IL-13 antibody complexes, crystals of IL-13R?1 polypeptide/IL-13 polypeptide/anti-IL-13 antibody complexes, and related methods and software systems are disclosed.