Abstract: An image acquisition device based on photo-thermal imaging, including a support beam, a translational electric motor, an imaging probe, and a light emitter. The translational electric motor is fixed to the lower side of the beam, and the imaging probe is perpendicularly fixed to a moving block in the translational electric motor. The light emitter is connected to the moving block via an adjustable connection piece, and by adjusting the adjustable connection piece, light emitted by the light emitter enters the imaging probe after being reflected by a sample. The moving block in the translational electric motor is configured to move the light emitter and the imaging probe in the radial direction right above the sample. The light emitter is configured to emit light on the upper surface of the sample. The imaging probe is configured to image reflected light from the upper surface of the sample.

Abstract: A method for large scale bonding carbon nanotubes on metallic electrodes is disclosed. The method includes that the wafer with a number of patterned electrodes deposited by CNTs via dielectrophoresis method is put onto the pedestal of our designed RF induction heating system. Then, the winding with alternating current induces scroll current on the surface of metallic electrodes due to skin effect. In this case, the current will generate Joule heat which could melt the surface metal of the electrodes. Finally, the CNTs will sink into the surface of the electrodes after short time heating. By varying the parameters of the RF source we can control the bonding process.

Abstract: A novel light-emitting diode structure is proposed wherein the epitaxial layers are cleaved to micro-units to suppress transverse propagation of light generated in active layer and improve light extraction efficiency. Further enhancement in light output will be obtained by introducing a light extraction layer with microstructures or directly structuring the top surface of each micro-unit. Another advantage of the method is effective thermal dissipation due to the hollowed-out pattern and possible buried heat conductive materials.

Abstract: A single integrated sensing chip with multi-functions for tire pressure monitor system (TPMS) comprises: a pressure sensor, an accelerometer, a temperature sensor, and an ASIC (Applied Specific Integrated Circuit) that implements signal conditioning and digitalizes pressure output. The accelerometer incorporated for vehicle motion is used to determine centrifugal acceleration or three-axial acceleration of the rotating wheel, and used for the TPMS sensor wake-up from “power down” mode, or when the velocity of the vehicle is higher than certain speed threshold, which is more robust and lower in cost than the mechanical vibration switch and is naturally integrated with the electronic control unit. The accelerometer can be used for regular motion sensing to monitor the dynamic stability.