Abstract: Structures, methods, and apparatus for protecting interconnections between components and boards in an electronic device from damage resulting from a physical shock. This damage can occur due to differential tensile forces being applied between the component and the board during a drop or other shock event. An example can reduce or prevent damage by providing differential compression forces between the component and board that can cancel differential tensile forces between the component and board during the shock event. Another example can reduce or prevent damage by reducing differential tensile forces between a component and board. Another example can secure a component to the board to directly reduce the differential force in order to prevent damage.

Abstract: A system may have a window. The system may be a vehicle having a vehicle body. The window may serve as a front window in the vehicle body, a rear window in the vehicle body, a side or roof window, or other window. A window may include one or more structural glass layers. A layer of polymer may be used to attach glass layers together. An electrically adjustable component such as a light modulator layer may be included between structural glass layers. The glass layers may be characterized by regions of compound curvature. To ensure satisfactory optical performance, the window layers may be formed from molded sheets of glass that are shaped in a molding tool with draw beads of various strengths. The molded glass layers may exhibit low amounts of thickness variation.