Patents by Inventor ZHIYONG SIMON SUN

ZHIYONG SIMON SUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated package design with wire leads for package-on-package product
    Patent number: 9960104
    Abstract: An integrated package design for a package-on-package product is described that uses wire leads. Some embodiments pertain to a stacked package assembly that includes a first die having a front side and a back side, a die paddle attached to the back side of the first die, a plurality of wire leads, one end being connected to the front side of the die for connection to an external device, a mold compound encapsulating the first die and at least a portion of the die paddle, a land pad cut from the die paddle and supported by the mold compound, a second plurality of wire leads, one end of the wire leads being connected to the front side of the first die and the other end of the wire leads being connected to the land pad, a second die stacked over the die paddle and a third plurality of wire leads, one end being connected to the second die and the other end being connected to the land pad.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: May 1, 2018
    Assignee: Intel Corporation
    Inventor: Zhiyong Simon Sun
  • INTEGRATED PACKAGE DESIGN WITH WIRE LEADS FOR PACKAGE-ON-PACKAGE PRODUCT
    Publication number: 20160372404
    Abstract: An integrated package design for a package-on-package product is described that uses wire leads. Some embodiments pertain to a stacked package assembly that includes a first die having a front side and a back side, a die paddle attached to the back side of the first die, a plurality of wire leads, one end being connected to the front side of the die for connection to an external device, a mold compound encapsulating the first die and at least a portion of the die paddle, a land pad cut from the die paddle and supported by the mold compound, a second plurality of wire leads, one end of the wire leads being connected to the front side of the first die and the other end of the wire leads being connected to the land pad, a second die stacked over the die paddle and a third plurality of wire leads, one end being connected to the second die and the other end being connected to the land pad.
    Type: Application
    Filed: December 23, 2014
    Publication date: December 22, 2016
    Applicant: INTEL CORPORATION
    Inventor: ZHIYONG SIMON SUN