Abstract: A composition comprises at least one silver nanoparticulate material, at least one conductive microparticulate material, and less than about 3% wt of an organic or polymeric resin. The composition provides a low curing temperature and upon cure good film properties. Also provided herein is a method of using an ink or paste, comprising: (i) providing the ink or paste comprising at least one silver nanoparticulate material, at least one conductive microparticulate material, and less than about 3% wt of an organic or polymeric resin; and (ii) curing the ink or paste at a temperature at lower than about 200° C. to decompose the organic resin.