Patents by Inventor Zhiyu Yu

Zhiyu Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230319974
    Abstract: The invention relates to a detachable and separated heat dissipation device, which is characterized by comprising a PCBA circuit board, a metal pressure lock, a metal heat-conducting support, a heat-pipe heat-dissipating module and a convection fan, and one side of the metal heat-conducting support is provided with an insulating heat-conducting pad, the metal heat-conducting bracket is arranged on the PCBA circuit board, the metal heat-conducting bracket is provided with an installation slot, and the heat pipe extension of the heat pipe cooling module is inserted into the preset installation slot of the metal heat-conducting bracket, the PCBA The electronic heating elements arranged in a row on the circuit board are fixed on the insulating and heat-conducting pad of the metal heat-conducting support through screws. The advantages of the present invention are that the working efficiency of electronic components can be improved to meet this demand and provide better temperature rise redundancy.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 5, 2023
    Inventor: Zhiyu Yu
  • Patent number: D955329
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: June 21, 2022
    Inventor: Zhiyu Yu