Patents by Inventor ZhiZhong Tang
ZhiZhong Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11860308Abstract: An integrated chip packaging for a LIDAR sensor mounted to a vehicle includes a laser assembly configured to output a beam, an optical amplifier array chip configured to amplify a beam, and a transceiver chip coupled to the laser assembly and the optical amplifier array chip. The transceiver chip may be configured to emit the beam with reference to a first surface of the transceiver chip through an optical window and receive a reflected beam from a target through the optical window. The integrated chip packaging for the LIDAR sensor defines the configuration of optical components for providing a path for the optical signal to travel in and out of the LIDAR sensor and dissipating the heat generated by the optical components for improved performance.Type: GrantFiled: November 16, 2022Date of Patent: January 2, 2024Assignee: Aurora Operations, Inc.Inventors: Colin Delaney, James Ferrara, Stefan Heinemann, Amir Hosseini, Pruthvi Jujjavarapu, Yongxuan Liang, Parth Panchal, Zhizhong Tang
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Patent number: 11789221Abstract: An optical sub-assembly includes a diode submount structure, a diode mounted to the diode submount, and a thermoelectric cooler (TEC). The TEC is in thermal contact with the diode, and the diode is positioned between the diode submount structure and the TEC.Type: GrantFiled: October 5, 2021Date of Patent: October 17, 2023Assignee: Aeva, Inc.Inventors: Zhizhong Tang, Wenjing Liang, Kevin Kinichi Masuda, Pradeep Srinivasan
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Publication number: 20230327395Abstract: Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.Type: ApplicationFiled: June 16, 2023Publication date: October 12, 2023Inventors: Zhizhong Tang, Pradeep Srinivasan, Kevin Masuda, Wenjing Liang
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Publication number: 20230305245Abstract: A method of cooling an optical sub-assembly includes operating a diode mounted to a diode submount structure and cooling the diode with a thermoelectric cooler (TEC) in thermal contact with the diode, wherein the diode is positioned between the diode submount structure and the TEC.Type: ApplicationFiled: May 22, 2023Publication date: September 28, 2023Inventors: Zhizhong TANG, Wenjing LIANG, Kevin Kinichi MASUDA, Pradeep SRINIVASAN
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Patent number: 11768279Abstract: A light detection and ranging (LIDAR) system and apparatus including a photonics chip mounted to a substrate, the photonics chip including one or more optical components and one or more electrical components and one or more integrated circuit (IC) chips mounted to the photonics chip to process an electrical signal generated by the one or more optical components and the one or more electrical components, wherein the one or more IC chips are physically separated from the substrate to reduce crosstalk on the LIDAR apparatus.Type: GrantFiled: June 24, 2022Date of Patent: September 26, 2023Assignee: Aeva, Inc.Inventors: Zhizhong Tang, Pradeep Srinivasan, Bing Shen
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Patent number: 11754687Abstract: A modular LIDAR system comprising a seed laser configured to output a beam, a modular modulator coupled to receive the beam output the seed laser and modulate the beam to create a modulated beam, a modular amplifier coupled to receive the modulated beam from the modular modulator and generate an amplified beam, and a modular transceiver chip coupled to the modular modulator and the modular amplifier, the transceiver chip configured to emit the beam perpendicularly from a first surface of the transceiver chip through an optical window; and receive a reflected beam from a target through the optical window.Type: GrantFiled: December 30, 2022Date of Patent: September 12, 2023Assignee: AURORA OPERATIONS, INC.Inventors: Ashish Bhardwaj, Colin Delaney, Stefan Heinemann, Amir Hosseini, Pruthvi Jujjavarapu, Parth Panchai, Zhizhong Tang
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Patent number: 11715929Abstract: Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.Type: GrantFiled: May 2, 2022Date of Patent: August 1, 2023Assignee: Aeva, Inc.Inventors: Zhizhong Tang, Pradeep Srinivasan, Kevin Masuda, Wenjing Liang
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Publication number: 20230123042Abstract: Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.Type: ApplicationFiled: May 2, 2022Publication date: April 20, 2023Inventors: Zhizhong Tang, Pradeep Srinivasan, Kevin Masuda, Wenjing Liang
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Publication number: 20230103569Abstract: An optical sub-assembly includes a diode submount structure, a diode mounted to the diode submount, and a thermoelectric cooler (TEC). The TEC is in thermal contact with the diode, and the diode is positioned between the diode submount structure and the TEC.Type: ApplicationFiled: October 5, 2021Publication date: April 6, 2023Applicant: AEVA, INC.Inventors: Zhizhong Tang, Wenjing Liang, Kevin Kinichi Masuda, Pradeep Srinivasan
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Publication number: 20230106643Abstract: A light detection and ranging (LIDAR) system and apparatus including a photonics chip mounted to a substrate, the photonics chip including one or more optical components and one or more electrical components and one or more integrated circuit (IC) chips mounted to the photonics chip to process an electrical signal generated by the one or more optical components and the one or more electrical components, wherein the one or more IC chips are physically separated from the substrate to reduce crosstalk on the LIDAR apparatus.Type: ApplicationFiled: June 24, 2022Publication date: April 6, 2023Inventors: Zhizhong Tang, Pradeep Srinivasan, Bing Shen
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Patent number: 11378664Abstract: A light detection and ranging (LIDAR) system and apparatus including a photonics chip coupled to a substrate, the photonics chip including an optical source to generate an optical beam, a waveguide to direct the optical beam through the photonics chip, a photodetector to generate an electrical signal in response to detecting a return signal, and an optical coupler to transmit the optical beam from the waveguide to a target in the field of view of the LIDAR apparatus. The system and apparatus may further include an integrated circuit (IC) chip coupled to the photonics chip, the IC chip to process the electrical signal generated by the photodetector.Type: GrantFiled: October 5, 2021Date of Patent: July 5, 2022Assignee: Aeva, Inc.Inventors: Zhizhong Tang, Pradeep Srinivasan, Bing Shen
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Patent number: 11362485Abstract: Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.Type: GrantFiled: October 15, 2021Date of Patent: June 14, 2022Assignee: Aeva, Inc.Inventors: Zhizhong Tang, Pradeep Srinivasan, Kevin Masuda, Wenjing Liang
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Patent number: 10969840Abstract: Disclosed herein are embodiments of heat spreaders with interlocked inserts, and related devices and methods. In some embodiments, a heat spreader may include: a frame formed of a first material, wherein the frame includes an opening, a projection of the frame extends into the opening, and the projection has a top surface, a side surface, and a bottom surface; a recess having at least one sidewall formed by the frame; and an insert formed of a second material different from the first material, wherein the insert is disposed in the frame and in contact with the top surface, the side surface, and the bottom surface of the projection.Type: GrantFiled: November 16, 2015Date of Patent: April 6, 2021Assignee: Intel CorporationInventors: Aravindha R. Antoniswamy, Syadwad Jain, Zhizhong Tang, Wei Hu
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Patent number: 10763188Abstract: Integrated heat spreaders having electromagnetically-formed features, and semiconductor packages incorporating such integrated heat spreaders, are described. In an example, an integrated heat spreader includes a top plate flattened using an electromagnetic forming process. Methods of manufacturing integrated heat spreaders having electromagnetically-formed features are also described.Type: GrantFiled: December 23, 2015Date of Patent: September 1, 2020Assignee: Intel CorporationInventors: Aravindha R. Antoniswamy, Thomas John Fitzgerald, Kumaran Murugesan Chakravarthy, Syadwad Jain, Wei Hu, Zhizhong Tang
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Patent number: 10651108Abstract: Devices and methods disclosed herein can include a conductive foam having pores disposed within the conductive foam. The conductive foam can be compressible between an uncompressed thickness and a compressed thickness. The compressed thickness can be ninety-five percent or less of the uncompressed thickness. In one example, a filler can be disposed in the pores of the conductive foam. The filler can include a first thermal conductivity. The first thermal conductivity can be greater than a thermal conductivity of air.Type: GrantFiled: June 29, 2016Date of Patent: May 12, 2020Assignee: Intel CorporationInventors: Zhizhong Tang, Syadwad Jain, Wei Hu, Michael A. Schroeder, Rajen S. Sidhu, Carl L. Deppisch, Patrick Nardi, Kelly P. Lofgreen, Manish Dubey
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Publication number: 20190079567Abstract: Disclosed herein are embodiments of heat spreaders with interlocked inserts, and related devices and methods. In some embodiments, a heat spreader may include: a frame formed of a first material, wherein the frame includes an opening, a projection of the frame extends into the opening, and the projection has a top surface, a side surface, and a bottom surface; a recess having at least one sidewall formed by the frame; and an insert formed of a second material different from the first material, wherein the insert is disposed in the frame and in contact with the top surface, the side surface, and the bottom surface of the projection.Type: ApplicationFiled: November 16, 2015Publication date: March 14, 2019Applicant: Intel CorporationInventors: Aravindha R. Antoniswamy, Syadwad Jain, Zhizhong Tang, Wei Hu
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Patent number: 10214340Abstract: A container assembly and system for dispensing a stack of electronic device components includes an elongated tube having a cavity configured to contain a stack of said components. The tube has a dispensing end opposite an access end and a dispenser opening sized to dispense the electronic device components. The access end has an access opening sized to allow entry of a press to push the stack upwardly. A retainer is positioned proximate the access end to engage a last component in the stack and prevent it from exiting the tube through the access opening. The retainer may include a plurality of retainers. The retainer(s) can be a pair of retainers, four retainers, a chamfer formed in the tube, a perimeter insert, and/or a slidable panel. A method of making and a method of dispensing are provided.Type: GrantFiled: July 1, 2016Date of Patent: February 26, 2019Assignee: Intel CorporationInventors: Mingjie Xu, Pan Gu, Bassam M. Ziadeh, Michael Garcia, Zhizhong Tang
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Publication number: 20190043778Abstract: Embodiments are generally directed to a swaging process for complex integrated heat spreaders. An embodiment of an integrated heat spreader includes components, each of the components including one or more swage points; and a multiple swage joints, each swage joint including a swage pin joining two or more components, wherein components are joined into a single integrated heat spreader unit by the swage joints.Type: ApplicationFiled: December 26, 2015Publication date: February 7, 2019Inventors: Zhizhong TANG, Shinobu KOURAKATA, Kazuo OGATA, Paul R. START, Syadwad JIAN, William Nicholas LABANOK, Wei HU, Peng LI, Douglas R. YOUNG, Gregory S. CONSTABLE, John J. Beatty, Pardeep K. BHATTI, Luke J. GARNER, Aravindha R. ANTONISWAMY
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Publication number: 20190027379Abstract: Disclosed herein are embodiments of sintered heat spreaders with inserts and related devices and methods. In some embodiments, a heat spreader may include: a frame including aluminum and a polymer binder; an insert disposed in the frame, wherein the insert has a thermal conductivity higher than a thermal conductivity of the frame; and a recess having at least one sidewall formed by the frame. The polymer binder may be left over from sintering frame material and insert material to form the heat spreader.Type: ApplicationFiled: November 16, 2015Publication date: January 24, 2019Applicant: Intel CorporationInventors: Wei Hu, Aravindha R. Antoniswamy, Thomas J. Fitzgerald, Nikunj P. Patel, Syadwad Jain, Zhizhong Tang, Shrenik Kothari
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Publication number: 20180002101Abstract: A container assembly and system for dispensing a stack of electronic device components includes an elongated tube having a cavity configured to contain a stack of said components. The tube has a dispensing end opposite an access end and a dispenser opening sized to dispense the electronic device components. The access end has an access opening sized to allow entry of a press to push the stack upwardly. A retainer is positioned proximate the access end to engage a last component in the stack and prevent it from exiting the tube through the access opening. The retainer may include a plurality of retainers. The retainer(s) can be a pair of retainers, four retainers, a chamfer formed in the tube, a perimeter insert, and/or a slidable panel. A method of making and a method of dispensing are provided.Type: ApplicationFiled: July 1, 2016Publication date: January 4, 2018Applicant: Intel CorporationInventors: Mingjie Xu, Pan GU, Bassam M. Ziadeh, Michael Garcia, Zhizhong Tang