Patents by Inventor Zhong-Xiang Ile

Zhong-Xiang Ile has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure, design structure and method of manufacturing a structure having VIAS and high density capacitors
    Patent number: 8125013
    Abstract: A semiconductor structure and design structure includes at least a first trench and a second trench having different depths arranged in a substrate, a capacitor arranged in the first trench, and a via arranged in the second trench.
    Type: Grant
    Filed: August 14, 2008
    Date of Patent: February 28, 2012
    Assignee: International Business Machines Corporation
    Inventors: David S. Collins, Kai D. Feng, Zhong-Xiang Ile, Peter J. Lindgren, Robert M. Rassel
  • Structure, Design Structure and Method of Manufacturing a Structure Having VIAS and High Density Capacitors
    Publication number: 20100038750
    Abstract: A semiconductor structure and design structure includes at least a first trench and a second trench having different depths arranged in a substrate, a capacitor arranged in the first trench, and a via arranged in the second trench.
    Type: Application
    Filed: August 14, 2008
    Publication date: February 18, 2010
    Inventors: David S. Collins, Kai D. Feng, Zhong-Xiang Ile, Peter J. Lindgren, Robert M. Rassel