Abstract: Disclosed herein is a flexible sensing interface, comprising: a sensor, comprising: a core; an inner electrode in the form of a conductive material in contact with the core; an inner dielectric material substantially encasing the inner electrode; an outer electrode in the form of a conductive material in contact with the inner dielectric material and in electrical communication with the inner electrode; and an outer dielectric material substantially encasing the outer electrode; wherein the inner dielectric material and the outer dielectric material comprise an elastic material. Also disclosed herein are systems and methods for making and using the same.

Abstract: The present invention provides a substrate for a semiconductor and the semiconductor package, wherein with the setup that the conductive fingers around the chip of enclosure structure superposes with the electrical connecting element, the distance between the conductive fingers and the chip will be shortened, so as to effectively shorten the wires from the chip to the conductive fingers and reduce the materials and the processing time, in favor of cutting down the cost of production.