Abstract: Disclosed is a method for preparing an environmentally-friendly high-strength wood composite material, which includes the following steps: S1. pulverizing wood into a wood flour, adding the wood flour to an acid solution to obtain a first mixture, ball milling the first mixture to obtain a ball milled mixture, and filtering the ball milled mixture, to obtain a dually-treated wood flour; S2. adding the dually-treated wood flour to a first alkaline solution, and performing a neutralization reaction, to obtain a second mixture; S3. adding an alkaline solution to the second mixture to remove part of lignin, to obtain a lignin-partially removed wood flour; S4. washing the lignin-partially removed wood flour with anhydrous ethanol and drying, to obtain a dried lignin-partially removed wood flour; S5. subjecting the dried lignin-partially removed wood flour to hot pressing, followed by cooling, to obtain the environmentally-friendly high-strength wood composite material.

Abstract: A reference via in a set of plated vias on a printed circuit board is located. A reference lead is applied to the reference via. A test via in the set of plated vias is located. A test lead is applied to the test via. An electrical conductance between the reference via and the test via is measured. A property of a core layer of the printed circuit board is identified based on the electrical conductance.

Abstract: A computer-readable code array comprises a first three-dimensional module and second three-dimensional module. The first three-dimensional module comprises a first face and a second face. A state of the first face encodes a pixel of a first computer-readable code. A state of the second face encodes a pixel of a second computer-readable code. The second three-dimensional module comprises a third face and a fourth face. A state of the third face encodes a second pixel of the first computer-readable code. A state of the second face encodes a second pixel of the second computer-readable code.

Abstract: A computer-readable code array comprises a first three-dimensional module and second three-dimensional module. The first three-dimensional module comprises a first face and a second face. A state of the first face encodes a pixel of a first computer-readable code. A state of the second face encodes a pixel of a second computer-readable code. The second three-dimensional module comprises a third face and a fourth face. A state of the third face encodes a second pixel of the first computer-readable code. A state of the second face encodes a second pixel of the second computer-readable code.

Abstract: A reference via in a set of plated vias on a printed circuit board is located. A reference lead is applied to the reference via. A test via in the set of plated vias is located. A test lead is applied to the test via. An electrical conductance between the reference via and the test via is measured. A property of a core layer of the printed circuit board is identified based on the electrical conductance.

Abstract: A compliant pin pre-screening, guiding and quality monitoring apparatus is provided. The compliant pin pre-screening, guiding and quality monitoring apparatus includes a fixed plate, a movable plate, a printed circuit board (PCB) and a press-fit connector. The fixed plate defines a through-hole and is disposable above a working table. The movable plate is disposable to be urged by a bias against a first surface of the fixed plate facing the working table and includes pin extendable through the through-hole. The PCB defines a via and is disposable on a second surface of the fixed plate opposite the first surface whereby the pin is extendable through the via with the via corresponding in position to the through-hole and the pin. The press-fit connector is disposable to be secured in position proximate to the PCB and to be inserted into the via with guidance provided by the pin against the bias.

Abstract: A socket for a card-edge connector comprises a bottom frame end, a top frame end, a first frame portion, a second frame portion, and a slot. A card-edge connector inserted into the slot may proceed from the from the top frame end towards the bottom frame end between the first frame portion and second frame portion. The socket may comprise a pin contact in the first frame portion. The pin contact may comprise a bottom pin that protrudes out of the first frame portion into the slot near the bottom frame end, a pin shaft located within the first frame portion and connected to the bottom pin section, and a top pin section connected to the pin shaft and located within the first frame portion. The socket may comprise a pin fulcrum located within the first frame portion. The pin fulcrum may contact the pin shaft at a fulcrum point.

Abstract: A compliant pin pre-screening, guiding and quality monitoring apparatus is provided. The compliant pin pre-screening, guiding and quality monitoring apparatus includes a fixed plate, a movable plate, a printed circuit board (PCB) and a press-fit connector. The fixed plate defines a through-hole and is disposable above a working table. The movable plate is disposable to be urged by a bias against a first surface of the fixed plate facing the working table and includes pin extendable through the through-hole. The PCB defines a via and is disposable on a second surface of the fixed plate opposite the first surface whereby the pin is extendable through the via with the via corresponding in position to the through-hole and the pin. The press-fit connector is disposable to be secured in position proximate to the PCB and to be inserted into the via with guidance provided by the pin against the bias.

Abstract: In an approach to creating a press-fit force analysis, one or more computer processors retrieve a force press-fit data from a press-fit machine based on a press cycle. One or more computer processors calculate a deformation force of the press cycle based on the press-fit data and storing the deformation force. One or more computer processors create a predictive control model based on the deformation force and determine if a corrective action is required based on at least one of a raw material quality data, machine setting data, a completed lot quality data or the predictive control model. One or more computer processors determine if a corrective action is required and alert a downstream process to take the corrective action. One or more computer processors schedule a material kitting.

Abstract: In an approach to creating a press-fit force analysis, one or more computer processors retrieve a force press-fit data from a press-fit machine based on a press cycle. One or more computer processors calculate a deformation force of the press cycle based on the press-fit data and storing the deformation force. One or more computer processors create a predictive control model based on the deformation force and determine if a corrective action is required based on at least one of a raw material quality data, machine setting data, a completed lot quality data or the predictive control model. One or more computer processors determine if a corrective action is required and alert a downstream process to take the corrective action. One or more computer processors schedule a material kitting.

Abstract: In an approach to creating a press-fit force analysis, one or more computer processors retrieve a force press-fit data from a press-fit machine based on a press cycle. One or more computer processors calculate a deformation force of the press cycle based on the press-fit data and storing the deformation force. One or more computer processors create a predictive control model based on the deformation force and determine if a corrective action is required based on at least one of a raw material quality data, machine setting data, a completed lot quality data or the predictive control model. One or more computer processors determine if a corrective action is required and alert a downstream process to take the corrective action. One or more computer processors schedule a material kitting.