Abstract: A liquid cooling device includes a cooling base plate, a first sealing cover plate and a first sealing tube, wherein the first sealing cover plate and the cooling base plate form a first sealing cavity; and the first sealing tube and the first sealing cavity form a liquid cooling channel used for conveying a liquid cooling medium; a second sealing cover plate is fixed on the cooling base plate, and a second sealing tube is fixed on the second sealing cover plate, the second sealing cover plate and the second sealing tube form a second sealing cavity. The liquid cooling device has an excellent sealing performance, and a reliability problem caused by water leakage of the first sealing cavity is eliminated, thus improving the safety of the liquid cooling device.

Abstract: A liquid-cooling heat dissipation device includes a pipeline outlet formed on an exterior sidewall of a chassis, wherein the exterior sidewall is an exterior wall of side panel in contact with a chassis panel and an IO port panel of the chassis, a circuit board fixed on an inner bottom surface of the chassis, an evaporator fixed on the circuit board with a preset gap, forming an accommodating space with the circuit board, a heat-generating electronic component mounted on the circuit board within the accommodating space, electrically connected to the circuit board and thermally connected to the evaporator, a condenser fixed to the exterior sidewall where the pipeline outlet is located, and a vapor pipeline and a liquid pipeline pass through the pipeline outlet, connecting the evaporator and the condenser.

Abstract: The present disclosure discloses a liquid-cooled cold plate device, comprising a microchannel cold plate for dissipating heat of the electronic system, at least two microchannel groups, disposed inside the microchannel cold plate; at least one liquid inlet, provided on the microchannel cold plate and used for the cooling liquid to flow in; at least one liquid outlet provided on the microchannel cold plate and used for the cooling liquid to flow out; the cooling liquid entering the liquid inlet is divided into one cooling liquid branch; the cooling liquid branch flows bidirectionally through the microchannels group. The present disclosure uses a combination of microchannel cold plates and microchannel groups, greatly improves the heat dissipation efficiency, reduces the influence of thermal cascade, thus is beneficial to the efficient heat dissipation of electronic system.

Abstract: A closed loop liquid cooler and an electronic device using the same. The closed loop liquid cooler includes: a first liquid cooling module and a second liquid cooling module, where a cooling reflux at an output end of the first liquid cooling module is outputted to a cooling liquid input end of the second liquid cooling module; and a cooling reflux at an output end of the second liquid cooling module is outputted to a cooling liquid input end of the first liquid cooling module.

Abstract: The present disclosure discloses a liquid-cooled cold plate device, comprising a microchannel cold plate for dissipating heat of the electronic system, at least two microchannel groups, disposed inside the microchannel cold plate; at least one liquid inlet, provided on the microchannel cold plate and used for the cooling liquid to flow in; at least one liquid outlet provided on the microchannel cold plate and used for the cooling liquid to flow out; the cooling liquid entering the liquid inlet is divided into one cooling liquid branch; the cooling liquid branch flows bidirectionally through the microchannels group. The present disclosure uses a combination of microchannel cold plates and microchannel groups, greatly improves the heat dissipation efficiency, reduces the influence of thermal cascade, thus is beneficial to the efficient heat dissipation of electronic system.

Abstract: The present disclosure provides a closed loop liquid cooler and an electronic device using the same. The closed loop liquid cooler includes: a first liquid cooling module and a second liquid cooling module, where a cooling reflux at an output end of the first liquid cooling module is outputted to a cooling liquid input end of the second liquid cooling module; and a cooling reflux at an output end of the second liquid cooling module is outputted to a cooling liquid input end of the first liquid cooling module.

Abstract: The present disclosure provides a cabinet and a heat dissipation system. The cabinet includes: an operating compartment, disposed on one side of a heat dissipation substrate, where the operating compartment is configured to accommodate a server; and a heat dissipation compartment, disposed on the other side of the heat dissipation substrate. Both the heat dissipation compartment and the operating compartment share the heat dissipation substrate as a compartment wall. The operating compartment is separated from the heat dissipation compartment by using the heat dissipation substrate. The heat dissipation compartment accommodates multiple heat dissipation fins, and the multiple heat dissipation fins are connected to the heat dissipation substrate. An air intake vent is disposed in a first compartment wall of the heat dissipation compartment, and an air exhaust vent is disposed in a second compartment wall of the heat dissipation compartment disclosure.

Abstract: The present disclosure provides a cabinet and a heat dissipation system. The cabinet includes: an operating compartment, disposed on one side of a heat dissipation substrate, where the operating compartment is configured to accommodate a server; and a heat dissipation compartment, disposed on the other side of the heat dissipation substrate. Both the heat dissipation compartment and the operating compartment share the heat dissipation substrate as a compartment wall. The operating compartment is separated from the heat dissipation compartment by using the heat dissipation substrate. The heat dissipation compartment accommodates multiple heat dissipation fins, and the multiple heat dissipation fins are connected to the heat dissipation substrate. An air intake vent is disposed in a first compartment wall of the heat dissipation compartment, and an air exhaust vent is disposed in a second compartment wall of the heat dissipation compartment disclosure.