Abstract: This application provides a vapor generation system and a vapor generation device, configured to heat an aerosol-generating product to generate an aerosol. The vapor generation device includes a main housing; and the main housing includes: a heating assembly, configured to heat the aerosol-generating product; and a door cover, movably coupled to the main housing at a first position and a second position, where the door cover covers the heating assembly at the first position, and exposes the heating assembly at the second position. The foregoing vapor generation device selectively covers or exposes the heating assembly through the door cover, then exposes the heating assembly as required, and covers the heating assembly after use to protect the heating assembly.

Abstract: An aerosol generator includes a first vaporizer, a circuit board, and a connecting assembly. The connecting assembly includes a conductive connector electrically connecting a first electrode to a second electrode. The first electrode is separably connected to the second electrode by means of the connector. The first electrode and the second electrode are located on a same side of the connector. Since the first vaporizer and the circuit board are located on a same side with respect to the connecting assembly, the first electrode is indirectly electrically connected to the second electrode by means of the connector, and at least one of the first electrode and the second electrode is separable from the connector. When the first vaporizer needs to be removed, the first electrode is electrically disconnected from the second electrode, or when the first vaporizer is loaded, the first electrode may be electrically connected to the second electrode.

Abstract: This application provides a vaporizer and an aerosol generation apparatus. The vaporizer includes a housing, where the housing has a liquid storage cavity and a first air outlet channel; a fixing bracket, mounted inside the housing, where the fixing bracket has a liquid guide portion extending toward the liquid storage cavity, where at least a part of a surface of the liquid guide portion that faces toward the first air outlet channel is recessed to form a first recessed portion; and a vaporization assembly, fixedly mounted on the fixing bracket, and being in fluid communication with the liquid storage cavity through the liquid guide portion, where the vaporization assembly is configured to vaporize the liquid substrate to form the aerosol. In the vaporizer, a structural design of the fixing bracket and a design of the air outlet channel are simplified, so that the whole structure is simpler.

Abstract: The invention relates to heterocyclic compounds, pharmaceutically acceptable salts thereof, and pharmaceutical preparations thereof. Also described herein are compositions and the use of such compounds in methods of treating diseases and conditions mediated by deficient CFTR activity, in particular cystic fibrosis.

Abstract: This application discloses a vaporizer and an aerosol generation device. The vaporizer includes a housing provided with an open end, where a liquid storage cavity and a vaporization component for vaporizing a liquid substrate to form an aerosol are provided in the housing; a base, covering the open end of the housing, where at least a part of the base defines an air inlet for entry of external air, at least a part of the air inlet extends transversely in a short axis direction of the housing, and the base and the vaporization component jointly define a vaporization cavity; and at least one first airflow channel, connecting the air inlet to the vaporization cavity, where at least a part of the first airflow channel extends longitudinally along the housing.

Abstract: Use of a flurbiprofen axetil (FPA) in preparing a pharmaceutical composition for fever relief in a patient through an intravenous administration route is provided, where the pharmaceutical composition includes FPA at a content of 10 mg to 40 mg, preferably 10 mg to 35 mg, 15 mg to 35 mg, and 15 mg to 30 mg, 15 mg, and 30 mg. The pharmaceutical composition can be safely and effectively used for fever relief in an adult patient. Surprisingly, the pharmaceutical composition has a comparable antipyretic effect and duration to a pharmaceutical composition with high-content FPA, but the pharmaceutical composition with low-content FPA has less adverse reactions. Compared with ibuprofen injections, a single administration of the low-dosage FPA provided by the present disclosure can maintain an antipyretic effect for 6 hours to 10 hours or more, which significantly reduces the administration frequency and improves the compliance of a patient.

Abstract: Disclosed is a method of manufacturing a piezoelectric thin film resonator on a non-silicon substrate, including the following steps: depositing a copper thin film on a silicon wafer; coating photoresist on the copper thin film to perform photoetching so as to remove photoresist in an air gap region under the piezoelectric thin film resonator to be disposed; electroplating-depositing a copper layer, and removing photoresist to obtain a stepped peel sacrifice layer; coating polyimide and performing imidization by heat treatment, making a sandwich structure of the piezoelectric thin film resonator above the polyimide layer; performing etching for the polyimide layer in a region not covered by the piezoelectric thin film resonator by oxygen plasma; placing the obtained device into a copper corrosion solution to dissolve the copper around and under the piezoelectric thin film resonator, attaching a drum coated with polyvinyl alcohol glue onto the piezoelectric thin film resonator, releasing and peeling it from th

Abstract: Disclosed is a method of manufacturing a piezoelectric thin film resonator on a non-silicon substrate, including the following steps: depositing a copper thin film on a silicon wafer; coating photoresist on the copper thin film to perform photoetching so as to remove photoresist in an air gap region under the piezoelectric thin film resonator to be disposed; electroplating-depositing a copper layer, and removing photoresist to obtain a stepped peel sacrifice layer; coating polyimide and performing imidization by heat treatment, making a sandwich structure of the piezoelectric thin film resonator above the polyimide layer; performing etching for the polyimide layer in a region not covered by the piezoelectric thin film resonator by oxygen plasma; placing the obtained device into a copper corrosion solution to dissolve the copper around and under the piezoelectric thin film resonator, attaching a drum coated with polyvinyl alcohol glue onto the piezoelectric thin film resonator, releasing and peeling it from th

Abstract: A microneedle mold and a method of manufacturing a microneedle mold are provided for use in fabricating microneedles. The method includes providing a microneedle mold base with recesses therein, the recesses corresponding to the microneedles to be fabricated and extending from a first surface of the microneedle mold base; and forming side-port forming holes in the microneedle mold base, the side-port forming holes extend in side surfaces of the recesses within the microneedle mold base at side-port forming positions of the recesses.

Abstract: Side-ported microneedles are produced from a suitably shaped microneedle mould (40). A microneedle mould base (32) is made with a number of microneedle mould recesses (30) in it. One surface of the microneedle mould base (32) is coated with a seed layer (34). The microneedle mould base (32) contains two microneedle mould sheets (24, 26), which are separated to gain access to an internal surface of one of the microneedle mould sheets (24, 26). Side-port forming channels (38) are formed on one of the internal surfaces, intersecting with the recesses (30) within the relevant microneedle mould sheet (24). The two microneedle mould sheets (24, 26) are placed back together and joined together as a unitary microneedle mould (40). The microneedles are formed in the recesses (30) by depositing a microneedle layer (44) therein and on the surface with the seed layer (34).

Abstract: A master mould is made by wire cutting a plate in two or more directions to provide a base with an array of master mould needles protruding therefrom. The size and shape of the master mould needles can readily be varied by varying the angles of upward and downward cuts in the two or more directions. The master mould is used to make a secondary mould by hot embossing a secondary mould plate onto the master mould. This forms through-holes in the secondary mould. The secondary mould is plated with a layer of metal, which forms a microneedle array.

Abstract: A laser device has a substrate and at least one GaN-based layer upon a first surface of the substrate, and the laser device is cleaved by cutting linear grooves into a second surface of the substrate such that the grooves are in alignment with vertical planes of the substrate. The substrate and the at least one GaN-based layer are cleaved along the vertical planes. The cutting is performed using a laser beam from an external laser source.

Abstract: The present invention relates to a method for electroless deposition of a metal layer on selected portions of a substrate. A preferred form of the invention relates to a method of depositing a desired metal layer, by electroless deposition, on one or more selected portions of an indium tin oxide (ITO) surface of a substrate. These selected portions are typically transparent conductive paths of ITO. The method includes a number of steps including applying a masking layer onto the surface, the masking layer having one or more apertures formed therein so as to expose the one or more selected portions of the surface: exposing the one or more selected portions of the surface to a colloidal suspension of catalytic particles adapted to adsorb to the substrate surface and to enhance deposition of the desired metal layer, and exposing the one or more selected portions of the surface to an ionic solution containing ions of the desired metal to enable formation of the metal layer.

Abstract: A method of fabricating a cleaved facet of a laser device having a substrate and at least one GaN-based layer formed upon a first surface of the substrate, said method including the following steps: