Abstract: The semiconductor structure manufacturing method includes the steps of: providing a substrate with bit line contact regions and isolation regions located between adjacent bit line contact regions; forming a groove in the substrate, the bottom of the groove exposes the bit line contact region and the isolation region adjacent to the bit line contact region; forming a contact region isolation layer covering at least sidewalls of the groove; and forming a contact region to cover the contact region isolating the surface of the layer and filling the bit line contact layer of the groove, the bit line contact layer being in contact with the bit line contact region at the bottom of the groove; forming a bit line layer on the bit line contact layer. The invention avoids damage to the sidewalls of the active region in the substrate.

Abstract: The present application discloses a semiconductor structure and a method for fabrication. This technique improves the stability of the bit line structure. The semiconductor structure is formed in a bit line trench in a substrate, it includes: a bit line conductive layer formed in the bit line trench, and the top surface of the bit line conductive layer is higher the top surface of the substrate; a barrier layer formed at least partially between the bit line conductive layer and the inner wall of the bit line trench; and an isolation layer formed on top of the bit line conductive layer.

Abstract: The present application relates to a semiconductor structure and a method of manufacturing the same. The method includes: providing a substrate; forming a bitline contact hole located in the substrate, and a non-metal conductive layer with which a surface of the substrate is covered and the bitline contact hole is filled, the non-metal conductive layer provided with a first opening therein, the first opening aligned with the bitline contact hole; forming a metal conductive layer, with which a surface of the non-metal conductive layer is covered; forming an insulation layer, with which a surface of the metal conductive layer surface is covered; and etching the insulation layer, the metal conductive layer, and the non-metal conductive layer to form a bitline structure.

Abstract: A method for preparing voriconazole L-camphorsulphonate and voriconazole. The method for preparing voriconazole L-camphorsulphonate comprises: method 1: dissolving (2R,3S)/(2S,3R) isomer mixture and L-camphor sulphonic acid in water and acetone, and performing crystallisation filtration to obtain voriconazole L-camphorsulphonate; method 2: (a) dissolving a mixture of isomer mixture and L-camphor sulphonic acid in a first solvent and then performing crystallisation filtration; or (a?) dissolving L-camphorsulphonate of the isomer mixture in a first solvent and then performing crystallisation filtration; (b) concentrating the filtrate obtained in step (a) or (a?) into a solid; and (c) dissolving the solid obtained in step (b) in a second solvent and performing crystallisation filtration to obtain voriconazole L-camphorsulphonate. Adjusting the resolution solvent effectively reduces production costs and facilitates recycling of the resolution solvent.

Abstract: A fast disintegrating thermally gelling hydroxypropyl methylcellulose (Hypromellose, HPMC) empty capsule can be formed from HPMC 2910 that has a methoxyl content of 27.0% to 30.0% (w/w) and a hydroxylpropoxyl content of 7.0% to 12.0% (w/w). Except for adding a small amount of opacifier and/or colorant, according to customer requirements, the composition can be free of any plasticizer, moisturizing agent, stabilizer, coagulant and other auxiliary materials. The resulting capsule dipped by thermal gelation method has no cracks or wrinkles. The resulting capsule exhibits rapid disintegration release, independent of any dissolution medium, that is significantly faster than capsules dipped by thermal gelation using Hypromellose 2906.

Abstract: A pullulan empty hard capsule and a preparation method therefor. The empty hard capsule includes the following components: 82-89 wt % of pullulan having a pH of 6-7, 1-1.4 wt % of gelling agent, 0.8-1.4 wt % of coagulant aid, 0.01-0.04 wt % of humectant, 0.01-0.04 wt % of surfactant, and 10-14 wt % of purified water. The preparation method for the pullulan empty hard capsule includes: weighing the components; dissolving the gelling agent, the coagulant aid, the humectant, the surfactant, a light-screening agent, a food coloring with 80-90° C. purified water, putting the dissolved substances into a gel dissolving barrel, stirring till the gelling agent is dissolved, adding the pullulan having a pH of 6-7 while stirring, after the pullulan is completely dissolved, cooling, preparing a capsule by means of a glue dipping method, and drying.

Abstract: A method for the production of empty pullulan capsules eliminate the need to dry pullulan solid product, thereby reducing the equipment cost and energy consumption. The pullulan raw material production can be linked directly with the capsule production to provide a unique approach for empty capsule formation. The purified pullulan fermentation fluid can be directly used in capsule preparation, thus removing the need for a melting process. On the one hand, the method may decrease material consumption, save the cost of equipment and labor, reduce production time and increase productivity. On the other hand, the method may reduce the fluctuating of raw material quality in the re-melting process and guarantee a more stable capsule production and quality.

Abstract: A method for the production of pullulan soft capsules eliminates the need to dry pullulan solid product, thereby reducing the equipment cost and energy consumption. The pullulan raw material production can be linked directly with the soft capsule production to provide a unique approach for soft capsule formation. The purified pullulan fermentation fluid can be directly used in soft capsule preparation, thus removing the need for a melting process. On the one hand, the method can decrease material consumption, save the cost of equipment and labor, reduce production time and increase productivity. On the other hand, the method can reduce the fluctuating of raw material quality in the re-melting process and guarantee a more stable soft capsule production and quality.

Abstract: A method for the production of pullulan soft capsules eliminates the need to dry pullulan solid product, thereby reducing the equipment cost and energy consumption. The pullulan raw material production can be linked directly with the soft capsule production to provide a unique approach for soft capsule formation. The purified pullulan fermentation fluid can be directly used in soft capsule preparation, thus removing the need for a melting process. On the one hand, the method can decrease material consumption, save the cost of equipment and labor, reduce production time and increase productivity. On the other hand, the method can reduce the fluctuating of raw material quality in the re-melting process and guarantee a more stable soft capsule production and quality.

Abstract: A method for the production of empty pullulan capsules eliminate the need to dry pullulan solid product, thereby reducing the equipment cost and energy consumption. The pullulan raw material production can be linked directly with the capsule production to provide a unique approach for empty capsule formation. The purified pullulan fermentation fluid can be directly used in capsule preparation, thus removing the need for a melting process. On the one hand, the method may decrease material consumption, save the cost of equipment and labor, reduce production time and increase productivity. On the other hand, the method may reduce the fluctuating of raw material quality in the re-melting process and guarantee a more stable capsule production and quality.