Patents by Inventor Zhongning Liang

Zhongning Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with isolated intermetal dielectrics
    Patent number: 6879015
    Abstract: The invention relates to a semiconductor device comprising bond pad structure, which bond pad structure comprises a bond pad disposed above at least one layered stricture, but preferably a stack of layered structures, wherein the layered structure comprises a metal layer and a layer of a dielectric material. In the layer of dielectric material via lines are present and arranged in such a way that the metal layers and the via lines form isolated areas filled with the dielectric material.
    Type: Grant
    Filed: April 10, 2001
    Date of Patent: April 12, 2005
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Zhongning Liang, Erik Jan Lous
  • Semiconductor device
    Publication number: 20010045669
    Abstract: The invention relates to a semiconductor device comprising a bond pad structure, which bond pad structure comprises a bond pad disposed above at least one layered structure, but preferably a stack of layered structures, wherein the layered structure comprises a metal layer and a layer of a dielectric material. In the layer of dielectric material via lines are present and arranged in such a way that the metal layers and the via lines form isolated areas filled with the dielectric material.
    Type: Application
    Filed: April 10, 2001
    Publication date: November 29, 2001
    Inventors: Zhongning Liang, Erik Jan Lous