Patents by Inventor Zhongning LIU

Zhongning LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUBSTRATE COMPRISING AN INDUCTIVE COUPLER FOR SIGNAL LEAKAGE REDUCTION
    Publication number: 20240047131
    Abstract: A substrate that includes at least one dielectric layer and an inductive coupler formed in the at least one dielectric layer. The inductive coupler includes a first inductor and a second inductor. The first inductor is formed in the at least one dielectric layer. The first inductor is configured to be electrically coupled to a transmitter filter and an antenna. The second inductor is formed in the at least one dielectric layer. The second inductor is configured to be electrically coupled to the transmitter filter and ground. The second inductor is configured to provide a path to ground for a rejected signal having a rejected frequency. The second inductor is configured such that the rejected signal traveling through the second inductor causes the first inductor to generate an induced signal that counteracts a leakage signal traveling through the transmission filter.
    Type: Application
    Filed: October 19, 2023
    Publication date: February 8, 2024
    Inventors: Rui TANG, Chenqian GAN, Zhongning LIU
  • Substrate comprising an inductive coupler for signal leakage reduction
    Patent number: 11823831
    Abstract: A substrate that includes at least one dielectric layer and an inductive coupler formed in the at least one dielectric layer. The inductive coupler includes a first inductor and a second inductor. The first inductor is formed in the at least one dielectric layer. The first inductor is configured to be coupled to a transmitter filter and an antenna. The second inductor is formed in the at least one dielectric layer. The second inductor is configured to be coupled to the transmitter filter and ground. The second inductor is configured to provide a path to ground for a rejected signal having a rejected frequency. The second inductor is configured such that the rejected signal traveling through the second inductor causes the first inductor to generate an induced signal that counteracts a leakage signal traveling through the transmission filter.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: November 21, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Rui Tang, Chenqian Gan, Zhongning Liu
  • Substrate comprising at least one patterned ground plane for shielding
    Patent number: 11270951
    Abstract: A substrate that includes at least one dielectric layer, a first inductor formed in the at least one dielectric layer, a second inductor formed in the at least one dielectric layer, and a patterned ground layer formed on a metal layer of the substrate. The patterned ground layer is configured to provide electromagnetic (EM) shielding. The patterned ground layer includes a plurality of slots. The plurality of slots may be filled with the at least one dielectric layer. The plurality of slots may include a slot with a rectangular shape, a slot with a polygon shape, a slot with a circular shape, or combinations thereof. The patterned ground layer may include at least one slot that, individually or collectively, has a shape of a spiral.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: March 8, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Rui Tang, Zhongning Liu, Chenqian Gan
  • SUBSTRATE COMPRISING AN INDUCTIVE COUPLER FOR SIGNAL LEAKAGE REDUCTION
    Publication number: 20200373080
    Abstract: A substrate that includes at least one dielectric layer and an inductive coupler formed in the at least one dielectric layer. The inductive coupler includes a first inductor and a second inductor. The first inductor is formed in the at least one dielectric layer. The first inductor is configured to be coupled to a transmitter filter and an antenna. The second inductor is formed in the at least one dielectric layer. The second inductor is configured to be coupled to the transmitter filter and ground. The second inductor is configured to provide a path to ground for a rejected signal having a rejected frequency. The second inductor is configured such that the rejected signal traveling through the second inductor causes the first inductor to generate an induced signal that counteracts a leakage signal traveling through the transmission filter.
    Type: Application
    Filed: May 24, 2019
    Publication date: November 26, 2020
    Inventors: Rui TANG, Chenqian GAN, Zhongning LIU
  • SUBSTRATE COMPRISING AT LEAST ONE PATTERNED GROUND PLANE FOR SHIELDING
    Publication number: 20200194378
    Abstract: A substrate that includes at least one dielectric layer, a first inductor formed in the at least one dielectric layer, a second inductor formed in the at least one dielectric layer, and a patterned ground layer formed on a metal layer of the substrate. The patterned ground layer is configured to provide electromagnetic (EM) shielding. The patterned ground layer includes a plurality of slots. The plurality of slots may be filled with the at least one dielectric layer. The plurality of slots may include a slot with a rectangular shape, a slot with a polygon shape, a slot with a circular shape, or combinations thereof. The patterned ground layer may include at least one slot that, individually or collectively, has a shape of a spiral.
    Type: Application
    Filed: December 13, 2018
    Publication date: June 18, 2020
    Inventors: Rui TANG, Zhongning LIU, Chenqian GAN