Patents by Inventor Zhongqiang Yang
Zhongqiang Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240070704Abstract: Provided are a current transaction method, system and apparatus based on a blockchain. The solution is: receiving types of service requests related to medication usage data of different users, and acquiring first money corresponding to the types of service requests of the different users, wherein the first money is obtained by performing medication rationality analysis on the medication usage data of the users; determining second money in a blockchain reward pool corresponding to the first money, according to the first money corresponding to the types of service requests of the different users; and completing a transfer of the second money and completing a transaction by means of a smart contract mechanism, wherein the transfer is used for representing that the second money is issued to the users in a reward manner, and an aim of the transaction is in exchange for an article or a service.Type: ApplicationFiled: April 23, 2021Publication date: February 29, 2024Applicant: Beijing Jingdong Tuoxian Technology Co., Ltd.Inventors: Lei HAN, Jun YANG, Zhongqiang HE, Luhui GUAN, Shanbao XU
-
Patent number: 11744013Abstract: The present invention relates to a composite, a high-frequency circuit substrate prepared therefrom and a process for preparing the same. Such composite includes (1) from 20 to 70 parts by weight of a thermosetting mixture, including (A) a thermosetting resin based on polybutadiene or a copolymer resin of polybutadiene and styrene having a molecular weight of 11,000 or less, being composed of carbon and hydrogen elements and containing 60% or more of vinyl groups, and (B) an ethylene-propylene rubber having a weight-average molecular weight of greater than 100,000 and less than 150,000 and a number-average molecular weight of greater than 60,000 and less than 100,000 and being in a solid state at room temperature; (2) from 10 to 60 parts by weight of a glass fiber cloth; (3) from 0 to 70 parts by weight of a powder filler; and (4) from 1 to 3 parts by weight of a curing initiator. The composite of the present invention has good solvent solubility and good process operability.Type: GrantFiled: December 14, 2017Date of Patent: August 29, 2023Inventors: Minshe Su, Duye Li, Shanyin Yan, Qianfa Liu, Zhongqiang Yang
-
Patent number: 11377551Abstract: Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.Type: GrantFiled: November 2, 2017Date of Patent: July 5, 2022Assignee: SHENGYI TECHNOLOGY CO., LTD.Inventors: Minshe Su, Zhongqiang Yang
-
Publication number: 20220153989Abstract: The present disclosure discloses a resin composition, and a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. The prepreg, laminate and printed circuit board prepared from such resin composition have a low dielectric loss factor, good flame retardancy, and also have high interlaminar adhesion and a low CTE.Type: ApplicationFiled: April 8, 2019Publication date: May 19, 2022Inventors: Liexiang HE, Yongnian QI, Xianping ZENG, Zhongqiang YANG, Hualin PAN
-
Publication number: 20220135788Abstract: The present disclosure provides a resin composition, as well as a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 48-54 parts by weight of a halogen-free epoxy resin, 16-31 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group; and 15-32 parts by weight of a cyanate ester resin. The prepreg, laminate and printed circuit board prepared from the resin composition have a low coefficient of thermal expansion.Type: ApplicationFiled: April 8, 2019Publication date: May 5, 2022Inventors: Liexiang HE, Yaode ZENG, Zhongqiang YANG, Yu YANG, Hualin PAN, Yongjing XU
-
Patent number: 11319397Abstract: Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and another thermosetting resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the other thermosetting resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.Type: GrantFiled: November 2, 2017Date of Patent: May 3, 2022Assignee: SHENGYI TECHNOLOGY CO., LTD.Inventors: Minshe Su, Zhongqiang Yang
-
Patent number: 11191158Abstract: The present invention provides a process for preparing a pre-treated low Dk-type glass fabric for constituting a circuit board, comprising pre-treating low Dk-type glass fabric with a pre-treating varnish having a Dk close to the Dk of the used low Dk-type glass fabric at different temperatures and having a small Df. The present invention further provides a bonding sheet and a circuit board prepared thereby. The circuit boards prepared by the preparation process of the present invention have a Dk having small differences in warp and weft directions, and can effectively solve the problem of signal propagation delay. The circuit boards have a small Df, so as to have a small signal loss. Meanwhile, the cured, partially-cured or uncured dry glue obtained after drying the solvent of the pre-treating varnish has similar dielectric properties at different temperatures to the used low Dk-type glass fabric, so that the circuit boards have a very small signal propagation delay at different temperatures.Type: GrantFiled: December 7, 2015Date of Patent: November 30, 2021Inventors: Shanyin Yan, Yongjing Xu, Zhongqiang Yang, Yongming Zhu
-
Publication number: 20200224026Abstract: Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.Type: ApplicationFiled: November 2, 2017Publication date: July 16, 2020Inventors: Minshe SU, Zhongqiang YANG
-
Publication number: 20200207899Abstract: Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and another thermosetting resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the other thermosetting resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.Type: ApplicationFiled: November 2, 2017Publication date: July 2, 2020Inventors: Minshe SU, Zhongqiang YANG
-
Patent number: 10494502Abstract: The present invention provides a halogen-free thermosetting resin composition, a prepreg, a laminate and a printed circuit board comprising the same. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free thermosetting resin, (B) from 10 to 35 parts by weight of a phenolic curing agent, and (C) a phosphorus-containing flame retardant. The prepregs, laminates and printed circuit boards prepared from the halogen-free thermosetting resin composition of the present invention have excellent dimensional stability and dielectric properties, high adhesive force, high heat resistance, low water absorption and better processability, and can achieve halogen-free flame retardancy and reach UL94 V-0.Type: GrantFiled: September 14, 2016Date of Patent: December 3, 2019Assignee: SHENGYI TECHNOLOGY CO., LTD.Inventors: Jiang You, Tianhui Huang, Yongjing Xu, Zhongqiang Yang
-
Patent number: 10400058Abstract: Disclosed are a resin composition, and prepreg, laminate and copper clad laminate using the same, and degrading method thereof, the resin composition comprising: an epoxy resin, a degradable amine curing agent, a degradable mercaptan curing agent and an inorganic filler. A copper clad laminate manufactured by the resin composition comprises several pieces of stacked prepreg, and copper foil arranged at one side or two sides of stacked prepreg, each of the prepreg comprising a reinforced material and the resin composition adhered thereon after soaking and drying. The present invention mixes the degradable amine curing agent and the degradable mercaptan curing agent to obtain a curing system having an adjustable reaction rate, thus facilitating process control when manufacturing the copper clad laminate, and the manufactured copper clad laminate has high overall performance and is completely degradable, thus recycling and reusing each of the effective components.Type: GrantFiled: May 27, 2015Date of Patent: September 3, 2019Assignee: SHENGYI TECHNOLOGY CO., LTD.Inventors: Huayang Deng, Zengbiao Huang, Qianfa Liu, Zhongqiang Yang, Peng Wang
-
Patent number: 10400173Abstract: The present invention provides a siloxane-modified cyclotriphosphazene halogen-free flame retardant, and a preparation method and a use thereof. The siloxane-modified cyclotriphosphazene halogen-free flame retardant has the structural formula as shown in Formula I. In the siloxane-modified cyclotriphosphazene halogen-free flame retardant of the present invention, three kinds of structures of siloxane, aryl phosphorus oxygen compound and cyclotriphosphazene are built in one molecular formula, which combines the advantages of three structures, improves the compatibility between the flame retardant and resins, has a high flame retardant efficiency and a better char formation and can greatly increase the flame retardancy and stability of resin cured products.Type: GrantFiled: March 31, 2017Date of Patent: September 3, 2019Assignee: SHENGYI TECHNOLOGY CO., LTD.Inventors: Yongzhen Wang, Yueshan He, Zhongqiang Yang, Yongjing Xu
-
Publication number: 20180263115Abstract: The present invention relates to a composite, a high-frequency circuit substrate prepared therefrom and a process for preparing the same. Such composite comprises (1) from 20 to 70 parts by weight of a thermosetting mixture, comprising (A) a thermosetting resin based on polybutadiene or a copolymer resin of polybutadiene and styrene having a molecular weight of 11,000 or less, being composed of carbon and hydrogen elements and containing 60% or more of vinyl groups, and (B) an ethylene-propylene rubber having a weight-average molecular weight of greater than 100,000 and less than 150,000 and a number-average molecular weight of greater than 60,000 and less than 100,000 and being in a solid state at room temperature; (2) from 10 to 60 parts by weight of a glass fiber cloth; (3) from 0 to 70 parts by weight of a powder filler; and (4) from 1 to 3 parts by weight of a curing initiator. The composite of the present invention has good solvent solubility and good process operability.Type: ApplicationFiled: December 14, 2017Publication date: September 13, 2018Inventors: Minshe SU, Duye LI, Shanyin YAN, Qianfa LIU, Zhongqiang YANG
-
Publication number: 20180126701Abstract: The present invention relates to a halogen-free thermosetting resin composition, a prepreg and a laminate for printed circuit boards using the same. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 16 to 42 parts by weight of a halogen-free epoxy resin, (B) from 1.5 to 4.8 parts by weight of a compound containing dihydrobenzoxazine ring; (C) from 10 to 28 parts by weight of a phosphorus-containing bisphenol curing agent, wherein the phosphorus-containing bisphenol curing agent has a weight average molecular weight of 1000-6500, and (D) from 30 to 70 parts by weight of silicon dioxide. The prepreg and laminate for printed circuit boards prepared from the halogen-free thermosetting resin composition have high glass transition temperature, excellent dielectric performances, low water absorption, high heat resistance and better processability, and can achieve halogen-free flame retardancy and UL94 V-0.Type: ApplicationFiled: September 8, 2016Publication date: May 10, 2018Applicant: Shengyi Technology Co., Ltd.Inventors: Jiang YOU, Tianhui HUANG, Yongjing XU, Zhongqiang YANG
-
Publication number: 20180112133Abstract: The present invention provides a siloxane-modified cyclotriphosphazene halogen-free flame retardant, and a preparation method and a use thereof. The siloxane-modified cyclotriphosphazene halogen-free flame retardant has the structural formula as shown in Formula I. In the siloxane-modified cyclotriphosphazene halogen-free flame retardant of the present invention, three kinds of structures of siloxane, aryl phosphorus oxygen compound and cyclotriphosphazene are built in one molecular formula, which combines the advantages of three structures, improves the compatibility between the flame retardant and resins, has a high flame retardant efficiency and a better char formation and can greatly increase the flame retardancy and stability of resin cured products.Type: ApplicationFiled: March 31, 2017Publication date: April 26, 2018Inventors: Yongzhen WANG, Yueshan HE, Zhongqiang YANG, Yongjing XU
-
Publication number: 20180086895Abstract: The present invention provides a halogen-free thermosetting resin composition, a prepreg, a laminate and a printed circuit board comprising the same. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free thermosetting resin, (B) from 10 to 35 parts by weight of a phenolic curing agent, and (C) a phosphorus-containing flame retardant. The prepregs, laminates and printed circuit boards prepared from the halogen-free thermosetting resin composition of the present invention have excellent dimensional stability and dielectric properties, high adhesive force, high heat resistance, low water absorption and better processability, and can achieve halogen-free flame retardancy and reach UL94 V-0.Type: ApplicationFiled: September 14, 2016Publication date: March 29, 2018Inventors: Jiang YOU, Tianhui HUANG, Yongjing XU, Zhongqiang YANG
-
Publication number: 20170321001Abstract: Disclosed are a resin composition, and prepreg, laminate and copper clad laminate using the same, and degrading method thereof, the resin composition comprising: an epoxy resin, a degradable amine curing agent, a degradable mercaptan curing agent and an inorganic filler. A copper clad laminate manufactured by the resin composition comprises several pieces of stacked prepreg, and copper foil arranged at one side or two sides of stacked prepreg, each of the prepreg comprising a reinforced material and the resin composition adhered thereon after soaking and drying. The present invention mixes the degradable amine curing agent and the degradable mercaptan curing agent to obtain a curing system having an adjustable reaction rate, thus facilitating process control when manufacturing the copper clad laminate, and the manufactured copper clad laminate has high overall performance and is completely degradable, thus recycling and reusing each of the effective components.Type: ApplicationFiled: May 27, 2015Publication date: November 9, 2017Inventors: Huayang DENG, Zengbiao HUANG, Qianfa LIU, Zhongqiang YANG, Peng WANG
-
Patent number: 9752028Abstract: The present invention relates to a halogen-free thermosetting resin composition, and also a prepreg and a laminate for printed circuit prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 5 to 30 parts by weight of a first curing agent of phosphorus-containing bisphenol, (C) from 5 to 30 parts by weight of a second curing agent of alkylphenol novolac, and (D) a phosphorus-containing flame retardant. The prepreg and laminate for printed circuit prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better process workability, and can fulfill halogen-free flame retardance and achieve the grade of UL94 V-0.Type: GrantFiled: April 6, 2015Date of Patent: September 5, 2017Assignee: SHENGYI TECHNOLOGY CO., LTD.Inventors: Jiang You, Tianhui Huang, Zhongqiang Yang
-
Publication number: 20170238417Abstract: The present invention provides a process for preparing a pre-treated low Dk-type glass fabric for constituting a circuit board, comprising pre-treating low Dk-type glass fabric with a pre-treating varnish having a Dk close to the Dk of the used low Dk-type glass fabric at different temperatures and having a small Df. The present invention further provides a bonding sheet and a circuit board prepared thereby. The circuit boards prepared by the preparation process of the present invention have a Dk having small differences in warp and weft directions, and can effectively solve the problem of signal propagation delay. The circuit boards have a small Df, so as to have a small signal loss. Meanwhile, the cured, partially-cured or uncured dry glue obtained after drying the solvent of the pre-treating varnish has similar dielectric properties at different temperatures to the used low Dk-type glass fabric, so that the circuit boards have a very small signal propagation delay at different temperatures.Type: ApplicationFiled: December 7, 2015Publication date: August 17, 2017Inventors: Shanyin YAN, Yongjing XU, Zhongqiang YANG, Yongming ZHU
-
Patent number: 9611377Abstract: The present invention relates to a halogen-free thermosetting resin composition and also a prepreg and a laminate for printed circuits prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 20 to 50 parts by weight of a compound containing dihydrobenzoxazine ring, (C) from 10 to 40 parts by weight of a phosphorus-containing bisphenol curing agent. The prepreg and laminate for printed circuits prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better processability, and can fulfill halogen-free flame retardancy and achieve UL94 V-0 grade.Type: GrantFiled: April 7, 2015Date of Patent: April 4, 2017Assignee: SHENGYI TECHNOLOGY CO., LTD.Inventors: Jiang You, Tianhui Huang, Zhongqiang Yang